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Lu; Tseng-Fu Patent Filings

Lu; Tseng-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Tseng-Fu.The latest application filed is for "semiconductor device having reduced contact resistance between access transistors and conductive features and method of manufacturing the same".

Company Profile
27.22.28
  • Lu; Tseng-Fu - New Taipei TW
  • Lu; Tseng-Fu - New Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device with T-shaped buried gate electrode and method for forming the same
Grant 11,437,481 - Huang , et al. September 6, 2
2022-09-06
Semiconductor structure having buried gate electrode with protruding member and method of manufacturing the same
Grant 11,417,744 - Lu August 16, 2
2022-08-16
Semiconductor Device Having Reduced Contact Resistance Between Access Transistors And Conductive Features And Method Of Manufacturing The Same
App 20220157824 - Lu; Tseng-Fu
2022-05-19
Method Of Manufacturing Semiconductor Device Having Reduced Contact Resistance Between Access Transistors And Conductive Features
App 20220157825 - LU; TSENG-FU
2022-05-19
Semiconductor structure with buried power line and buried signal line and method for manufacturing the same
Grant 11,315,928 - Shih , et al. April 26, 2
2022-04-26
Method Of Fabricating Semiconductor Structure
App 20220102484 - HUANG; Ching-Chia ;   et al.
2022-03-31
Semiconductor Structure Having Buried Gate Electrode With Protruding Member And Method Of Manufacturing The Same
App 20220093759 - LU; Tseng-Fu
2022-03-24
Method For Preparing Semiconductor Structure Having Buried Gate Electrode With Protruding Member
App 20220093760 - LU; TSENG-FU
2022-03-24
Method For Preparing Semiconductor Device With T-shaped Buried Gate Electrode
App 20220085180 - HUANG; CHING-CHIA ;   et al.
2022-03-17
Method For Manufacturing Semiconductor Structure With Buried Power Line And Buried Signal Line
App 20220077148 - SHIH; CHIANG-LIN ;   et al.
2022-03-10
Semiconductor Structure With Buried Power Line And Buried Signal Line And Method For Manufacturing The Same
App 20220077147 - SHIH; CHIANG-LIN ;   et al.
2022-03-10
Semiconductor Device With T-shaped Buried Gate Electrode And Method For Forming The Same
App 20210408251 - HUANG; CHING-CHIA ;   et al.
2021-12-30
Method Of Forming Semiconductor Structure
App 20210320104 - HUANG; Ching-Chia ;   et al.
2021-10-14
IC package having a metal die for ESP protection
Grant 11,107,807 - Liu , et al. August 31, 2
2021-08-31
IC Package Having a Metal Die for ESD Protection
App 20210257354 - LIU; FANG WEN ;   et al.
2021-08-19
Semiconductor structure having active regions with different dopant concentrations
Grant 11,094,692 - Huang , et al. August 17, 2
2021-08-17
Off chip driver structure
Grant 11,037,921 - Liu , et al. June 15, 2
2021-06-15
Semiconductor Structure And Method Of Forming The Same
App 20210143149 - HUANG; Ching-Chia ;   et al.
2021-05-13
Semiconductor Structure And Fabrication Method Thereof
App 20210126087 - HUANG; Ching-Chia ;   et al.
2021-04-29
Off Chip Driver Structure
App 20210111173 - LIU; Fang-Wen ;   et al.
2021-04-15
Method For Preparing Transistor Device
App 20210082705 - TSAI; JHEN-YU ;   et al.
2021-03-18
Semiconductor device with negative capacitance material in buried channel
Grant 10,937,886 - Huang , et al. March 2, 2
2021-03-02
Transistor device and method for preparing the same
Grant 10,903,080 - Tsai , et al. January 26, 2
2021-01-26
Semiconductor device with undercutted-gate and method of fabricating the same
Grant 10,825,931 - Huang , et al. November 3, 2
2020-11-03
Semiconductor layout structure including asymmetrical channel region
Grant 10,825,898 - Tsai , et al. November 3, 2
2020-11-03
Semiconductor structure and method for preparing the same
Grant 10,818,800 - Hsieh , et al. October 27, 2
2020-10-27
Semiconductor structure
Grant 10,763,212 - Hsieh , et al. Sep
2020-09-01
Semiconductor Device With Negative Capacitance Material In Buried Channel
App 20200185507 - HUANG; Ching-Chia ;   et al.
2020-06-11
Memory Device And Method Of Forming The Same
App 20200176452 - TING; Chen-Lun ;   et al.
2020-06-04
Memory Structure With Non-straight Word Line
App 20200135241 - WANG; Wei-Chih ;   et al.
2020-04-30
Semiconductor Layout Structure Including Asymmetrical Channel Region
App 20200127094 - TSAI; JHEN-YU ;   et al.
2020-04-23
Memory structure with non-straight word line
Grant 10,622,030 - Wang , et al.
2020-04-14
Semiconductor structure for electrostatic discharge protection
Grant 10,580,765 - Liu , et al.
2020-03-03
Transistor Device And Method For Preparing The Same
App 20200066533 - TSAI; JHEN-YU ;   et al.
2020-02-27
Transistor device and semiconductor layout structure including asymmetrical channel region
Grant 10,559,661 - Tsai , et al. Feb
2020-02-11
Semiconductor electrostatic discharge protection device
Grant 10,559,560 - Liu , et al. Feb
2020-02-11
Semiconductor device with undercutted-gate and method of fabricating the same
Grant 10,461,191 - Huang , et al. Oc
2019-10-29
Diode structure and electrostatic discharge protection device including the same
Grant 10,418,356 - Liu , et al. Sept
2019-09-17
Semiconductor Device With Undercutted-gate And Method Of Fabricating The Same
App 20190252549 - HUANG; Ching-Chia ;   et al.
2019-08-15
Semiconductor Device With Undercutted-gate And Method Of Fabricating The Same
App 20190252550 - HUANG; Ching-Chia ;   et al.
2019-08-15
Transistor structure and semiconductor layout structure
Grant 10,381,351 - Huang , et al. A
2019-08-13
Semiconductor Structure And Method For Preparing The Same
App 20190198676 - HSIEH; CHENG-HSIEN ;   et al.
2019-06-27
Transistor Structure And Semiconductor Layout Structure
App 20190198502 - HUANG; CHING-CHIA ;   et al.
2019-06-27
Diode Structure And Electrostatic Discharge Protection Device Including The Same
App 20190198492 - LIU; FANG-WEN ;   et al.
2019-06-27
Transistor Device And Semiconductor Layout Structure
App 20190172909 - TSAI; JHEN-YU ;   et al.
2019-06-06
Semiconductor Electrostatic Discharge Protection Device
App 20190131294 - LIU; Fang-Wen ;   et al.
2019-05-02
Semiconductor electrostatic discharge protection device
Grant 10,242,978 - Liu , et al.
2019-03-26
Surface treatment method by using the NH.sub.3 plasma treatment to modify the sensing thin-film
Grant 8,741,679 - Lai , et al. June 3, 2
2014-06-03
Surface Treatment Method By Using The Nh3 Plasma Treatment To Modify The Sensing Thin-film
App 20120322167 - LAI; Chao-Sung ;   et al.
2012-12-20

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