loadpatents
name:-0.040625095367432
name:-0.022204875946045
name:-0.00065517425537109
Lukas; Aaron Scott Patent Filings

Lukas; Aaron Scott

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lukas; Aaron Scott.The latest application filed is for "materials and methods of forming controlled void".

Company Profile
0.20.22
  • Lukas; Aaron Scott - Washington DC
  • Lukas; Aaron Scott - Lansdale PA
  • Lukas; Aaron Scott - Allentown PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
Grant 9,061,317 - Vrtis , et al. June 23, 2
2015-06-23
Methods for using porogens for low k porous organosilica glass films
Grant 8,951,342 - Vrtis , et al. February 10, 2
2015-02-10
Materials and Methods of Forming Controlled Void
App 20140363950 - Vrtis; Raymond Nicholas ;   et al.
2014-12-11
Materials and methods of forming controlled void
Grant 8,846,522 - Vrtis , et al. September 30, 2
2014-09-30
Materials and Methods of Forming Controlled Void
App 20130157435 - Vrtis; Raymond Nicholas ;   et al.
2013-06-20
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants
App 20130095255 - Vrtis; Raymond Nicholas ;   et al.
2013-04-18
Materials and methods of forming controlled void
Grant 8,399,349 - Vrtis , et al. March 19, 2
2013-03-19
Methods For Using Porogens For Low K Porous Organosilica Glass Films
App 20120282415 - Vrtis; Raymond Nicholas ;   et al.
2012-11-08
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
Grant 8,293,001 - Vrtis , et al. October 23, 2
2012-10-23
Mechanical enhancer additives for low dielectric films
Grant 8,137,764 - Vincent , et al. March 20, 2
2012-03-20
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants
App 20110143032 - Vrtis; Raymond Nicholas ;   et al.
2011-06-16
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
Grant 7,943,195 - Vrtis , et al. May 17, 2
2011-05-17
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
Grant 7,932,188 - Lukas , et al. April 26, 2
2011-04-26
Method for removing carbon-containing residues from a substrate
Grant 7,581,549 - Johnson , et al. September 1, 2
2009-09-01
Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure
App 20090054674 - Lukas; Aaron Scott ;   et al.
2009-02-26
Non-thermal process for forming porous low dielectric constant films
Grant 7,470,454 - Lukas , et al. December 30, 2
2008-12-30
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
Grant 7,468,290 - Lukas , et al. December 23, 2
2008-12-23
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants
App 20080271640 - Vrtis; Raymond Nicholas ;   et al.
2008-11-06
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants
App 20080268177 - Vrtis; Raymond Nicholas ;   et al.
2008-10-30
Non-thermal process for forming porous low dielectric constant films
Grant 7,404,990 - Lukas , et al. July 29, 2
2008-07-29
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
Grant 7,384,471 - Vrtis , et al. June 10, 2
2008-06-10
Porous low dielectric constant compositions and methods for making and using same
Grant 7,332,445 - Lukas , et al. February 19, 2
2008-02-19
Materials And Methods Of Forming Controlled Void
App 20080038934 - VRTIS; RAYMOND NICHOLAS ;   et al.
2008-02-14
Method for removing a residue from a chamber
App 20060196525 - Vrtis; Raymond Nicholas ;   et al.
2006-09-07
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
Grant 7,098,149 - Lukas , et al. August 29, 2
2006-08-29
Low dielectric constant material and method of processing by CVD
Grant 7,074,489 - O'Neill , et al. July 11, 2
2006-07-11
Porous low dielectric constant compositions and methods for making and using same
App 20060078676 - Lukas; Aaron Scott ;   et al.
2006-04-13
Method for removing carbon-containing residues from a substrate
App 20060027249 - Johnson; Andrew David ;   et al.
2006-02-09
Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants
Grant 6,846,515 - Vrtis , et al. January 25, 2
2005-01-25
Mechanical enhancer additives for low dielectric films
App 20040241463 - Vincent, Jean Louise ;   et al.
2004-12-02
Method for enhancing deposition rate of chemical vapor deposition films
App 20040197474 - Vrtis, Raymond Nicholas ;   et al.
2004-10-07
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
App 20040175957 - Lukas, Aaron Scott ;   et al.
2004-09-09
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
App 20040175501 - Lukas, Aaron Scott ;   et al.
2004-09-09
Non-thermal process for forming porous low dielectric constant films
App 20040096672 - Lukas, Aaron Scott ;   et al.
2004-05-20
Non-thermal process for forming porous low dielectric constant films
App 20040096593 - Lukas, Aaron Scott ;   et al.
2004-05-20
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
App 20030232137 - Vrtis, Raymond Nicholas ;   et al.
2003-12-18
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants
App 20030198742 - Vrtis, Raymond Nicholas ;   et al.
2003-10-23
Low dielectric constant material and method of processing by CVD
App 20030162034 - O'Neill, Mark Leonard ;   et al.
2003-08-28

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