Lu; Shu-Wan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Shu-Wan.The latest application filed is for "solvent-containing dry film and method for applying the same on a substrate".

Company Profile

0.3.7

Lu; Shu-Wan - Kaohsiung TW
Lu, Shu-Wan - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solvent-containing dry film and method for applying the same on a substrate Grant 10,639,876 - Wu , et al.	2020-05-05
Solvent-containing Dry Film And Method For Applying The Same On A Substrate App 20160017105 - WU; Chung-Jen ; et al.	2016-01-21
Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage Grant 8,101,703 - Wu , et al. January 24, 2	2012-01-24
Precursor Solution For Polyimide/silica Composite Material, Its Manufacture Method, And Polyimide/silica Composite Material Having Low Volume Shrinkage App 20100297455 - WU; Chung-Jen ; et al.	2010-11-25
Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage Grant 7,790,828 - Wu , et al. September 7, 2	2010-09-07
Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage App 20050245715 - Wu, Chung-Jen ; et al.	2005-11-03
Package structure for a multi-chip integrated circuit App 20040183179 - Shieh, Wen-Lo ; et al.	2004-09-23
Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad App 20040082174 - Shieh, Wen-Lo ; et al.	2004-04-29
Fabrication method for solder bump pattern of rear section wafer package App 20040082159 - Shieh, Wen-Lo ; et al.	2004-04-29
Open-type multichips stack packaging App 20030160316 - Shieh, Wen-Lo ; et al.	2003-08-28

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