Lv; Wenfeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lv; Wenfeng.The latest application filed is for "resin composition, copper clad laminate and printed circuit board using same".

Company Profile

0.5.5

Lv; Wenfeng - Kunshan CN
LV; Wenfeng - Kunshan City CN
Lv; Wenfeng - Jiangsu Province CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, copper clad laminate and printed circuit board using same Grant 10,072,148 - Wang , et al. September 11, 2	2018-09-11
Resin Composition, Copper Clad Laminate And Printed Circuit Board Using Same App 20180072884 - WANG; Rongtao ; et al.	2018-03-15
Resin composition, copper clad laminate and printed circuit board using same Grant 9,850,375 - Wang , et al. December 26, 2	2017-12-26
Aromatic tetrafunctional vinylbenzyl resin composition and use thereof Grant 9,574,070 - Wang , et al. February 21, 2	2017-02-21
Low dissipation factor resin composition and product made thereby Grant 9,469,757 - Wang , et al. October 18, 2	2016-10-18
Resin Composition, Copper Clad Laminate And Printed Circuit Board Using Same App 20160222204 - WANG; Rongtao ; et al.	2016-08-04
Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same Grant 9,402,310 - Wang , et al. July 26, 2	2016-07-26
Aromatic Tetrafunctional Vinylbenzyl Resin Composition And Use Thereof App 20160160008 - WANG; Rongtao ; et al.	2016-06-09
Low Dissipation Factor Resin Composition And Product Made Thereby App 20160122521 - WANG; Rongtao ; et al.	2016-05-05
Low-dielectric Resin Composition And Copper-clad Laminate And Printed Circuit Board Using The Same App 20150044485 - WANG; Rongtao ; et al.	2015-02-12

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