Lu; Sheng-Li

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Sheng-Li.The latest application filed is for "method of fabricating electronic package".

Company Profile

1.6.9

Lu; Sheng-Li - Taichung TW
Lu; Sheng-Li - Shanghai CN
Lu; Sheng-Li - Taoyuan TW
LU; Sheng-Li - Taoyuan City TW
Lu; Sheng-Li - Taichung Hsien N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating electronic package Grant 10,199,320 - Chiang , et al. Fe	2019-02-05
Direct current to direct current power supply apparatus Grant 9,893,625 - Li , et al. February 13, 2	2018-02-13
Method Of Fabricating Electronic Package App 20180040550 - Chiang; Ching-Wen ; et al.	2018-02-08
Electronic package and method of fabricating the same Grant 9,818,683 - Chiang , et al. November 14, 2	2017-11-14
Isolated power control device, power conversion device and isolated power control method used in power conversion device Grant 9,735,688 - Yang , et al. August 15, 2	2017-08-15
Electronic Package And Method Of Fabricating The Same App 20170148716 - Chiang; Ching-Wen ; et al.	2017-05-25
Electronic Package And Method Of Fabricating The Same App 20170040248 - Chiang; Ching-Wen ; et al.	2017-02-09
Isolated Power Control Device, Power Conversion Device And Isolated Power Control Method Used In Power Conversion Device App 20160105117 - YANG; Zhong-Wang ; et al.	2016-04-14
Direct Current To Direct Current Power Supply Apparatus App 20150303814 - Li; Wen-Hua ; et al.	2015-10-22
Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM Grant 8,970,053 - Wang , et al. March 3, 2	2015-03-03
Semiconductor Package And Fabrication Method Thereof App 20130214310 - Wang; Yuen-Han ; et al.	2013-08-22
Led Chip Structure, Packaging Substrate, Package Structure And Fabrication Method Thereof App 20130175563 - Wang; Yuen-Han ; et al.	2013-07-11

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