Luo; Lixiong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Luo; Lixiong.The latest application filed is for "semiconductor packaging techniques".
- Luo; Lixiong - San Jose CA US
| Patent | Date |
|---|---|
| Semiconductor including cup-shaped leadframe packaging techniques Grant 9,040,356 - Chang , et al. May 26, 2 | 2015-05-26 |
| Semiconductor Packaging Techniques App 20090256246 - Chang; Mike ; et al. | 2009-10-15 |
| Semiconductor die package including cup-shaped leadframe Grant 7,595,547 - Chang , et al. September 29, 2 | 2009-09-29 |
| Semiconductor assembly with package using cup-shaped lead-frame Grant 6,909,170 - Chang , et al. June 21, 2 | 2005-06-21 |
| Semiconductor die package including cup-shaped leadframe Grant 6,744,124 - Chang , et al. June 1, 2 | 2004-06-01 |
| Semiconductor assembly with package using cup-shaped lead frame App 20030057532 - Chang, Mike ; et al. | 2003-03-27 |
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