LUAN; Jing-En

Patent Applications and Registrations

Patent applications and USPTO patent grants for LUAN; Jing-En.The latest application filed is for "wafer level packaging having redistribution layer formed utilizing laser direct structuring".

Company Profile

7.50.58

LUAN; Jing-En - Singapore SG
LUAN; Jing-En - Shenzhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Level Packaging Having Redistribution Layer Formed Utilizing Laser Direct Structuring App 20220285256 - LUAN; Jing-En	2022-09-08
Stacked Die Package Including A Multi-contact Interconnect App 20220199582 - LUAN; Jing-En	2022-06-23
Optical Sensor Package And Method Of Making An Optical Sensor Package App 20220189788 - LUAN; Jing-En	2022-06-16
Package With Polymer Pillars And Raised Portions App 20220165699 - LUAN; Jing-En	2022-05-26
Wafer Level Chip Scale Packaging With Sensor App 20210395077 - LUAN; Jing-En	2021-12-23
Embedded Wafer Level Optical Sensor Packaging App 20210399157 - LUAN; Jing-En	2021-12-23
Optical Sensor Package App 20210080547 - LUAN; Jing-En	2021-03-18
Wafer Level Chip Scale Package Having Varying Thicknesses App 20200395324 - LUAN; Jing-En	2020-12-17
Semiconductor Device With A Dielectric Between Portions App 20200381320 - LUAN; Jing-En	2020-12-03
Molded Proximity Sensor App 20190391264 - LUAN; Jing-En ; et al.	2019-12-26
Molded proximity sensor Grant 10,429,509 - Luan , et al. O	2019-10-01
Glue bleeding prevention cap for optical sensor packages Grant 10,355,146 - Luan , et al. July 16, 2	2019-07-16
Proximity detector device with interconnect layers and related methods Grant 10,326,039 - Luan	2019-06-18
Semiconductor die attachment with embedded stud bumps in attachment material Grant 10,269,583 - Luan	2019-04-23
Proximity sensor and manufacturing method therefor Grant 10,244,638 - Luan	2019-03-26
Proximity Detector Device With Interconnect Layers And Related Methods App 20190058076 - Luan; Jing-En	2019-02-21
Proximity detector device with interconnect layers and related methods Grant 10,141,471 - Luan Nov	2018-11-27
Glue Bleeding Prevention Cap For Optical Sensor Packages App 20180331236 - LUAN; Jing-En ; et al.	2018-11-15
Proximity sensor, electronic apparatus and method for manufacturing proximity sensor Grant 10,126,462 - Luan November 13, 2	2018-11-13
Glue bleeding prevention cap for optical sensor packages Grant 10,038,108 - Luan , et al. July 31, 2	2018-07-31
Semiconductor Packages And Methods For Forming Same App 20180122728 - LUAN; Jing-En	2018-05-03
Camera module and method of manufacturing the same Grant 9,923,020 - Luan March 20, 2	2018-03-20
Glue Bleeding Prevention Cap For Optical Sensor Packages App 20180062003 - LUAN; Jing-En ; et al.	2018-03-01
Electronic device with periphery contact pads surrounding central contact pads Grant 9,859,196 - Luan January 2, 2	2018-01-02
Proximity Detector Device With Interconnect Layers And Related Methods App 20170330989 - Luan; Jing-En	2017-11-16
Proximity detector device with interconnect layers and related methods Grant 9,768,341 - Luan September 19, 2	2017-09-19
Semiconductor device, semiconductor package, and method for manufacturing semiconductor device Grant 9,754,916 - Luan September 5, 2	2017-09-05
Electronic device with redistribution layer and stiffeners and related methods Grant 9,698,105 - Luan July 4, 2	2017-07-04
Semiconductor Packages And Methods For Forming Same App 20170186674 - Luan; Jing-En	2017-06-29
Proximity sensor, electronic apparatus and method for manufacturing proximity sensor Grant 9,645,238 - Luan May 9, 2	2017-05-09
Proximity Sensor, Electronic Apparatus And Method For Manufacturing Proximity Sensor App 20170123101 - Luan; Jing-En	2017-05-04
Proximity Sensor, Electronic Apparatus And Method For Manufacturing Proximity Sensor App 20170123064 - LUAN; Jing-En	2017-05-04
Image sensor circuit, system, and method Grant 9,640,574 - Luan , et al. May 2, 2	2017-05-02
Wafer level packaging for proximity sensor Grant 9,583,666 - Luan February 28, 2	2017-02-28
Semiconductor Die Attachment With Embedded Stud Bumps In Attachment Material App 20170053856 - LUAN; Jing-En	2017-02-23
Proximity Sensor And Manufacturing Method Therefor App 20170052040 - LUAN; Jing-En	2017-02-23
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device App 20170040286 - LUAN; Jing-En	2017-02-09
Electronic Device with Redistribution Layer and Stiffeners and Related Methods App 20160372426 - Luan; Jing-En	2016-12-22
Electronic Device with First and Second Contact Pads and Related Methods App 20160372406 - Luan; Jing-En	2016-12-22
Semiconductor device, semiconductor package, and method for manufacturing semiconductor device Grant 9,502,381 - Luan November 22, 2	2016-11-22
Electronic device with first and second contact pads and related methods Grant 9,466,557 - Luan October 11, 2	2016-10-11
Image sensing device with interconnect layer gap Grant 9,455,292 - Luan September 27, 2	2016-09-27
Image sensor device with aligned IR filter and dielectric layer and related methods Grant 9,419,047 - Luan August 16, 2	2016-08-16
Image sensor device with flexible interconnect layer and related methods Grant 9,385,153 - Luan July 5, 2	2016-07-05
Wafer Level Packaging For Proximity Sensor App 20160190380 - LUAN; Jing-En	2016-06-30
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device App 20160190097 - LUAN; Jing-En	2016-06-30
Molded Proximity Sensor App 20160187483 - LUAN; Jing-En ; et al.	2016-06-30
Compact electronic package with MEMS IC and related methods Grant 9,365,415 - Luan June 14, 2	2016-06-14
Electronic Device With First And Second Contact Pads And Related Methods App 20160111354 - LUAN; JING-EN	2016-04-21
Image Sensing Device With Interconnect Layer Gap And Related Methods App 20160104738 - LUAN; Jing-En	2016-04-14
Electronic Device With Redistribution Layer And Stiffeners And Related Methods App 20160104656 - LUAN; Jing-En	2016-04-14
Image Sensor Device With Flexible Interconnect Layer And Related Methods App 20160104737 - LUAN; Jing-En	2016-04-14
Electronic device with first and second contact pads and related methods Grant 9,287,227 - Luan March 15, 2	2016-03-15
Camera Module And Method Of Manufacturing The Same App 20150380454 - Luan; Jing-En	2015-12-31
Leadless surface mount assembly package and method of manufacturing the same Grant 9,177,939 - Luan November 3, 2	2015-11-03
Imaging device with adhesive filling openings and related methods Grant 9,083,872 - Luan July 14, 2	2015-07-14
Compact Electronic Package With Mems Ic And Related Methods App 20150183637 - LUAN; Jing-En	2015-07-02
Electronic Device With First And Second Contact Pads And Related Methods App 20150155215 - LUAN; Jing-En	2015-06-04
Leadless Surface Mount Assembly Package And Method Of Manufacturing The Same App 20150145110 - LUAN; Jing-En	2015-05-28
Adhesive dam Grant 9,025,339 - Luan , et al. May 5, 2	2015-05-05
Lens alignment apparatus and method Grant 9,019,636 - Luan , et al. April 28, 2	2015-04-28
Image Detector With Lens Assembly And Related Methods App 20150029384 - Luan; Jing-En	2015-01-29
Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layer Grant 8,934,052 - Luan January 13, 2	2015-01-13
Optical sensor package with through vias Grant 8,890,269 - Luan November 18, 2	2014-11-18
Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture Grant 8,884,422 - Goh , et al. November 11, 2	2014-11-11
Proximity Detector Device With Interconnect Layers And Related Methods App 20140319548 - LUAN; Jing-En	2014-10-30
Chip package with coplanarity controlling feature Grant 8,836,143 - Luan September 16, 2	2014-09-16
Image Sensor Device With Aligned Ir Filter And Dielectric Layer And Related Methods App 20140184809 - LUAN; Jing-En	2014-07-03
Imaging Device With Adhesive Filling Openings And Related Methods App 20140092297 - LUAN; Jing-En	2014-04-03
Wafer Level Optical Sensor Package And Low Profile Camera Module, And Method Of Manufacture App 20130320471 - Luan; Jing-En	2013-12-05
Wafer-level packaging method using composite material as a base Grant 8,502,367 - Luan August 6, 2	2013-08-06
Adhesive Dam App 20130170164 - Luan; Jing-En ; et al.	2013-07-04
Fan-out wafer level package for an optical sensor and method of manufacture thereof Grant 8,466,997 - Goh , et al. June 18, 2	2013-06-18
Chip Scale Package structure with can attachment Grant 8,389,335 - Goh , et al. March 5, 2	2013-03-05
Manufacturing Method Of Chip Package With Coplanarity Controlling Feature App 20130009326 - Luan; Jing-en	2013-01-10
Manufacturing method of chip package with coplanarity controlling feature Grant 8,278,146 - Luan October 2, 2	2012-10-02
Chip Scale Package Structure With Can Attachment App 20120178213 - Goh; Kim-Yong ; et al.	2012-07-12
Image Sensor Circuit, System, And Method App 20120168888 - LUAN; JING-EN ; et al.	2012-07-05
Lens Alignment Apparatus And Method App 20120162788 - LUAN; Jing-En ; et al.	2012-06-28
Low Profile Chip Scale Module And Method Of Producing The Same App 20120105713 - LUAN; Jing-En	2012-05-03
Chip scale package structure with can attachment Grant 8,164,179 - Goh , et al. April 24, 2	2012-04-24
Wafer-level Packaging Method Using Composite Material As A Base App 20120074592 - Luan; Jing-En	2012-03-29
Semiconductor package with a stiffening member supporting a thermal heat spreader Grant 8,013,438 - Luan , et al. September 6, 2	2011-09-06
Reliable Large Die Fan-out Wafer Level Package And Method Of Manufacture App 20110156240 - Luan; Jing-En ; et al.	2011-06-30
Flip-chip Fan-out Wafer Level Package For Package-on-package Applications, And Method Of Manufacture App 20110156250 - Goh; Kim-Yong ; et al.	2011-06-30
Fan-out Wafer Level Package For An Optical Sensor And Method Of Manufacture Thereof App 20110157452 - Goh; Kim-Yong ; et al.	2011-06-30
Step cavity for enhanced drop test performance in ball grid array package Grant 7,956,475 - Goh , et al. June 7, 2	2011-06-07
Semiconductor package with position member Grant 7,919,361 - Loo , et al. April 5, 2	2011-04-05
Semiconductor Package With A Stiffening Member Supporting A Thermal Heat Spreader App 20110018125 - Loo; Kum-Weng ; et al.	2011-01-27
Ic Package Design With Stress Relief Feature App 20100327421 - Luan; Jing-En	2010-12-30
Semiconductor package with position member App 20100297813 - Loo; Kum-weng ; et al.	2010-11-25
Semiconductor package with position member Grant 7,745,945 - Loo , et al. June 29, 2	2010-06-29
Chip Scale Package Structure With Can Attachment App 20100148347 - Goh; Kim-Yong ; et al.	2010-06-17
Step Cavity For Enhanced Drop Test Performance In Ball Grid Array Package App 20100148363 - Goh; Kim-Yong ; et al.	2010-06-17
Chip Package With Coplanarity Controlling Feature App 20100140810 - Luan; Jing-en	2010-06-10
Semiconductor package with position member App 20070085177 - Loo; Kum-weng ; et al.	2007-04-19

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