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name:-0.0065770149230957
name:-0.0006110668182373
LU; Weng-Jung Patent Filings

LU; Weng-Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for LU; Weng-Jung.The latest application filed is for "method of die bonding and apparatus thereof".

Company Profile
0.5.9
  • LU; Weng-Jung - Hsinchu City TW
  • Lu; Weng-Jung - Hsinchu TW
  • Lu; Weng-Jung - Hisinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method Of Die Bonding And Apparatus Thereof
App 20140102616 - LU; Weng-Jung ;   et al.
2014-04-17
Led Module And Packaging Method Thereof
App 20130005055 - Lin; Jian-Shian ;   et al.
2013-01-03
LED module and packaging method thereof
Grant 8,235,551 - Lin , et al. August 7, 2
2012-08-07
Robotic vacuum cleaner
Grant 7,861,365 - Sun , et al. January 4, 2
2011-01-04
Led Module And Packaging Method Thereof
App 20100157595 - Lin; Jian-Shian ;   et al.
2010-06-24
Robotic Vacuum Cleaner
App 20080066257 - Sun; Yann-Shuoh ;   et al.
2008-03-20
Ejector with multi-ejection pins
Grant 7,198,479 - Lu , et al. April 3, 2
2007-04-03
Ejector with multi-ejection pins
App 20060093698 - Lu; Weng-Jung ;   et al.
2006-05-04
Tray-positioning device
Grant 6,626,280 - Lu , et al. September 30, 2
2003-09-30
Air-suspended die sorter
App 20030015459 - Lu, Weng-Jung ;   et al.
2003-01-23
Device For Fast Taking Out And Putting In
App 20020189380 - Lu, Weng-Jung ;   et al.
2002-12-19
Tray-positioning device
App 20020179408 - Lu, Weng-Jung ;   et al.
2002-12-05
Tray input-output module
App 20020182051 - Lu, Weng-Jung ;   et al.
2002-12-05
Automatic ball placing device
Grant 5,704,536 - Chen , et al. January 6, 1
1998-01-06

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