Luther, Barbara
Patent Applications and Registrations
Patent applications and USPTO patent grants for Luther, Barbara.The latest application filed is for "plasma treatment to enhance inorganic dielectric adhesion to copper".
- Luther, Barbara - Cold Spring NY
- Luther; Barbara - Devon PA
| Patent | Date |
|---|---|
| Plasma treatment to enhance inorganic dielectric adhesion to copper App 20010053591 - Buchwalter, Leena P. ; et al. | 2001-12-20 |
| Plasma treatment to enhance inorganic dielectric adhesion to copper Grant 6,261,951 - Buchwalter , et al. July 17, 2 | 2001-07-17 |
| Plasma treatment to enhance inorganic dielectric adhesion to copper Grant 6,255,217 - Agnello , et al. July 3, 2 | 2001-07-03 |
| Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias Grant 4,789,648 - Chow , et al. December 6, 1 | 1988-12-06 |
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