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Patent applications and USPTO patent grants for Lu; Er-Wei.The latest application filed is for "heat-dissipating device".
Patent | Date |
---|---|
Evaporation-assisted heat dissipation apparatus Grant 9,171,775 - Zeng , et al. October 27, 2 | 2015-10-27 |
Heat-dissipating device Grant 9,146,060 - Yang , et al. September 29, 2 | 2015-09-29 |
Heat-dissipating Device App 20140338881 - YANG; CHIH-HAO ;   et al. | 2014-11-20 |
Mounting Apparatus For Data Storage Device App 20140183316 - ZENG; XIANG-KUN ;   et al. | 2014-07-03 |
Evaporation-assisted Heat Dissipation Apparatus App 20140144608 - ZENG; XIANG-KUN ;   et al. | 2014-05-29 |
Electronic Device With Spray Type Heat Dissipation Device App 20140138062 - ZENG; XIANG-KUN ;   et al. | 2014-05-22 |
Heat Dissipating Assembly And Electronic Device Assembly With Heat Dissipating Assembly App 20140133102 - LU; ER-WEI ;   et al. | 2014-05-15 |
Circuit Board Assembly App 20140126152 - YANG; CHIH-HAO ;   et al. | 2014-05-08 |
Mounting Apparatus For Data Storage Device App 20140104779 - YANG; CHIH-HAO ;   et al. | 2014-04-17 |
Optical Disk Drive With Storage Device App 20140096151 - YANG; CHIH-HAO ;   et al. | 2014-04-03 |
Electronic Device With Heat Sink App 20130161074 - YANG; CHIH-HAO ;   et al. | 2013-06-27 |
Electronic Device With Heat Dissipating Module App 20130070419 - YANG; CHIH-HAO ;   et al. | 2013-03-21 |
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