Lu; Gau-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lu; Gau-Ming.The latest application filed is for "method for plasma etching a wafer after backside grinding".
- Lu; Gau-Ming - Taipei TW
- Lu; Gau-Ming - Hsin-Chu TW
| Patent | Date |
|---|---|
| Method for plasma etching a wafer after backside grinding Grant 6,887,793 - Chang , et al. May 3, 2 | 2005-05-03 |
| Photoresist adhesion improvement on metal layer after photoresist rework by extra N2O treatment Grant 6,740,471 - Lu , et al. May 25, 2 | 2004-05-25 |
| Method for plasma etching a wafer after backside grinding App 20030224583 - Chang, Feng-Ru ; et al. | 2003-12-04 |
| Wet dip method for photoresist and polymer stripping without buffer treatment step Grant 6,652,666 - Ma , et al. November 25, 2 | 2003-11-25 |
| Wet dip method for photoresist and polymer stripping without buffer treatment step App 20020162578 - Ma, Ching-Tien ; et al. | 2002-11-07 |
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