Lye; Meng Kong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lye; Meng Kong.The latest application filed is for "qfn semiconductor package, semiconductor package and lead frame".

Company Profile

8.37.24

Lye; Meng Kong - Shah Alam MY
Lye; Meng Kong - Petaling Jaya MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making flexible semiconductor device with graphene tape Grant 11,456,188 - Ge , et al. September 27, 2	2022-09-27
Qfn Semiconductor Package, Semiconductor Package And Lead Frame App 20220077052 - Ge; You ; et al.	2022-03-10
Semiconductor device with lead frame that accommodates various die sizes Grant 11,171,077 - Ge , et al. November 9, 2	2021-11-09
Semiconductor Device With Lead Frame That Accommodates Various Die Sizes App 20210013137 - GE; You ; et al.	2021-01-14
Power Die Package App 20200411423 - Ge; You ; et al.	2020-12-31
Flexible Semiconductor Device With Graphene Tape App 20200312751 - Ge; You ; et al.	2020-10-01
Sensor device with flip-chip die and interposer Grant 10,787,361 - Doraisamy , et al. September 29, 2	2020-09-29
Hybrid lead frame for semiconductor die package with improved creepage distance Grant 10,734,311 - Ching, Jr. , et al.	2020-08-04
Hybrid Lead Frame For Semiconductor Die Package With Improved Creepage Distance App 20200203262 - CHING, JR.; Mariano Layson ; et al.	2020-06-25
Flexible semiconductor device with graphene tape Grant 10,692,802 - Ge , et al.	2020-06-23
Sensor Device With Flip-chip Die And Interposer App 20200131026 - Doraisamy; Stanley Job ; et al.	2020-04-30
Lead frame with bendable leads Grant 10,515,880 - Yao , et al. Dec	2019-12-24
Lead Frame With Bendable Leads App 20190287883 - Yao; Jinzhong ; et al.	2019-09-19
Lead frame for integrated circuit device having J-leads and Gull Wing leads Grant 10,217,700 - Bai , et al. Feb	2019-02-26
Semiconductor device and lead frame with high density lead array Grant 10,217,697 - Wang , et al. Feb	2019-02-26
Lead frame for integrated circuit device having J-leads and gull wing leads Grant 10,181,434 - Pang , et al. Ja	2019-01-15
Woven signal-routing substrate for wearable electronic devices Grant 10,041,195 - Ge , et al. August 7, 2	2018-08-07
Semiconductor Device And Lead Frame With High Density Lead Array App 20180102305 - WANG; ZHIJIE ; et al.	2018-04-12
Flexible Semiconductor Device With Graphene Tape App 20170358525 - GE; YOU ; et al.	2017-12-14
Integrated circuit die with corner IO pads Grant 9,633,959 - Kumar , et al. April 25, 2	2017-04-25
IC package having non-horizontal die pad and flexible substrate therefor Grant 9,548,255 - Ge , et al. January 17, 2	2017-01-17
Woven Signal-routing Substrate For Wearable Electronic Devices App 20170009387 - Ge; You ; et al.	2017-01-12
Semiconductor device with heat spreader Grant 9,484,289 - Ge , et al. November 1, 2	2016-11-01
Lead Frame With Deflecting Tie Bar For Ic Package App 20160293526 - Wang; Zhijie ; et al.	2016-10-06
Lead frame with deflecting tie bar for IC package Grant 9,449,901 - Wang , et al. September 20, 2	2016-09-20
Integrated Circuit Die With Corner Io Pads App 20160233183 - Kumar; Shailesh ; et al.	2016-08-11
IC package having non-horizontal die pad and lead frame therefor Grant 9,379,035 - Ge , et al. June 28, 2	2016-06-28
Semiconductor device with heat-dissipating lead frame Grant 9,355,945 - Ge , et al. May 31, 2	2016-05-31
Signal bond wire shield Grant 9,337,140 - Kumar , et al. May 10, 2	2016-05-10
Common pin for multi-die semiconductor package Grant 9,196,578 - Lim , et al. November 24, 2	2015-11-24
Semiconductor package with stress relief and heat spreader Grant 9,196,576 - Yow , et al. November 24, 2	2015-11-24
Semiconductor device with tube based heat spreader Grant 9,190,343 - Ge , et al. November 17, 2	2015-11-17
Power bar design for lead frame-based packages Grant 9,177,834 - Foong , et al. November 3, 2	2015-11-03
Semiconductor device with twisted leads Grant 9,165,869 - Chee , et al. October 20, 2	2015-10-20
Semiconductor device with improved shielding Grant 9,147,656 - Varshney , et al. September 29, 2	2015-09-29
Power Bar Design For Lead Frame-based Packages App 20150235924 - Foong; Chee Seng ; et al.	2015-08-20
Semiconductor Device With Heat Spreader App 20150108625 - Ge; You ; et al.	2015-04-23
Semiconductor Package With Stress Relief And Heat Spreader App 20150084169 - Yow; Kai Yun ; et al.	2015-03-26
Lead frame based semiconductor device with routing substrate Grant 8,980,690 - Mei , et al. March 17, 2	2015-03-17
Semiconductor device with integral heat sink Grant 8,901,722 - Ge , et al. December 2, 2	2014-12-02
Semiconductor Device With Integral Heat Sink App 20140239476 - Ge; You ; et al.	2014-08-28
Method for reducing surface area of pad limited semiconductor die layout Grant 8,291,368 - Verma , et al. October 16, 2	2012-10-16
Bond pad for semiconductor die Grant 8,242,613 - Verma , et al. August 14, 2	2012-08-14
Bond Pad For Semiconductor Die App 20120049389 - Verma; Chetan ; et al.	2012-03-01
Method For Reducing Surface Area Of Pad Limited Semiconductor Die Layout App 20110246958 - VERMA; Chetan ; et al.	2011-10-06
Lead Frame And Semiconductor Package Manufactured Therewith App 20110204498 - Au; Yin Kheng ; et al.	2011-08-25

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