Lu; Yong Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Yong Feng.The latest application filed is for "method and apparatus for providing ablation-free laser marking on hard disk media".

Company Profile

0.9.5

Lu; Yong Feng - Singapore SG
Lu; Yong Feng - Lincoln NE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for deflashing of integrated circuit packages Grant 7,170,029 - Song , et al. January 30, 2	2007-01-30
Method and apparatus for decapping integrated circuit packages Grant 6,917,011 - Hong , et al. July 12, 2	2005-07-12
Method of multiple pulse laser annealing to activate ultra-shallow junctions Grant 6,897,118 - Poon , et al. May 24, 2	2005-05-24
Method and apparatus for deflashing of integrated circuit packages Grant 6,838,637 - Song , et al. January 4, 2	2005-01-04
Method of patterning a substrate Grant 6,835,319 - Song , et al. December 28, 2	2004-12-28
Method and apparatus for providing ablation-free laser marking on hard disk media App 20030127439 - Wee, Teng Soon ; et al.	2003-07-10
Method and apparatus for removal of mold flash Grant 6,576,867 - Lu , et al. June 10, 2	2003-06-10
Method of patterning a substrate App 20030080089 - Song, Wen Dong ; et al.	2003-05-01
Method and apparatus for deflashing of integrated circuit packages App 20030062347 - Song, Wen Dong ; et al.	2003-04-03
Method and apparatus for providing ablation-free laser marking on hard disk media Grant 6,518,540 - Wee , et al. February 11, 2	2003-02-11
Method and apparatus for decapping integrated circuit packages App 20030010761 - Hong, Ming Hui ; et al.	2003-01-16
Flat panel display and method of manufacture App 20030001457 - Wang, Weijie ; et al.	2003-01-02
Pulsed laser salicidation for fabrication of ultra-thin silicides in sub-quarter micron devices Grant 6,156,654 - Ho , et al. December 5, 2	2000-12-05
Pulse laser induced removal of mold flash on integrated circuit packages Grant 5,961,860 - Lu , et al. October 5, 1	1999-10-05

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