Lu; Hsiao-Ling

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Hsiao-Ling.The latest application filed is for "chemical mechanical polishing process for forming shallow trench isolation structure".

Company Profile

0.6.5

Lu; Hsiao-Ling - Jhudong Township Hsinchu County TW
Lu; Hsiao-Ling - Hsin-Chu TW
Lu; Hsiao-Ling - Hsinchu TW
Lu, Hsiao-Ling - Chu-Tung Town TW
Lu; Hsiao-Ling - Taipei Hsien TW
Lu; Hsiao-Ling - Chung Ho TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical polishing process for forming shallow trench isolation structure Grant 7,544,305 - Hsu , et al. June 9, 2	2009-06-09
Chemical Mechanical Polishing Process For Forming Shallow Trench Isolation Structure App 20080029478 - Hsu; Chia-Jung ; et al.	2008-02-07
Chemical mechanical polishing process for forming shallow trench isolation structure Grant 7,294,575 - Hsu , et al. November 13, 2	2007-11-13
Method for preventing edge peeling defect App 20060172526 - Hsu; Chia-Lin ; et al.	2006-08-03
Chemical mechanical polishing process for forming shallow trench isolation structure App 20050148184 - Hsu, Chia-Rung ; et al.	2005-07-07
Method for forming shallow trench isolation structure Grant 6,913,978 - Chen , et al. July 5, 2	2005-07-05
Method for preventing edge peeling defect App 20050085163 - Hsu, Chia-Lin ; et al.	2005-04-21
Polishing pad and method of polishing wafer App 20050054277 - Tsai, Teng-Chun ; et al.	2005-03-10
Ti liner for copper interconnect with low-k dielectric Grant 6,661,097 - Clevenger , et al. December 9, 2	2003-12-09
Method for testing leakage current caused self-aligned silicide Grant 6,249,138 - Huang , et al. June 19, 2	2001-06-19
Method for fabricating semiconductor device Grant 6,140,192 - Huang , et al. October 31, 2	2000-10-31

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