Lu; Hui-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Hui-Chuan.The latest application filed is for "fabrication method of semiconductor package".

Company Profile

3.5.6

Lu; Hui-Chuan - Taichung TW
Lu; Hui-Chuan - Jhongli TW
Lu; Hui-Chuan - Jhongli City TW
Lu; Hui-Chuan - Hsin-Chu TW
Lu; Hui-Chuan - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of semiconductor package Grant 10,811,367 - Lu , et al. October 20, 2	2020-10-20
Fabrication Method Of Semiconductor Package App 20190287928 - Lu; Hui-Chuan ; et al.	2019-09-19
Fabrication method of semiconductor package Grant 10,340,228 - Lu , et al.	2019-07-02
Fabrication Method Of Semiconductor Package App 20180068959 - Lu; Hui-Chuan ; et al.	2018-03-08
Semiconductor package and fabrication method thereof Grant 9,786,610 - Lu , et al. October 10, 2	2017-10-10
Semiconductor Package And Fabrication Method Thereof App 20160141255 - Lu; Hui-Chuan ; et al.	2016-05-19
Method for manufacturing display substrate Grant 7,544,581 - Li , et al. June 9, 2	2009-06-09
Method for manufacturing display substrate App 20090011567 - Li; De-Jiun ; et al.	2009-01-08
Canted-fiber duplex optical assembly App 20070133928 - Ko; Chih-Hsiang ; et al.	2007-06-14
Method for reducing reactive ion etching (RIE) lag in semiconductor fabrication processes Grant 6,900,136 - Chung , et al. May 31, 2	2005-05-31
Method for reducing reactive ion etching (RIE) lag in semiconductor fabrication processes App 20030171000 - Chung, Chen-Kuei ; et al.	2003-09-11

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