loadpatents
Patent applications and USPTO patent grants for LU; Weng-Jung.The latest application filed is for "method of die bonding and apparatus thereof".
Patent | Date |
---|---|
Method Of Die Bonding And Apparatus Thereof App 20140102616 - LU; Weng-Jung ;   et al. | 2014-04-17 |
Led Module And Packaging Method Thereof App 20130005055 - Lin; Jian-Shian ;   et al. | 2013-01-03 |
LED module and packaging method thereof Grant 8,235,551 - Lin , et al. August 7, 2 | 2012-08-07 |
Robotic vacuum cleaner Grant 7,861,365 - Sun , et al. January 4, 2 | 2011-01-04 |
Led Module And Packaging Method Thereof App 20100157595 - Lin; Jian-Shian ;   et al. | 2010-06-24 |
Robotic Vacuum Cleaner App 20080066257 - Sun; Yann-Shuoh ;   et al. | 2008-03-20 |
Ejector with multi-ejection pins Grant 7,198,479 - Lu , et al. April 3, 2 | 2007-04-03 |
Ejector with multi-ejection pins App 20060093698 - Lu; Weng-Jung ;   et al. | 2006-05-04 |
Tray-positioning device Grant 6,626,280 - Lu , et al. September 30, 2 | 2003-09-30 |
Air-suspended die sorter App 20030015459 - Lu, Weng-Jung ;   et al. | 2003-01-23 |
Device For Fast Taking Out And Putting In App 20020189380 - Lu, Weng-Jung ;   et al. | 2002-12-19 |
Tray-positioning device App 20020179408 - Lu, Weng-Jung ;   et al. | 2002-12-05 |
Tray input-output module App 20020182051 - Lu, Weng-Jung ;   et al. | 2002-12-05 |
Automatic ball placing device Grant 5,704,536 - Chen , et al. January 6, 1 | 1998-01-06 |
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