loadpatents
name:-0.015891075134277
name:-0.011826992034912
name:-0.00058102607727051
LUBBEN; Daniel C. Patent Filings

LUBBEN; Daniel C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for LUBBEN; Daniel C..The latest application filed is for "self-ionized and inductively-coupled plasma for sputtering and resputtering".

Company Profile
0.11.13
  • LUBBEN; Daniel C. - San Jose CA
  • Lubben, Daniel C. - Saratoga CA
  • Lubben; Daniel C. - Santa Clara CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20180327893 - DING; Peijun ;   et al.
2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 10,047,430 - Ding , et al. August 14, 2
2018-08-14
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20140305802 - DING; Peijun ;   et al.
2014-10-16
Prediction and compensation of erosion in a magnetron sputtering target
Grant 8,764,949 - Miller , et al. July 1, 2
2014-07-01
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 8,696,875 - Ding , et al. April 15, 2
2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 8,668,816 - Ding , et al. March 11, 2
2014-03-11
Prediction and compensation of erosion in a magnetron sputtering target
App 20130313107 - Miller; Keith A. ;   et al.
2013-11-28
Method for predicting and compensating erosion in a magnetron sputtering target
Grant 8,518,220 - Miller , et al. August 27, 2
2013-08-27
Method for Predicting and Compensating Erosion in a Magnetron Sputtering Target
App 20120132518 - Miller; Keith A. ;   et al.
2012-05-31
Prediction and compensation of erosion in a magnetron sputtering target
Grant 8,133,360 - Miller , et al. March 13, 2
2012-03-13
Mechanism for varying the spacing between sputter magnetron and target
Grant 7,674,360 - Hong , et al. March 9, 2
2010-03-09
Apparatus And Method For Uniform Deposition
App 20090308732 - Cao; Yong ;   et al.
2009-12-17
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20090233438 - DING; Peijun ;   et al.
2009-09-17
Prediction And Compensation Of Erosion In A Magnetron Sputtering Target
App 20090159428 - MILLER; KEITH A. ;   et al.
2009-06-25
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20080110747 - DING; Peijun ;   et al.
2008-05-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering
App 20050255691 - Ding, Peijun ;   et al.
2005-11-17
Compensation of spacing between magnetron and sputter target
App 20050133361 - Ding, Peijun ;   et al.
2005-06-23
Mechanism for varying the spacing between sputter magnetron and target
App 20050133365 - Hong, Ilyoung Richard ;   et al.
2005-06-23
Small epicyclic magnetron with controlled radial sputtering profile
Grant 6,852,202 - Miller , et al. February 8, 2
2005-02-08
Self-ionized and inductively-coupled plasma for sputtering and resputtering
App 20050006222 - Ding, Peijun ;   et al.
2005-01-13
Small epicyclic magnetron with controlled radial sputtering profile
App 20030217914 - Miller, Michael Andrew ;   et al.
2003-11-27

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