Luo; Junhua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Luo; Junhua.The latest application filed is for "li4sr(bo3)2 compound, li4sr(bo3)2 nonlinear optical crystal, preparation method and use thereof".

Company Profile

0.13.16

Luo; Junhua - Fujian CN
LUO; Junhua - Fuzhou Fujian
Luo; Junhua - Tianjin N/A CN
Luo; Junhua - Shenzhen City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Li4Sr(BO3)2 compound, Li4Sr(BO3)2 nonlinear optical crystal, preparation method and use thereof Grant 10,005,675 - Zhang , et al. June 26, 2	2018-06-26
Li4Sr(BO3)2 Compound, Li4Sr(BO3)2 Nonlinear Optical Crystal, Preparation Method and Use Thereof App 20160137515 - ZHANG; Guochun ; et al.	2016-05-19
Semiconductor device package with cap element Grant 9,093,438 - Yin , et al. July 28, 2	2015-07-28
Semiconductor Device Package With Cap Element App 20140357023 - Yin; Baoguan ; et al.	2014-12-04
Method of packaging semiconductor die with cap element Grant 8,859,336 - Luo , et al. October 14, 2	2014-10-14
Semiconductor Device Die Attachment App 20140284806 - Luo; Junhua ; et al.	2014-09-25
Semiconductor device package with cap element Grant 8,836,105 - Yin , et al. September 16, 2	2014-09-16
Method of assembling semiconductor device including insulating substrate and heat sink Grant 8,722,465 - Luo , et al. May 13, 2	2014-05-13
Method Of Assembling Semiconductor Device Including Insulating Substrate And Heat Sink App 20140127862 - Luo; Junhua ; et al.	2014-05-08
Method of assembling semiconductor device including insulating substrate and heat sink Grant 8,643,170 - Luo , et al. February 4, 2	2014-02-04
Semiconductor Device Package With Cap Element App 20140027896 - Yin; Baoguan ; et al.	2014-01-30
Method of making semiconductor package with improved standoff Grant 8,481,369 - Luo , et al. July 9, 2	2013-07-09
Semiconductor Device Die Bonding App 20130037966 - QIU; Shunan ; et al.	2013-02-14
Method Of Assembling Semiconductor Device Including Insulating Substrate And Heat Sink App 20120264258 - LUO; Junhua ; et al.	2012-10-18
Method Of Packaging Semiconductor Die With Cap Element App 20120238058 - LUO; Junhua ; et al.	2012-09-20
Method Of Making Semiconductor Package With Improved Standoff App 20110189823 - Luo; Junhua ; et al.	2011-08-04
Lead Frame For Semiconductor Device App 20100283135 - YAO; Jinzhong ; et al.	2010-11-11
Process Generation Approach and System for an Integrated Telecom Platform App 20090249312 - Liao; Yongkun ; et al.	2009-10-01

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