Lu; Jing Ruei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Jing Ruei.The latest application filed is for "carrier tape system and methods of making and using the same".

Company Profile

4.20.21

Lu; Jing Ruei - Taipei TW
Lu; Jing Ruei - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package with redistribution structure Grant 11,417,643 - Liu , et al. August 16, 2	2022-08-16
Package-on-package structure having polymer-based material for warpage control Grant 11,133,285 - Chen , et al. September 28, 2	2021-09-28
Carrier Tape System And Methods Of Making And Using The Same App 20210134635 - Kuo; Chen-Ming ; et al.	2021-05-06
Package Structure And Methods Of Forming The Same App 20200066704 - Liu; Yu-Chih ; et al.	2020-02-27
Methods of forming package-on-package structures Grant 10,515,941 - Liu , et al. Dec	2019-12-24
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20190221544 - Chen; Meng-Tse ; et al.	2019-07-18
Package-on-package structure having polymer-based material for warpage control Grant 10,269,763 - Chen , et al.	2019-04-23
Package Structure and Methods of Forming the Same App 20180122791 - Liu; Yu-Chih ; et al.	2018-05-03
Ring structure for chip packaging Grant 9,887,144 - Lin , et al. February 6, 2	2018-02-06
Packages with Die Stack Including Exposed Molding Underfill App 20180033775 - Liu; Yu-Chih ; et al.	2018-02-01
Package structure and methods of forming the same Grant 9,859,265 - Liu , et al. January 2, 2	2018-01-02
Packages with die stack including exposed molding underfill Grant 9,793,242 - Liu , et al. October 17, 2	2017-10-17
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20170194289 - Chen; Meng-Tse ; et al.	2017-07-06
Flip chip packaging Grant 9,666,556 - Liu , et al. May 30, 2	2017-05-30
Package-on-package structure having polymer-based material for warpage control Grant 9,627,355 - Chen , et al. April 18, 2	2017-04-18
Package on packaging structure and methods of making same Grant 9,583,474 - Lin , et al. February 28, 2	2017-02-28
Flip Chip Packaging App 20160379955 - Liu; Yu-Chih ; et al.	2016-12-29
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20160247782 - Chen; Meng-Tse ; et al.	2016-08-25
Package-on-package structure having polymer-based material for warpage control Grant 9,349,663 - Chen , et al. May 24, 2	2016-05-24
Package Structure and Methods of Forming the Same App 20150357309 - Liu; Yu-Chih ; et al.	2015-12-10
Rotating curing Grant 9,147,584 - Lu , et al. September 29, 2	2015-09-29
Package on Packaging Structure and Methods of Making Same App 20150200190 - Lin; Wen-Yi ; et al.	2015-07-16
Packages with Die Stack Including Exposed Molding Underfill App 20150187734 - Liu; Yu-Chih ; et al.	2015-07-02
Flip-chip BGA assembly process Grant 8,993,378 - Liu , et al. March 31, 2	2015-03-31
Package on packaging structure and methods of making same Grant 8,946,888 - Lin , et al. February 3, 2	2015-02-03
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20140001652 - CHEN; Meng-Tse ; et al.	2014-01-02
Rotating Curing App 20130119565 - Lu; Jing Ruei ; et al.	2013-05-16
Package on Packaging Structure and Methods of Making Same App 20130082372 - Lin; Wen-Yi ; et al.	2013-04-04
Ring Structure For Chip Packaging App 20130062752 - LIN; Wen-Yi ; et al.	2013-03-14
Flip-chip Bga Assembly Process App 20130059416 - LIU; Yu-Chih ; et al.	2013-03-07
Apparatus and methods for semiconductor packages with improved warpage Grant 8,288,208 - Liu , et al. October 16, 2	2012-10-16

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