| Patent | Date |
|---|
Semiconductor Device with Tunable Antenna Using Wire Bonds
App 20220140468 - Luo; Shijian ; et al. | 2022-05-05 |
Die features for self-alignment during die bonding
Grant 11,302,653 - Street , et al. April 12, 2 | 2022-04-12 |
Semiconductor device with tunable antenna using wire bonds
Grant 11,251,516 - Luo , et al. February 15, 2 | 2022-02-15 |
Use Of Pre-channeled Materials For Anisotropic Conductors
App 20220028820 - Tuttle; Mark E. ; et al. | 2022-01-27 |
Use of pre-channeled materials for anisotropic conductors
Grant 11,139,262 - Tuttle , et al. October 5, 2 | 2021-10-05 |
Semiconductor Device With A Multi-layered Encapsulant And Associated Systems, Devices, And Methods
App 20210257226 - Luo; Shijian ; et al. | 2021-08-19 |
Transparent Display Device And Manufacturing Method Thereof
App 20210231841 - WANG; Qiaoni ; et al. | 2021-07-29 |
Color Film Substrate, Fabrication Method Thereof, And Display Device
App 20210199862 - Luo; Shijian ; et al. | 2021-07-01 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
Grant 11,004,697 - Luo , et al. May 11, 2 | 2021-05-11 |
Display system
Grant 10,990,062 - Wang , et al. April 27, 2 | 2021-04-27 |
Microelectronic Device Assemblies And Packages And Related Methods And Systems
App 20210118852 - Fay; Owen R. ; et al. | 2021-04-22 |
Device packaging facility and method, and device processing apparatus utilizing DEHT
Grant 10,937,757 - Zhang , et al. March 2, 2 | 2021-03-02 |
Die Features for Self-Alignment During Die Bonding
App 20200373252 - Street; Bret K. ; et al. | 2020-11-26 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20200350224 - Groothuis; Steven K. ; et al. | 2020-11-05 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
Grant 10,763,131 - Luo , et al. Sep | 2020-09-01 |
Die features for self-alignment during die bonding
Grant 10,748,857 - Street , et al. A | 2020-08-18 |
Use of Pre-Channeled Materials for Anisotropic Conductors
App 20200258859 - A1 | 2020-08-13 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,741,468 - Groothuis , et al. A | 2020-08-11 |
Semiconductor device packages with direct electrical connections and related methods
Grant 10,679,921 - Groothuis , et al. | 2020-06-09 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
Grant 10,622,223 - Luo , et al. | 2020-04-14 |
Die Features for Self-Alignment During Die Bonding
App 20200083178 - Street; Bret K. ; et al. | 2020-03-12 |
Carrier Bond and Debond Using Self-Depolymerizing Polymer
App 20200075384 - Luo; Shijian ; et al. | 2020-03-05 |
Semiconductor Device with Tunable Antenna Using Wire Bonds
App 20200076051 - Luo; Shijian ; et al. | 2020-03-05 |
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
Grant 10,461,059 - Koopmans , et al. Oc | 2019-10-29 |
Semiconductor Device With A Multi-layered Encapsulant And Associated Systems, Devices, And Methods
App 20190311918 - Luo; Shijian ; et al. | 2019-10-10 |
Device And Method For Muffling, Communication Device And Wearable Device
App 20190253545 - Yu; Yang ; et al. | 2019-08-15 |
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Deht
App 20190229086 - ZHANG; Jian ; et al. | 2019-07-25 |
Coa Substrate, Manufacturing Method Therefor, Display Panel, And Display Device
App 20190219853 - LIAO; Jiamin ; et al. | 2019-07-18 |
Semiconductor Device With A Multi-layered Encapsulant And Associated Systems, Devices, And Methods
App 20190157111 - Luo; Shijian ; et al. | 2019-05-23 |
Semiconductor Device With A Multi-layered Encapsulant And Associated Systems, Devices, And Methods
App 20190157112 - Luo; Shijian ; et al. | 2019-05-23 |
Device packaging facility and method, and device processing apparatus utilizing DEHT
Grant 10,283,481 - Zhang , et al. | 2019-05-07 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20190122950 - Groothuis; Steven K. ; et al. | 2019-04-25 |
Display System
App 20190086863 - WANG; Qiaoni ; et al. | 2019-03-21 |
Semiconductor Device Packages With Direct Electrical Connections And Related Methods
App 20190051578 - Groothuis; Steven ; et al. | 2019-02-14 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,170,389 - Groothuis , et al. J | 2019-01-01 |
Semiconductor device packages with direct electrical connections and related methods
Grant 10,134,655 - Groothuis , et al. November 20, 2 | 2018-11-20 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies
Grant 10,103,134 - Zhou , et al. October 16, 2 | 2018-10-16 |
Semiconductor Device Packages With Direct Electrical Connections And Related Methods
App 20180158751 - Groothuis; Steven ; et al. | 2018-06-07 |
Semiconductor device packages with improved thermal management and related methods
Grant 9,899,293 - Groothuis , et al. February 20, 2 | 2018-02-20 |
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Deht
App 20180033766 - ZHANG; Jian ; et al. | 2018-02-01 |
Methods Of Manufacturing Multi-die Semiconductor Device Packages And Related Assemblies
App 20180033781 - Zhou; Wei ; et al. | 2018-02-01 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies
Grant 9,865,578 - Zhou , et al. January 9, 2 | 2018-01-09 |
Device packaging facility and method, and device processing apparatus utilizing DEHT
Grant 9,824,998 - Zhang , et al. November 21, 2 | 2017-11-21 |
Device packaging facility and method, and device processing apparatus utilizing phthalate
Grant 9,741,683 - Zhang , et al. August 22, 2 | 2017-08-22 |
Semiconductor Device Packages With Improved Thermal Management And Related Methods
App 20170117205 - Groothuis; Steven ; et al. | 2017-04-27 |
Semiconductor device packages with improved thermal management and related methods
Grant 9,543,274 - Groothuis , et al. January 10, 2 | 2017-01-10 |
Methods Of Manufacturing Multi Die Semiconductor Device Packages And Related Assemblies
App 20160358898 - Zhou; Wei ; et al. | 2016-12-08 |
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Phthalate
App 20160336294 - ZHANG; Jian ; et al. | 2016-11-17 |
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Deht
App 20160336293 - ZHANG; Jian ; et al. | 2016-11-17 |
Device packaging facility and method, and device processing apparatus utilizing phthalate
Grant 9,472,531 - Zhang , et al. October 18, 2 | 2016-10-18 |
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Phthalate
App 20160233191 - ZHANG; Jian ; et al. | 2016-08-11 |
Semiconductor Device Packages With Improved Thermal Management And Related Methods
App 20160218085 - Groothuis; Steven ; et al. | 2016-07-28 |
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods
App 20160141270 - Koopmans; Michel ; et al. | 2016-05-19 |
Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same
Grant 9,269,646 - Luo , et al. February 23, 2 | 2016-02-23 |
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
Grant 9,269,700 - Koopmans , et al. February 23, 2 | 2016-02-23 |
Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
Grant 9,184,105 - Groothuis , et al. November 10, 2 | 2015-11-10 |
Adhesives including a filler material and related methods
Grant 9,157,014 - Luo , et al. October 13, 2 | 2015-10-13 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 9,153,520 - Groothuis , et al. October 6, 2 | 2015-10-06 |
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods
App 20150279828 - Koopmans; Michel ; et al. | 2015-10-01 |
Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process
Grant 9,128,382 - Berry , et al. September 8, 2 | 2015-09-08 |
Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods
Grant 9,070,656 - Hooper , et al. June 30, 2 | 2015-06-30 |
Underfill-accommodating Heat Spreaders And Related Semiconductor Device Assemblies And Methods
App 20140367844 - Hooper; Andy E. ; et al. | 2014-12-18 |
Semiconductor Device Packages Including Thermally Insulating Materials And Methods Of Making And Using Such Semiconductor Packages
App 20140327130 - Groothuis; Steven ; et al. | 2014-11-06 |
Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
Grant 8,816,494 - Groothuis , et al. August 26, 2 | 2014-08-26 |
Temporary Adhesives Including A Filler Material And Related Methods
App 20140147989 - Luo; Shijian ; et al. | 2014-05-29 |
Plasma Mediated Ashing Processes That Include Formation Of A Protective Layer Before And/or During The Plasma Mediated Ashing Process
App 20140103010 - Berry; Ivan ; et al. | 2014-04-17 |
Plasma Mediated Ashing Processes
App 20140076353 - Berry; Ivan L. ; et al. | 2014-03-20 |
Semiconductor Device Packages Including Thermally Insulating Materials And Methods Of Making And Using Such Semiconductor Packages
App 20140015598 - Groothuis; Steven ; et al. | 2014-01-16 |
Dry Flux Bonding Device And Method
App 20130299868 - Fay; Owen ; et al. | 2013-11-14 |
Substantially Non-oxidizing Plasma Treatment Devices And Processes
App 20130248113 - Geissbuhler; Phillip ; et al. | 2013-09-26 |
Dry flux bonding device and method
Grant 8,492,242 - Fay , et al. July 23, 2 | 2013-07-23 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20130119528 - Groothuis; Steven K. ; et al. | 2013-05-16 |
Semiconductor Die Assemblies With Enhanced Thermal Management, Semiconductor Devices Including Same And Related Methods
App 20130119527 - Luo; Shijian ; et al. | 2013-05-16 |
Plasma Mediated Ashing Processes
App 20120024314 - LUO; SHIJIAN ; et al. | 2012-02-02 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
Grant 8,072,055 - Corisis , et al. December 6, 2 | 2011-12-06 |
Dry Flux Bonding Device And Method
App 20110291146 - Fay; Owen ; et al. | 2011-12-01 |
Plasma Mediated Ashing Processes
App 20110226280 - Berry; Ivan L. ; et al. | 2011-09-22 |
Substantially Non-Oxidizing Plasma Treatment Devices and Processes
App 20110136346 - Geissbuhler; Phillip ; et al. | 2011-06-09 |
Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
Grant 7,851,266 - Jiang , et al. December 14, 2 | 2010-12-14 |
Front End Of Line Plasma Mediated Ashing Processes And Apparatus
App 20100130017 - Luo; Shijian ; et al. | 2010-05-27 |
Microelectronic Device Wafers Including An In-situ Molded Adhesive, Molds For In-situ Molding Adhesives On Microelectronic Device Wafers, And Methods Of Molding Adhesives On Microelectronic Device Wafers
App 20100127409 - Jiang; Tongbi ; et al. | 2010-05-27 |
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
Grant 7,696,011 - Jiang , et al. April 13, 2 | 2010-04-13 |
Electrical condition monitoring method for polymers
Grant 7,663,381 - Watkins, Jr. , et al. February 16, 2 | 2010-02-16 |
High Density Stacked Die Assemblies, Structures Incorporated Therein And Methods Of Fabricating The Assemblies
App 20100013074 - Corisis; David J. ; et al. | 2010-01-21 |
Plasma Mediated Ashing Processes That Include Formation Of A Protective Layer Before And/or During The Plasma Mediated Ashing Process
App 20090277871 - Berry; Ivan ; et al. | 2009-11-12 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
Grant 7,592,691 - Corisis , et al. September 22, 2 | 2009-09-22 |
Microelectronic Imaging Units Having An Infrared-absorbing Layer And Associated Systems And Methods
App 20090146234 - Luo; Shijian ; et al. | 2009-06-11 |
Electrical condition monitoring method for polymers
App 20080307909 - Watkins, JR.; Kenneth S. ; et al. | 2008-12-18 |
Electronic devices at the wafer level having front side and edge protection material and systems including the devices
Grant 7,417,305 - Jiang , et al. August 26, 2 | 2008-08-26 |
Electrical condition monitoring method for polymers
Grant 7,414,416 - Watkins, Jr. , et al. August 19, 2 | 2008-08-19 |
Microfeature devices and methods for manufacturing microfeature devices
Grant 7,411,297 - Luo , et al. August 12, 2 | 2008-08-12 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
App 20080054432 - Corisis; David J. ; et al. | 2008-03-06 |
Microfeature devices and methods for manufacturing microfeature devices
Grant 7,253,089 - Luo , et al. August 7, 2 | 2007-08-07 |
Microfeature devices and methods for manufacturing microfeature devices
Grant 7,199,037 - Luo , et al. April 3, 2 | 2007-04-03 |
Semiconductor device structures including protective layers formed from healable materials
Grant 7,199,464 - Luo , et al. April 3, 2 | 2007-04-03 |
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
App 20060246626 - Jiang; Tongbi ; et al. | 2006-11-02 |
Microfeature devices and methods for manufacturing microfeature devices
App 20060194424 - Luo; Shijian ; et al. | 2006-08-31 |
Microfeature devices and methods for manufacturing microfeature devices
App 20060189118 - Luo; Shijian ; et al. | 2006-08-24 |
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
App 20060043364 - Jiang; Tongbi ; et al. | 2006-03-02 |
Microfeature devices and methods for manufacturing microfeature devices
App 20050277279 - Luo, Shijian ; et al. | 2005-12-15 |
Semiconductor device structures including protective layers formed from healable materials
App 20050156328 - Luo, Shijian ; et al. | 2005-07-21 |
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
Grant 6,885,108 - Luo , et al. April 26, 2 | 2005-04-26 |
Methods for forming protective layers on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
App 20040198023 - Luo, Shijian ; et al. | 2004-10-07 |
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
App 20040183210 - Luo, Shijian ; et al. | 2004-09-23 |
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