LU; Yuhua

Patent Applications and Registrations

Patent applications and USPTO patent grants for LU; Yuhua.The latest application filed is for "apparatus and method for preparing glow discharge sputtering samples for material microscopic characterization".

Company Profile

6.3.7

LU; Yuhua - Beijing CN
Lu; Yuhua - Hollis NH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus And Method For Preparing Glow Discharge Sputtering Samples For Material Microscopic Characterization App 20220205922 - YU; Xing ; et al.	2022-06-30
Provisioning Virtual Machines With A Single Identity And Cache Virtual Disk App 20210406186 - Lu; Yuhua ; et al.	2021-12-30
Provisioning virtual machines with a single identity and cache virtual disk Grant 11,163,687 - Lu , et al. November 2, 2	2021-11-02
Secure Fast Reboot Of A Virtual Machine App 20210303469 - Lu; Yuhua ; et al.	2021-09-30
Provisioning Virtual Machines with a Single Identity and Cache Virtual Disk App 20210117330 - Lu; Yuhua ; et al.	2021-04-22
FULL-VIEW-FIELD QUANTITATIVE STATISTICAL DISTRIBUTION REPRESENTATION METHOD FOR MICROSTRUCTURES of y' PHASES IN METAL MATERIAL App 20210033549 - Wan; Weihao ; et al.	2021-02-04
Full-view-field quantitative statistical distribution characterization method of precipitate particles in metal material Grant 10,895,521 - Li , et al. January 19, 2	2021-01-19
Apparatus and method for large-scale high throughput quantitative characterization and three-dimensional reconstruction of material structure Grant 10,804,073 - Wang , et al. October 13, 2	2020-10-13
Apparatus And Method For Large-scale High Throughput Quantitative Characterization And Three-dimensional Reconstruction Of Material Structure App 20200294760 - WANG; Haizhou ; et al.	2020-09-17
Full-view-field Quantitative Statistical Distribution Characterization Method Of Precipitate Particles In Metal Material App 20190204199 - LI; Dongling ; et al.	2019-07-04

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