Patent | Date |
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Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 9,061,317 - Vrtis , et al. June 23, 2 | 2015-06-23 |
Methods for using porogens for low k porous organosilica glass films Grant 8,951,342 - Vrtis , et al. February 10, 2 | 2015-02-10 |
Materials and Methods of Forming Controlled Void App 20140363950 - Vrtis; Raymond Nicholas ;   et al. | 2014-12-11 |
Materials and methods of forming controlled void Grant 8,846,522 - Vrtis , et al. September 30, 2 | 2014-09-30 |
Materials and Methods of Forming Controlled Void App 20130157435 - Vrtis; Raymond Nicholas ;   et al. | 2013-06-20 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20130095255 - Vrtis; Raymond Nicholas ;   et al. | 2013-04-18 |
Materials and methods of forming controlled void Grant 8,399,349 - Vrtis , et al. March 19, 2 | 2013-03-19 |
Methods For Using Porogens For Low K Porous Organosilica Glass Films App 20120282415 - Vrtis; Raymond Nicholas ;   et al. | 2012-11-08 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 8,293,001 - Vrtis , et al. October 23, 2 | 2012-10-23 |
Mechanical enhancer additives for low dielectric films Grant 8,137,764 - Vincent , et al. March 20, 2 | 2012-03-20 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants App 20110143032 - Vrtis; Raymond Nicholas ;   et al. | 2011-06-16 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 7,943,195 - Vrtis , et al. May 17, 2 | 2011-05-17 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,932,188 - Lukas , et al. April 26, 2 | 2011-04-26 |
Method for removing carbon-containing residues from a substrate Grant 7,581,549 - Johnson , et al. September 1, 2 | 2009-09-01 |
Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure App 20090054674 - Lukas; Aaron Scott ;   et al. | 2009-02-26 |
Non-thermal process for forming porous low dielectric constant films Grant 7,470,454 - Lukas , et al. December 30, 2 | 2008-12-30 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,468,290 - Lukas , et al. December 23, 2 | 2008-12-23 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20080271640 - Vrtis; Raymond Nicholas ;   et al. | 2008-11-06 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20080268177 - Vrtis; Raymond Nicholas ;   et al. | 2008-10-30 |
Non-thermal process for forming porous low dielectric constant films Grant 7,404,990 - Lukas , et al. July 29, 2 | 2008-07-29 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 7,384,471 - Vrtis , et al. June 10, 2 | 2008-06-10 |
Porous low dielectric constant compositions and methods for making and using same Grant 7,332,445 - Lukas , et al. February 19, 2 | 2008-02-19 |
Materials And Methods Of Forming Controlled Void App 20080038934 - VRTIS; RAYMOND NICHOLAS ;   et al. | 2008-02-14 |
Method for removing a residue from a chamber App 20060196525 - Vrtis; Raymond Nicholas ;   et al. | 2006-09-07 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,098,149 - Lukas , et al. August 29, 2 | 2006-08-29 |
Low dielectric constant material and method of processing by CVD Grant 7,074,489 - O'Neill , et al. July 11, 2 | 2006-07-11 |
Porous low dielectric constant compositions and methods for making and using same App 20060078676 - Lukas; Aaron Scott ;   et al. | 2006-04-13 |
Method for removing carbon-containing residues from a substrate App 20060027249 - Johnson; Andrew David ;   et al. | 2006-02-09 |
Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants Grant 6,846,515 - Vrtis , et al. January 25, 2 | 2005-01-25 |
Mechanical enhancer additives for low dielectric films App 20040241463 - Vincent, Jean Louise ;   et al. | 2004-12-02 |
Method for enhancing deposition rate of chemical vapor deposition films App 20040197474 - Vrtis, Raymond Nicholas ;   et al. | 2004-10-07 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175957 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175501 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Non-thermal process for forming porous low dielectric constant films App 20040096672 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Non-thermal process for forming porous low dielectric constant films App 20040096593 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants App 20030232137 - Vrtis, Raymond Nicholas ;   et al. | 2003-12-18 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants App 20030198742 - Vrtis, Raymond Nicholas ;   et al. | 2003-10-23 |
Low dielectric constant material and method of processing by CVD App 20030162034 - O'Neill, Mark Leonard ;   et al. | 2003-08-28 |