Lu; Yen-Tien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Yen-Tien.The latest application filed is for "method for patterning a dielectric layer".

Company Profile

8.5.12

Lu; Yen-Tien - Albany NY
Lu; Yen-Tien - Hillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Patterning A Dielectric Layer App 20220293419 - Lu; Yen-Tien ; et al.	2022-09-15
Radiation of Substrates During Processing and Systems Thereof App 20220189764 - Edley; Michael ; et al.	2022-06-16
Radiation of substrates during processing and systems thereof Grant 11,289,325 - Edley , et al. March 29, 2	2022-03-29
Ald (atomic Layer Deposition) Liner For Via Profile Control And Related Applications App 20220020642 - Sun; Xinghua ; et al.	2022-01-20
Radiation of Substrates During Processing and Systems Thereof App 20210407790 - Edley; Michael ; et al.	2021-12-30
ALD (atomic layer deposition) liner for via profile control and related applications Grant 11,164,781 - Sun , et al. November 2, 2	2021-11-02
High aspect ratio via etch using atomic layer deposition protection layer Grant 11,121,027 - Lu , et al. September 14, 2	2021-09-14
Dielectric Etch Stop Layer For Reactive Ion Etch (rie) Lag Reduction And Chamfer Corner Protection App 20210265205 - Lu; Yen-Tien ; et al.	2021-08-26
Selective Deposition Of Conductive Cap For Fully-aligned-via (fav) App 20210242074 - Lu; Yen-Tien ; et al.	2021-08-05
Split Ash Processes For Via Formation To Suppress Damage To Low-k Layers App 20210151350 - Lu; Yen-Tien ; et al.	2021-05-20
Atomic layer deposition for low-K trench protection during etch Grant 10,964,587 - Lu , et al. March 30, 2	2021-03-30
Metal hard mask layers for processing of microelectronic workpieces Grant 10,950,444 - Lu , et al. March 16, 2	2021-03-16
Method For Using Ultra Thin Ruthenium Metal Hard Mask For Etching Profile Control App 20210028017 - Lu; Yen-Tien ; et al.	2021-01-28
Ald (atomic Layer Deposition) Liner For Via Profile Control And Related Applications App 20200051859 - Sun; Xinghua ; et al.	2020-02-13
Atomic Layer Deposition For Low-K Trench Protection During Etch App 20190355617 - O'Meara; David ; et al.	2019-11-21
Metal Hard Mask Layers For Processing Of Microelectronic Workpieces App 20190237331 - Lu; Yen-Tien ; et al.	2019-08-01
High Aspect Ratio Via Etch Using Atomic Layer Deposition Protection Layer App 20190181041 - Lu; Yen-Tien ; et al.	2019-06-13

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