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Patent applications and USPTO patent grants for Lu; Jhi-Cherng.The latest application filed is for "method for fabricating a semiconductor device".
Patent | Date |
---|---|
Method of temperature determination for deposition reactors Grant 9,011,599 - Lu , et al. April 21, 2 | 2015-04-21 |
Method for fabricating a semiconductor device Grant 8,530,316 - Cheng , et al. September 10, 2 | 2013-09-10 |
Method For Fabricating A Semiconductor Device App 20130122675 - CHENG; Yu-Hung ;   et al. | 2013-05-16 |
Method for fabricating a semiconductor device Grant 8,377,784 - Cheng , et al. February 19, 2 | 2013-02-19 |
Method Of Temperature Determination For Deposition Reactors App 20120012047 - LU; Jhi-Cherng ;   et al. | 2012-01-19 |
Method For Fabricating A Semiconductor Device App 20110263092 - CHENG; Yu-Hung ;   et al. | 2011-10-27 |
FIN-FET device structure formed employing bulk semiconductor substrate Grant 7,663,185 - Chen , et al. February 16, 2 | 2010-02-16 |
STI liner for SOI structure Grant 7,332,777 - Chen , et al. February 19, 2 | 2008-02-19 |
FIN-FET device structure formed employing bulk semiconductor substrate App 20070272954 - Chen; Kuang-Hsin ;   et al. | 2007-11-29 |
Method of forming field effect transistor and structure formed thereby Grant 7,026,196 - Hou , et al. April 11, 2 | 2006-04-11 |
Method and apparatus for real-time control and monitor of deposition processes App 20060049036 - Chang; Cheng-Hung ;   et al. | 2006-03-09 |
STI liner for SOI structure App 20060012004 - Chen; Kuang-Hsin ;   et al. | 2006-01-19 |
STI liner for SOI structure Grant 6,955,955 - Chen , et al. October 18, 2 | 2005-10-18 |
Method of achieving improved STI gap fill with reduced stress App 20050170606 - Fu, Chu-Yun ;   et al. | 2005-08-04 |
Rapid temperature compensation module for semiconductor tool App 20050145614 - Wu, Hsueh-Chang ;   et al. | 2005-07-07 |
STI liner for SOI structure App 20050145937 - Chen, Kuang-Hsin ;   et al. | 2005-07-07 |
Method of forming field effect transistor and structure formed thereby App 20050110086 - Hou, Chuan-Ping ;   et al. | 2005-05-26 |
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