Lu; Ming-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Ming-Chen.The latest application filed is for "wafer level chip scale package structure and manufacturing method thereof".

Company Profile

4.36.35

Lu; Ming-Chen - Shanghai CN
Lu; Ming-Chen - Hsinchu City TW
Lu; Ming-Chen - Hsinchu TW
Lu; Ming-Chen - Shangai CN
Lu; Ming-Chen - Songjiang CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer level chip scale package structure and manufacturing method thereof Grant 11,062,969 - Oh , et al. July 13, 2	2021-07-13
Power semiconductor device with small contact footprint and the preparation method Grant 10,504,823 - Gao , et al. Dec	2019-12-10
Wafer Level Chip Scale Package Structure And Manufacturing Method Thereof App 20190157174 - Oh; Cheow Khoon ; et al.	2019-05-23
Wafer level chip scale package structure and manufacturing method thereof Grant 10,242,926 - Oh , et al.	2019-03-26
Manufacturing Method Of Metal-insulator-metal Device App 20180254316 - Tai; Hsin ; et al.	2018-09-06
Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures Grant 10,043,736 - Yilmaz , et al. August 7, 2	2018-08-07
Wafer Level Chip Scale Package Structure And Manufacturing Method Thereof App 20180005912 - Oh; Cheow Khoon ; et al.	2018-01-04
Preparation method of a thin power device Grant 9,854,686 - Gong , et al. December 26, 2	2017-12-26
Power Semiconductor Device With Small Contact Footprint And The Preparation Method App 20170186675 - Gao; Hongtao ; et al.	2017-06-29
Embedded package and method thereof Grant 9,685,430 - Niu , et al. June 20, 2	2017-06-20
Semiconductor package with small gate clip and assembly method Grant 9,679,833 - Xue , et al. June 13, 2	2017-06-13
Semiconductor device with thick bottom metal and preparation method thereof Grant 9,653,383 - Yilmaz , et al. May 16, 2	2017-05-16
Power semiconductor device with small contact footprint and the preparation method Grant 9,646,920 - Gao , et al. May 9, 2	2017-05-09
Semiconductor Package With Small Gate Clip And Assembly Method App 20160379918 - Xue; Yan Xun ; et al.	2016-12-29
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures App 20160315039 - Yilmaz; Hamza ; et al.	2016-10-27
Semiconductor package with small gate clip and assembly method Grant 9,472,491 - Xue , et al. October 18, 2	2016-10-18
Flip chip semiconductor device Grant 9,437,587 - Zhang , et al. September 6, 2	2016-09-06
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures Grant 9,425,181 - Yilmaz , et al. August 23, 2	2016-08-23
Power semiconductor device and the preparation method Grant 9,337,131 - Huo , et al. May 10, 2	2016-05-10
Method Of Fabricating Flash Memory App 20160111343 - Lu; Ming-Chen ; et al.	2016-04-21
Method of fabricating flash memory Grant 9,318,396 - Lu , et al. April 19, 2	2016-04-19
Embedded Package And Method Thereof App 20160099238 - Niu; Zhiqiang ; et al.	2016-04-07
Power Semiconductor Device And The Preparation Method App 20160093560 - Huo; Yan ; et al.	2016-03-31
Semiconductor Package With Small Gate Clip And Assembly Method App 20160093559 - Xue; Yan Xun ; et al.	2016-03-31
Embedded package and method thereof Grant 9,269,699 - Niu , et al. February 23, 2	2016-02-23
Top-exposed semiconductor package and the manufacturing method Grant 9,245,831 - Huo , et al. January 26, 2	2016-01-26
Method of making stacked multi-chip packaging structure Grant 9,230,949 - Zhang , et al. January 5, 2	2016-01-05
Power Semiconductor Device With Small Contact Footprint And The Preparation Method App 20150357268 - Gao; Hongtao ; et al.	2015-12-10
Embedded Package And Method Thereof App 20150325559 - Niu; Zhiqiang ; et al.	2015-11-12
Semiconductor package with small gate clip and assembly method Grant 9,171,788 - Xue , et al. October 27, 2	2015-10-27
Semiconductor Device With Thick Bottom Metal And Preparation Method Thereof App 20150279766 - Yilmaz; Hamza ; et al.	2015-10-01
Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures App 20150236005 - Yilmaz; Hamza ; et al.	2015-08-20
Flip Chip Semiconductor Device App 20150206868 - Zhang; Xiaotian ; et al.	2015-07-23
Semiconductor device with thick bottom metal and preparation method thereof Grant 9,087,828 - Yilmaz , et al. July 21, 2	2015-07-21
Preparation Method Of A Thin Power Device App 20150189764 - Gong; Yuping ; et al.	2015-07-02
Method Of Making Stacked Multi-chip Packaging Structure App 20150179626 - Zhang; Xiaotian ; et al.	2015-06-25
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures Grant 9,054,091 - Yilmaz , et al. June 9, 2	2015-06-09
Stacked multi-chip packaging structure and manufacturing method thereof Grant 9,006,870 - Zhang , et al. April 14, 2	2015-04-14
Thin power device and preparation method thereof Grant 9,006,901 - Gong , et al. April 14, 2	2015-04-14
Stacked multi-chip bottom source semiconductor device and preparation method thereof Grant 8,952,509 - Yilmaz , et al. February 10, 2	2015-02-10
Stacked Multi - Chip Packaging Structure And Manufacturing Method Thereof App 20150035129 - Zhang; Xiaotian ; et al.	2015-02-05
Thin Power Device And Preparation Method Thereof App 20150021780 - Gong; Yuping ; et al.	2015-01-22
Hybrid Packaging Multi-chip Semiconductor Device And Preparation Method Thereof App 20140361420 - Yilmaz; Hamza ; et al.	2014-12-11
Semiconductor Device with Thick Bottom Metal and Preparation Method Thereof App 20140264802 - Yilmaz; Hamza ; et al.	2014-09-18
Copper Wire Bonding Structure In Semiconductor Device And Fabrication Method Thereof App 20140175628 - Pan; Hua ; et al.	2014-06-26
Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Grant 8,703,545 - Niu , et al. April 22, 2	2014-04-22
Flip chip semiconductor device Grant 8,669,650 - Zhang , et al. March 11, 2	2014-03-11
Wafer level package structure and the fabrication method thereof Grant 8,642,385 - Xue , et al. February 4, 2	2014-02-04
Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process Grant 8,563,417 - Lu , et al. October 22, 2	2013-10-22
Aluminum Alloy Lead-frame And Its Use In Fabrication Of Power Semiconductor Package App 20130221507 - Niu; Zhiqiang ; et al.	2013-08-29
Method For Packaging Ultra-thin Chip With Solder Ball Thermo-compression In Wafer Level Packaging Process App 20130130443 - Lu; Jun ; et al.	2013-05-23
Wafer Level Package Structure And The Fabrication Method Thereof App 20130037935 - Xue; Yan Xun ; et al.	2013-02-14
Flip Chip Semiconductor Device App 20120248539 - Zhang; Xiaotian ; et al.	2012-10-04

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