Lustig; Naftali Eliahu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lustig; Naftali Eliahu.The latest application filed is for "crack bifurcation in back-end-of-line".
- Lustig; Naftali Eliahu - Croton on Hudson NY
| Patent | Date |
|---|---|
| Crack bifurcation in back-end-of-line Grant 11,133,268 - Sinha , et al. September 28, 2 | 2021-09-28 |
| Crack Bifurcation In Back-end-of-line App 20200373250 - SINHA; TUHIN ; et al. | 2020-11-26 |
| Electronic fuse vias in interconnect structures Grant 9,099,468 - Bao , et al. August 4, 2 | 2015-08-04 |
| Electronic Fuse Vias In Interconnect Structures App 20150041951 - Bao; Junjing ; et al. | 2015-02-12 |
| Electronic fuse vias in interconnect structures Grant 8,916,461 - Bao , et al. December 23, 2 | 2014-12-23 |
| Fuse and integrated conductor Grant 8,836,124 - Bonilla , et al. September 16, 2 | 2014-09-16 |
| Electronic anti-fuse Grant 8,736,020 - Bao , et al. May 27, 2 | 2014-05-27 |
| Electronic Fuse Vias in Interconnect Structures App 20140077334 - Bao; Jinjing ; et al. | 2014-03-20 |
| Electronic Anti-fuse App 20140070363 - Bao; Junjing ; et al. | 2014-03-13 |
| Fuse and Integrated Conductor App 20130234284 - Bonilla; Griselda ; et al. | 2013-09-12 |
| Semiconductor structure Grant 8,030,707 - Cheng , et al. October 4, 2 | 2011-10-04 |
| Method For Forming A Semiconductor Structure To Remedy Box Undercut And Structure Formed Thereby App 20100213522 - Cheng; Kangguo ; et al. | 2010-08-26 |
| Method Of Forming A Dual-damascene Structure Using An Underlayer App 20090093114 - Burns; Sean David ; et al. | 2009-04-09 |
| Interconnect structure and process of making the same Grant 7,488,679 - Standaert , et al. February 10, 2 | 2009-02-10 |
| Interconnect Structure And Process Of Making The Same App 20080026568 - Standaert; Theodorus Eduardus ; et al. | 2008-01-31 |
| Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect Grant 6,573,606 - Sambucetti , et al. June 3, 2 | 2003-06-03 |
| Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect App 20030001275 - Sambucetti, Carlos Juan ; et al. | 2003-01-02 |
| Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing Grant 6,020,264 - Lustig , et al. February 1, 2 | 2000-02-01 |
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