Luo; Jia Le
Patent Applications and Registrations
Patent applications and USPTO patent grants for Luo; Jia Le.The latest application filed is for "method and system for pull testing of wire bonds".
- Luo; Jia Le - Singapore SG
| Patent | Date |
|---|---|
| Method and apparatus for measuring a free air ball size during wire bonding Grant 10,163,845 - Song , et al. Dec | 2018-12-25 |
| Method and system for pull testing of wire bonds Grant 9,889,521 - Song , et al. February 13, 2 | 2018-02-13 |
| Method And System For Pull Testing Of Wire Bonds App 20160153880 - SONG; Keng Yew ; et al. | 2016-06-02 |
| Method And Apparatus For Measuring A Free Air Ball Size During Wire Bonding App 20150008251 - SONG; Keng Yew ; et al. | 2015-01-08 |
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