Lu; Yung-Li
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lu; Yung-Li.The latest application filed is for "stackable semiconductor package".
- Lu; Yung-Li - Kaohsiung TW
- Lu; Yung-Li - Kaohsiung Hsien TW
- Lu; Yung-Li - Kao-Hsiung Hsien TW
- Lu; Yung-Li - Kaohsiung County TW
- Lu; Yung-Li - Linyuan Township Kaohsiung County TW
| Patent | Date |
|---|---|
| Stackable semiconductor package Grant 7,589,408 - Weng , et al. September 15, 2 | 2009-09-15 |
| Stackable semiconductor package Grant 7,550,832 - Weng , et al. June 23, 2 | 2009-06-23 |
| Chip package with a ring having a buffer groove that surrounds the active region of a chip Grant 7,547,962 - Weng , et al. June 16, 2 | 2009-06-16 |
| Chip package and package process thereof Grant 7,432,127 - Lu , et al. October 7, 2 | 2008-10-07 |
| Stackable semiconductor package Grant 7,365,427 - Lu , et al. April 29, 2 | 2008-04-29 |
| Stackable semiconductor package App 20080042251 - Weng; Gwo-Liang ; et al. | 2008-02-21 |
| Stackable semiconductor package App 20070278640 - Weng; Gwo-Liang ; et al. | 2007-12-06 |
| Stackable semiconductor package App 20070278696 - Lu; Yung-Li ; et al. | 2007-12-06 |
| Stackable Semiconductor Package App 20070246815 - Lu; Yung-Li ; et al. | 2007-10-25 |
| Chip package App 20070222041 - Weng; Gwo-Liang ; et al. | 2007-09-27 |
| Chip Package Structure App 20070075441 - Lee; Cheng-Yin ; et al. | 2007-04-05 |
| Sensor chip packaging structure Grant 7,187,067 - Weng , et al. March 6, 2 | 2007-03-06 |
| Chip Package and Package Process Thereof App 20070042534 - Lu; Yung-Li ; et al. | 2007-02-22 |
| Semiconductor package Grant 7,126,221 - Weng , et al. October 24, 2 | 2006-10-24 |
| Semiconductor package structure Grant 7,122,893 - Weng , et al. October 17, 2 | 2006-10-17 |
| Contact sensor package structure Grant 7,122,757 - Lee , et al. October 17, 2 | 2006-10-17 |
| Chip on glass package Grant 7,049,689 - Yeh , et al. May 23, 2 | 2006-05-23 |
| Sensor chip packaging structure App 20060091515 - Weng; Gwo-Liang ; et al. | 2006-05-04 |
| Semiconductor package and method of manufacturing the same App 20050275074 - Weng, Gwo-Liang ; et al. | 2005-12-15 |
| Contact sensor package structure App 20050274597 - Lee, Shih-Chang ; et al. | 2005-12-15 |
| Chip on glass package App 20050062142 - Yeh, Ying-Tsai ; et al. | 2005-03-24 |
| Semiconductor package structure App 20050051885 - Weng, Gwo-Liang ; et al. | 2005-03-10 |
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