| Patent | Date |
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Semiconductor Device With Isolation Structure
App 20220293596 - WANG; Chieh-Ping ; et al. | 2022-09-15 |
Semiconductor device and method
Grant 11,444,177 - Lin , et al. September 13, 2 | 2022-09-13 |
Dielectric Spacer to Prevent Contacting Shorting
App 20220285529 - Chen; Ting-Gang ; et al. | 2022-09-08 |
Semiconductor device and method of manufacture
Grant 11,437,492 - Kao , et al. September 6, 2 | 2022-09-06 |
Post-formation Mends Of Dielectric Features
App 20220254901 - Kao; Wan-Yi ; et al. | 2022-08-11 |
Reducing K Values of Dielectric Films Through Anneal
App 20220238697 - Lin; Wen-Kai ; et al. | 2022-07-28 |
Semiconductor Device and Method
App 20220231022 - Kao; Wan-Yi ; et al. | 2022-07-21 |
Semiconductor device with isolation structure
Grant 11,348,917 - Wang , et al. May 31, 2 | 2022-05-31 |
Dielectric spacer to prevent contacting shorting
Grant 11,342,444 - Chen , et al. May 24, 2 | 2022-05-24 |
Post-formation mends of dielectric features
Grant 11,316,034 - Kao , et al. April 26, 2 | 2022-04-26 |
Gapfill Structure And Manufacturing Methods Thereof
App 20220051950 - Lin; Sung-En ; et al. | 2022-02-17 |
Nanosheet Field-effect Transistor Device And Method Of Forming
App 20220052181 - Lin; Wen-Kai ; et al. | 2022-02-17 |
Semiconductor Device and Method of Manufacture
App 20220037321 - Kao; Wan-Yi ; et al. | 2022-02-03 |
Semiconductor Device and Method of Manufacture
App 20220029011 - Kao; Wan-Yi ; et al. | 2022-01-27 |
Method of forming isolation layer
Grant 11,227,788 - Tsai , et al. January 18, 2 | 2022-01-18 |
Semiconductor Device And Method
App 20220013364 - Chang; Ya-Lan ; et al. | 2022-01-13 |
Defect filling in patterned layer
Grant 11,205,709 - Chang , et al. December 21, 2 | 2021-12-21 |
Semiconductor Devices and Methods of Manufacture
App 20210376105 - Lin; Wen-Kai ; et al. | 2021-12-02 |
Post-Formation Mends of Dielectric Features
App 20210376113 - Kao; Wan-Yi ; et al. | 2021-12-02 |
Semiconductor Device and Method of Manufacture
App 20210367063 - Kao; Wan-Yi ; et al. | 2021-11-25 |
Replacement Gate Process for Semiconductor Devices
App 20210358816 - Shen; Yu-Jen ; et al. | 2021-11-18 |
Semiconductor Device With Isolation Structure
App 20210343709 - WANG; Chieh-Ping ; et al. | 2021-11-04 |
Semiconductor Devices And Methods Of Manufacture
App 20210335657 - Lu; Bo-Cyuan ; et al. | 2021-10-28 |
Dielectric spacer to prevent contacting shorting
Grant 11,107,902 - Chen , et al. August 31, 2 | 2021-08-31 |
Semiconductor Device And Method
App 20210242333 - Kao; Wan-Yi ; et al. | 2021-08-05 |
Semiconductor Device and Method
App 20210242327 - Lin; Wen-Kai ; et al. | 2021-08-05 |
Replacement gate process for semiconductor devices
Grant 11,081,402 - Shen , et al. August 3, 2 | 2021-08-03 |
CMP-friendly coatings for planar recessing or removing of variable-height layers
Grant 11,011,385 - Liu , et al. May 18, 2 | 2021-05-18 |
Atomic Layer Deposition Tool And Method
App 20210115557 - Ko; Chung-Ting ; et al. | 2021-04-22 |
Method Of Forming Isolation Layer
App 20200335388 - TSAI; Teng-Chun ; et al. | 2020-10-22 |
Method of forming isolation layer
Grant 10,707,114 - Tsai , et al. | 2020-07-07 |
Environment control system and method of guiding occupant to make demand response to environment status thereof
Grant 10,648,689 - Lu , et al. | 2020-05-12 |
Network management system and method for automatic registration of network device thereof
Grant 10,641,513 - Lu , et al. | 2020-05-05 |
Replacement Gate Process for Semiconductor Devices
App 20200118887 - Shen; Yu-Jen ; et al. | 2020-04-16 |
Dielectric Spacer to Prevent Contacting Shorting
App 20200013875 - Chen; Ting-Gang ; et al. | 2020-01-09 |
Defect Filling in Patterned Layer
App 20190393325 - Chang; Chia-Ao ; et al. | 2019-12-26 |
Dielectric Spacer to Prevent Contacting Shorting
App 20190393324 - Chen; Ting-Gang ; et al. | 2019-12-26 |
Replacement gate process for semiconductor devices
Grant 10,515,860 - Shen , et al. Dec | 2019-12-24 |
Method of forming isolation layer
Grant 10,418,271 - Tsai , et al. Sept | 2019-09-17 |
Semiconductor device and method of forming vertical structure
Grant 10,325,994 - Peng , et al. | 2019-06-18 |
Method for forming semiconductor device structure with gate structure
Grant 10,312,158 - Li , et al. | 2019-06-04 |
CMP Polishing Head Design for Improving Removal Rate Uniformity
App 20190126429 - Hou; Te-Chien ; et al. | 2019-05-02 |
Multi-layer mask and method of forming same
Grant 10,269,567 - Tsai , et al. | 2019-04-23 |
Method For Forming Semiconductor Device Structure With Gate Structure
App 20190043763 - LI; Yi-Cheng ; et al. | 2019-02-07 |
CMP polishing head design for improving removal rate uniformity
Grant 10,160,091 - Hou , et al. Dec | 2018-12-25 |
Method Of Forming Isolation Layer
App 20180350655 - TSAI; Teng-Chun ; et al. | 2018-12-06 |
Polisher, polishing tool, and polishing method
Grant 10,144,109 - Tsai , et al. De | 2018-12-04 |
Environment Control System And Method Of Guiding Occupant To Make Demand Response To Environment Status Thereof
App 20180320917 - LU; Yung-Cheng ; et al. | 2018-11-08 |
Network Management System And Method For Automatic Registration Of Network Device Thereof
App 20180324226 - LU; Yung-Cheng ; et al. | 2018-11-08 |
Semiconductor Device And Method Of Forming Vertical Structure
App 20180240882 - PENG; Chih-Tang ; et al. | 2018-08-23 |
Replacement Gate Process for Semiconductor Devices
App 20180197795 - Shen; Yu-Jen ; et al. | 2018-07-12 |
Method for operating a polishing head and method for polishing a substrate
Grant 9,987,720 - Suen , et al. June 5, 2 | 2018-06-05 |
Systems and methods for performing chemical mechanical planarization
Grant 9,962,801 - Lee , et al. May 8, 2 | 2018-05-08 |
Semiconductor device and method of forming vertical structure
Grant 9,954,069 - Peng , et al. April 24, 2 | 2018-04-24 |
Replacement gate process for semiconductor devices
Grant 9,917,017 - Shen , et al. March 13, 2 | 2018-03-13 |
Multi-Layer Mask and Method of Forming Same
App 20170372900 - Tsai; Teng-Chun ; et al. | 2017-12-28 |
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers
App 20170352548 - Liu; Wen-Kuei ; et al. | 2017-12-07 |
Multi-layer mask and method of forming same
Grant 9,768,024 - Tsai , et al. September 19, 2 | 2017-09-19 |
CMP-friendly coatings for planar recessing or removing of variable-height layers
Grant 9,748,109 - Liu , et al. August 29, 2 | 2017-08-29 |
Polisher, Polishing Tool, And Polishing Method
App 20170190017 - TSAI; Teng-Chun ; et al. | 2017-07-06 |
Replacement Gate Process for Semiconductor Devices
App 20170186650 - Shen; Yu-Jen ; et al. | 2017-06-29 |
CMP Polishing Head Design for Improving Removal Rate Uniformity
App 20170136602 - Hou; Te-Chien ; et al. | 2017-05-18 |
Methods of forming contact feature
Grant 9,620,628 - Huang , et al. April 11, 2 | 2017-04-11 |
BARC-assisted process for planar recessing or removing of variable-height layers
Grant 9,478,431 - Liu , et al. October 25, 2 | 2016-10-25 |
Semiconductor Device And Method Of Forming Vertical Structure
App 20160211370 - PENG; CHIH-TANG ; et al. | 2016-07-21 |
Carbonization of metal caps
Grant 9,385,034 - Chang , et al. July 5, 2 | 2016-07-05 |
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers
App 20160172209 - Liu; Wen-Kuei ; et al. | 2016-06-16 |
Platen assembly, chemical-mechanical polisher, and method for polishing substrate
Grant 9,352,443 - Suen , et al. May 31, 2 | 2016-05-31 |
Method For Operating A Polishing Head And Method For Polishing A Substrate
App 20160136777 - SUEN; Shich-Chang ; et al. | 2016-05-19 |
Semiconductor device and method of forming vertical structure
Grant 9,318,447 - Peng , et al. April 19, 2 | 2016-04-19 |
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers
App 20160099157 - Liu; Wen-Kuei ; et al. | 2016-04-07 |
Polishing head, and chemical-mechanical polishing system for polishing substrate
Grant 9,272,386 - Suen , et al. March 1, 2 | 2016-03-01 |
Semiconductor Device And Method Of Forming Vertical Structure
App 20160020180 - PENG; CHIH-TANG ; et al. | 2016-01-21 |
Barc-assisted process for planar recessing or removing of variable-height layers
Grant 9,236,446 - Liu , et al. January 12, 2 | 2016-01-12 |
Interconnect structure for semiconductor devices
Grant 9,219,036 - Chang , et al. December 22, 2 | 2015-12-22 |
Method Of Forming Isolation Layer
App 20150364358 - TSAI; TENG-CHUN ; et al. | 2015-12-17 |
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers
App 20150263132 - Liu; Wen-Kuei ; et al. | 2015-09-17 |
Impurity doped UV protection layer
Grant 9,136,226 - Wu , et al. September 15, 2 | 2015-09-15 |
Interconnect Structure for Semiconductor Devices
App 20150214159 - Chang; Hui-Lin ; et al. | 2015-07-30 |
Systems And Methods For Performing Chemical Mechanical Planarization
App 20150194318 - LEE; SHEN-NAN ; et al. | 2015-07-09 |
Platen Assembly, Chemical-Mechanical Polisher, and Method for Polishing Substrate
App 20150133033 - Suen; Shich-Chang ; et al. | 2015-05-14 |
Polishing Head, Chemical-Mechanical Polishing System, and Method for Polishing Substrate
App 20150111477 - SUEN; Shich-Chang ; et al. | 2015-04-23 |
Interconnect structure for semiconductor devices
Grant 8,999,842 - Chang , et al. April 7, 2 | 2015-04-07 |
Methods for improving uniformity of cap layers
Grant 8,987,085 - Yu , et al. March 24, 2 | 2015-03-24 |
Interconnect Structure for Semiconductor Devices
App 20150017800 - Chang; Hui-Lin ; et al. | 2015-01-15 |
Interconnect structure for semiconductor devices
Grant 8,785,324 - Chang , et al. July 22, 2 | 2014-07-22 |
Interconnect Structure for Semiconductor Devices
App 20130102148 - Chang; Hui-Lin ; et al. | 2013-04-25 |
Interconnect structure for semiconductor devices
Grant 8,330,275 - Chang , et al. December 11, 2 | 2012-12-11 |
Integrated circuit device
Grant 8,324,731 - Yu , et al. December 4, 2 | 2012-12-04 |
Synergy effect of alloying materials in interconnect structures
Grant 8,264,046 - Chang , et al. September 11, 2 | 2012-09-11 |
Interconnect structure having a silicide/germanide cap layer
Grant 8,143,162 - Yu , et al. March 27, 2 | 2012-03-27 |
Interconnect Structure for Semiconductor Devices
App 20120049371 - Chang; Hui-Lin ; et al. | 2012-03-01 |
Semiconductor device including I/O oxide nitrided core oxide on substrate
Grant 8,084,328 - Wu , et al. December 27, 2 | 2011-12-27 |
Interconnect structure for semiconductor devices
Grant 8,053,356 - Chang , et al. November 8, 2 | 2011-11-08 |
Selective formation of boron-containing metal cap pre-layer
Grant 7,977,791 - Chang , et al. July 12, 2 | 2011-07-12 |
Semiconductor device including I/O oxide nitrided core oxide on substrate, and method of manufacture
App 20110081758 - Wu; Zhen-Cheng ; et al. | 2011-04-07 |
Method for enhancing adhesion between layers in BEOL fabrication
Grant 7,897,505 - Ko , et al. March 1, 2 | 2011-03-01 |
Interconnect Structure for Semiconductor Devices
App 20110027991 - Chang; Hui-Lin ; et al. | 2011-02-03 |
Self-aligned dielectric cap
Grant 7,863,196 - Chang , et al. January 4, 2 | 2011-01-04 |
Semiconductor device including I/O oxide and nitrided core oxide on substrate
Grant 7,834,405 - Wu , et al. November 16, 2 | 2010-11-16 |
Interconnect structure for semiconductor devices
Grant 7,834,458 - Chang , et al. November 16, 2 | 2010-11-16 |
Impurity Doped UV Protection Layer
App 20100213518 - Wu; Zhen-Cheng ; et al. | 2010-08-26 |
Impurity doped UV protection layer
Grant 7,732,923 - Wu , et al. June 8, 2 | 2010-06-08 |
Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio
Grant 7,723,226 - Yu , et al. May 25, 2 | 2010-05-25 |
Interconnect Structure for Semiconductor Devices
App 20100090343 - Chang; Hui-Lin ; et al. | 2010-04-15 |
Integrated circuit device
App 20100065969 - Yu; Chen-Hua ; et al. | 2010-03-18 |
Synergy Effect of Alloying Materials in Interconnect Structures
App 20100059893 - Chang; Hui-Lin ; et al. | 2010-03-11 |
Interconnect structures for semiconductor devices
Grant 7,655,556 - Chang , et al. February 2, 2 | 2010-02-02 |
Bond pads and methods for fabricating the same
Grant 7,646,097 - Yu , et al. January 12, 2 | 2010-01-12 |
Synergy effect of alloying materials in interconnect structures
Grant 7,642,189 - Chang , et al. January 5, 2 | 2010-01-05 |
Interconnects with harmonized stress and methods for fabricating the same
Grant 7,638,859 - Lu , et al. December 29, 2 | 2009-12-29 |
Method for modulating stresses of a contact etch stop layer
Grant 7,629,273 - Yu , et al. December 8, 2 | 2009-12-08 |
Interconnect Structure Having a Silicide/Germanide Cap Layer
App 20090275195 - Yu; Chen-Hua ; et al. | 2009-11-05 |
Plasma processes for depositing low dielectric constant films
Grant 7,560,377 - Cheung , et al. July 14, 2 | 2009-07-14 |
Synergy Effect of Alloying Materials in Interconnect Structures
App 20090152722 - Chang; Hui-Lin ; et al. | 2009-06-18 |
Selective Formation of Boron-Containing Metal Cap Pre-layer
App 20090014877 - Chang; Hui-Lin ; et al. | 2009-01-15 |
Method for improving a semiconductor device delamination resistance
Grant 7,456,093 - Chen , et al. November 25, 2 | 2008-11-25 |
Self-aligned Dielectric Cap
App 20080280449 - Chang; Huilin ; et al. | 2008-11-13 |
Metal structure with sidewall passivation and method
Grant 7,446,047 - Tsai , et al. November 4, 2 | 2008-11-04 |
Carbonization of metal caps
App 20080251928 - Chang; Hui-Lin ; et al. | 2008-10-16 |
Interconnect Structures for Semiconductor Devices
App 20080233745 - Chang; Hui-Lin ; et al. | 2008-09-25 |
Method for enhancing adhesion between layers
App 20080233765 - Ko; Chung-Chi ; et al. | 2008-09-25 |
Apparatus for wire bonding and integrated circuit chip package
App 20080197461 - Yu; Chen-Hua ; et al. | 2008-08-21 |
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip
Grant 7,405,481 - Lin , et al. July 29, 2 | 2008-07-29 |
Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio
App 20080171431 - Yu; Chen-Hua ; et al. | 2008-07-17 |
Method for modulating stresses of a contact etch stop layer
App 20080085607 - Yu; Chen-Hua ; et al. | 2008-04-10 |
Methods for improving uniformity of cap layers
App 20080032472 - Yu; Chen-Hua ; et al. | 2008-02-07 |
Semiconductor device and fabrication method thereof
Grant 7,312,531 - Chang , et al. December 25, 2 | 2007-12-25 |
Formation and applications of nitrogen-free silicon carbide in semiconductor manufacturing
App 20070264843 - Li; Lih-Ping ; et al. | 2007-11-15 |
Method Of Fabricating An Interconnect Structure
App 20070249164 - Chen; Pi-Tsung ; et al. | 2007-10-25 |
Interconnect structure having a silicide/germanide cap layer
App 20070228571 - Yu; Chen-Hua ; et al. | 2007-10-04 |
Carbon and nitrogen based cap materials for metal hard mask scheme
App 20070205507 - Chang; Hui-Lin ; et al. | 2007-09-06 |
Copper damascene integration scheme for improved barrier layers
Grant 7,259,090 - Wu , et al. August 21, 2 | 2007-08-21 |
Method of fabricating semiconductor device
Grant 7,256,124 - Lin , et al. August 14, 2 | 2007-08-14 |
Copper interconnects
Grant 7,253,524 - Wu , et al. August 7, 2 | 2007-08-07 |
Semiconductor devices with composite etch stop layers and methods of fabrication thereof
Grant 7,250,364 - Lu , et al. July 31, 2 | 2007-07-31 |
Method for planarizing semiconductor structures
Grant 7,247,571 - Chen , et al. July 24, 2 | 2007-07-24 |
Integration film scheme for copper / low-k interconnect
Grant 7,244,673 - Huang , et al. July 17, 2 | 2007-07-17 |
WAT process to avoid wiring defects
Grant 7,220,677 - Li , et al. May 22, 2 | 2007-05-22 |
Post-ESL porogen burn-out for copper ELK integration
Grant 7,217,648 - Lu , et al. May 15, 2 | 2007-05-15 |
Semiconductor device and fabrication method thereof
App 20070096326 - Chang; Hui-Lin ; et al. | 2007-05-03 |
Bond pads and methods for fabricating the same
App 20070080460 - Yu; Chen-Hua ; et al. | 2007-04-12 |
Method for planarizing semiconductor structures
App 20070054494 - Chen; Ying-Tsung ; et al. | 2007-03-08 |
Semiconductor device including I/O oxide and nitrided core oxide on substrate, and method of manufacture
App 20070013009 - Wu; Zhen-Cheng ; et al. | 2007-01-18 |
Method of depositing low k films
Grant 7,160,821 - Huang , et al. January 9, 2 | 2007-01-09 |
Interconnects with harmonized stress and methods for fabricating the same
App 20060276027 - Lu; Yung-Cheng ; et al. | 2006-12-07 |
Method for forming a multi-layer low-K dual damascene
Grant 7,129,164 - Chang , et al. October 31, 2 | 2006-10-31 |
WAT process to avoid wiring defects
App 20060234403 - Li; Lin-Ping ; et al. | 2006-10-19 |
Heat sink and the method for making the same
App 20060232941 - Huang; Chi-Wei ; et al. | 2006-10-19 |
Semiconductor device and fabricating method thereof
App 20060226549 - Yu; Chen-Hua ; et al. | 2006-10-12 |
Method of fabricating semiconductor device
App 20060228856 - Lin; Keng-Chu ; et al. | 2006-10-12 |
Metal structure with sidewall passivation and method
App 20060189143 - Tsai; Minghsing ; et al. | 2006-08-24 |
Dual damascene method for ultra low K dielectrics
Grant 7,094,683 - Yeh , et al. August 22, 2 | 2006-08-22 |
Method of decreasing the k value in sioc layer deposited by chemical vapor deposition
Grant 7,074,708 - Gaillard , et al. July 11, 2 | 2006-07-11 |
Process for improving dielectric properties in low-k organosilicate dielectric material
Grant 7,074,727 - Hsu , et al. July 11, 2 | 2006-07-11 |
Impurity doped UV protection layer
App 20060145303 - Wu; Zhen-Cheng ; et al. | 2006-07-06 |
Integrated treatment method for obtaining robust low dielectric constant materials
Grant 7,071,093 - Liang , et al. July 4, 2 | 2006-07-04 |
Post-ESL porogen burn-out for copper ELK integration
App 20060134906 - Lu; Yung-Cheng ; et al. | 2006-06-22 |
Back end of line integration scheme
App 20060125102 - Wu; Zhen-Cheng ; et al. | 2006-06-15 |
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip
App 20060118921 - Lin; Keng-Chu ; et al. | 2006-06-08 |
Methods and Structures to Produce a Strain-Inducing Layer in a Semiconductor Device
App 20060118892 - Wu; Zhen-Cheng ; et al. | 2006-06-08 |
Method of forming copper interconnects
Grant 7,056,826 - Wu , et al. June 6, 2 | 2006-06-06 |
Semiconductor devices with composite etch stop layers and methods of fabrication thereof
App 20060110912 - Lu; Yung-Cheng ; et al. | 2006-05-25 |
Method for forming a multi-layer low-K dual damascene
App 20060084279 - Chang; Hui Lin ; et al. | 2006-04-20 |
Metallization layers for crack prevention and reduced capacitance
App 20060027924 - Chen; Pi-Tsung ; et al. | 2006-02-09 |
Method for improving a semiconductor device delamination resistance
App 20060003572 - Chen; Pi-Tsung ; et al. | 2006-01-05 |
Method of depositing low k films
App 20050260864 - Huang, Tzu-Fang ; et al. | 2005-11-24 |
Copper damascene integration scheme for improved barrier layers
App 20050245071 - Wu, Zhen-Cheng ; et al. | 2005-11-03 |
Insulating layer having graded densification
Grant 6,958,524 - Li , et al. October 25, 2 | 2005-10-25 |
Integrated treatment method for obtaining robust low dielectric constant materials
App 20050215052 - Liang, Mong-Song ; et al. | 2005-09-29 |
Plasma processes for depositing low dielectric constant films
App 20050191846 - Cheung, David ; et al. | 2005-09-01 |
Plasma processes for depositing low dielectric constant films
Grant 6,930,061 - Cheung , et al. August 16, 2 | 2005-08-16 |
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds
App 20050156317 - Yau, Wai-Fan ; et al. | 2005-07-21 |
Heterogeneous low k dielectric
App 20050140029 - Li, Lih-Ping ; et al. | 2005-06-30 |
Copper interconnects
App 20050110153 - Wu, Zhen-Cheng ; et al. | 2005-05-26 |
Integration film scheme for copper / low-k interconnect
App 20050098896 - Huang, Tai-Chun ; et al. | 2005-05-12 |
Insulating layer having graded densification
App 20050101119 - Li, Lih-Ping ; et al. | 2005-05-12 |
Plasma processes for depositing low dielectric constant films
Grant 6,869,896 - Cheung , et al. March 22, 2 | 2005-03-22 |
Method for ultra low-K dielectric deposition
App 20050048795 - Ko, Chung-Chi ; et al. | 2005-03-03 |
Dual damascene method for ultra low K dielectrics
App 20050032355 - Yeh, Chen-Nan ; et al. | 2005-02-10 |
Process for improving dielectric properties in low-k organosilicate dielectric material
App 20050010000 - Hsu, Peng-Fu ; et al. | 2005-01-13 |
Method of depositing low K films
Grant 6,806,207 - Huang , et al. October 19, 2 | 2004-10-19 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
Grant 6,784,119 - Gaillard , et al. August 31, 2 | 2004-08-31 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
App 20040166665 - Gaillard, Frederic ; et al. | 2004-08-26 |
Method of forming copper interconnects
App 20040130035 - Wu, Zhen-Cheng ; et al. | 2004-07-08 |
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant
Grant 6,756,321 - Ko , et al. June 29, 2 | 2004-06-29 |
Structure for improving interlevel conductor connections
Grant 6,753,607 - Wu , et al. June 22, 2 | 2004-06-22 |
Method of improving moisture resistance of low dielectric constant films
Grant 6,743,737 - Yau , et al. June 1, 2 | 2004-06-01 |
Plasma processes for depositing low dielectric constant films
Grant 6,734,115 - Cheung , et al. May 11, 2 | 2004-05-11 |
Plasma processes for depositing low dielectric constant films
App 20040082199 - Cheung, David ; et al. | 2004-04-29 |
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant
App 20040067658 - Ko, Chung-Chi ; et al. | 2004-04-08 |
Plasma processes for depositing low dielectric constant films
App 20040038545 - Cheung, David ; et al. | 2004-02-26 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
App 20040029400 - Gaillard, Frederic ; et al. | 2004-02-12 |
Plasma processes for depositing low dielectric constant films
Grant 6,660,656 - Cheung , et al. December 9, 2 | 2003-12-09 |
Method of depositing low dielectric constant carbon doped silicon oxide
Grant 6,632,735 - Yau , et al. October 14, 2 | 2003-10-14 |
Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
Grant 6,627,532 - Gaillard , et al. September 30, 2 | 2003-09-30 |
Method of depositing low K films
App 20030162410 - Huang, Tzu-Fang ; et al. | 2003-08-28 |
Method for forming low dielectric constant damascene structure while employing carbon doped silicon oxide planarizing stop layer
Grant 6,602,779 - Li , et al. August 5, 2 | 2003-08-05 |
Method for protecting sidewalls of etched openings to prevent via poisoning
Grant 6,602,780 - Shih , et al. August 5, 2 | 2003-08-05 |
Plasma processes for depositing low dielectric constant films
Grant 6,596,655 - Cheung , et al. July 22, 2 | 2003-07-22 |
Method of depositing low k films using an oxidizing plasma
Grant 6,593,247 - Huang , et al. July 15, 2 | 2003-07-15 |
Plasma processes for depositing low dielectric constant films
Grant 6,562,690 - Cheung , et al. May 13, 2 | 2003-05-13 |
Plasma processes for depositing low dielectric constant films
App 20030064610 - Cheung, David ; et al. | 2003-04-03 |
Plasma processes for depositing low dielectric constant films
Grant 6,541,282 - Cheung , et al. April 1, 2 | 2003-04-01 |
Method of improving moisture resistance of low dielectric constant films
App 20030054667 - Yau, Wai-Fan ; et al. | 2003-03-20 |
Method for protecting sidewalls of etched openings to prevent via poisoning
App 20030045124 - Shih, Tsu ; et al. | 2003-03-06 |
Method of depositing low dielectric constant carbon doped silicon oxide
App 20030032305 - Yau, Wai-Fan ; et al. | 2003-02-13 |
Method of improving moisture resistance of low dielectric constant films
Grant 6,448,187 - Yau , et al. September 10, 2 | 2002-09-10 |
Method for actuating network linking to internet from distant end
App 20020083180 - Lu, Yung-Cheng | 2002-06-27 |
Plasma processes for depositing low dielectric constant films
App 20020045361 - Cheung, David ; et al. | 2002-04-18 |
Plasma processes for depositing low dielectric constant films
Grant 6,348,725 - Cheung , et al. February 19, 2 | 2002-02-19 |
Plasma processes for depositing low dielectric constant films
Grant 6,303,523 - Cheung , et al. October 16, 2 | 2001-10-16 |
Method of improving moisture resistance of low dielectric constant films
App 20010026849 - Yau, Wai-Fan ; et al. | 2001-10-04 |
Plasma Processes For Depositing Low Dielectric Constant Films
App 20010005546 - CHEUNG, DAVID ; et al. | 2001-06-28 |
Plasma Processes For Depositing Low Dielectric Constant Films
App 20010004479 - CHEUNG, DAVID ; et al. | 2001-06-21 |
Method of improving moisture resistance of low dielectric constant films
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