loadpatents
name:-0.010807991027832
name:-0.007382869720459
name:-0.0003669261932373
Lu; Sheng Feng Patent Filings

Lu; Sheng Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Sheng Feng.The latest application filed is for "interposer and methods of forming and testing an interposer".

Company Profile
0.6.9
  • Lu; Sheng Feng - Baoshan Township TW
  • Lu; Sheng-Feng - Hsinchu TW
  • Lu; Sheng-Feng - Hsin-Chu TW
  • Lu; Sheng-Feng - Hsin-Chu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Interposer and methods of forming and testing an interposer
Grant 9,601,424 - Agarwal , et al. March 21, 2
2017-03-21
Interposer And Methods Of Forming And Testing An Interposer
App 20160300788 - Agarwal; Rahul ;   et al.
2016-10-13
Batch-test method using a chip tray
Grant 7,915,903 - Lu , et al. March 29, 2
2011-03-29
Chip Test Method
App 20090302875 - Lu; Sheng-Feng ;   et al.
2009-12-10
Wafer level assemble chip multi-site testing solution
Grant 7,595,631 - Lu , et al. September 29, 2
2009-09-29
Fabrication of wafer-level test module for testing image sensor chips
Grant 7,589,033 - Lu , et al. September 15, 2
2009-09-15
Test socket and test board for wafer level semiconductor testing
Grant 7,576,551 - Lu , et al. August 18, 2
2009-08-18
Test socket and test board for wafer level semiconductor testing
App 20090079461 - Lu; Sheng-Feng ;   et al.
2009-03-26
Detector and detecting method
App 20090032681 - Lu; Sheng-Feng ;   et al.
2009-02-05
Wafer-level test module for testing image sensor chips, the related test method and fabrication
App 20080280382 - Lu; Sheng-Feng ;   et al.
2008-11-13
Wafer-level test module for testing image sensor chips, the related test method and fabrication
Grant 7,414,423 - Lu , et al. August 19, 2
2008-08-19
Batch-test system with a chip tray
App 20080169831 - Lu; Sheng-Feng ;   et al.
2008-07-17
Wafer-level test module for testing image sensor chips, the related test method and fabrication
App 20080136434 - Lu; Sheng-Feng ;   et al.
2008-06-12
Probe card for testing image-sensing chips
App 20080122469 - Lu; Sheng-Feng
2008-05-29
Packing member for packing wafer container
App 20070151896 - Lu; Sheng-Feng
2007-07-05

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