Lu; De-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lu; De-Hao.The latest application filed is for "method of packaging a chip and a substrate".
- Lu; De-Hao - Taoyuan County TW
- Lu; De-Hao - Taoyuan TW
| Patent | Date |
|---|---|
| Stacked multilayer structure Grant 9,095,084 - Lin , et al. July 28, 2 | 2015-07-28 |
| Method of manufacturing a stacked multilayer structure Grant 9,095,085 - Lin , et al. July 28, 2 | 2015-07-28 |
| Package structure of a chip and a substrate Grant 8,941,224 - Lin , et al. January 27, 2 | 2015-01-27 |
| Method of manufacturing a chip support board structure Grant 8,887,386 - Lin , et al. November 18, 2 | 2014-11-18 |
| Method of manufacturing a laminate circuit board Grant 8,875,390 - Lin , et al. November 4, 2 | 2014-11-04 |
| Package Structure Of A Chip And A Substrate App 20140291853 - Lin; Ting-Hao ; et al. | 2014-10-02 |
| Stacked Multilayer Structure App 20140290983 - Lin; Ting-Hao ; et al. | 2014-10-02 |
| Method Of Manufacturing A Stacked Multilayer Structure App 20140290057 - Lin; Ting-Hao ; et al. | 2014-10-02 |
| Method Of Packaging A Chip And A Substrate App 20140295623 - Lin; Ting-Hao ; et al. | 2014-10-02 |
| Chip support board structure Grant 8,766,102 - Lin , et al. July 1, 2 | 2014-07-01 |
| Method Of Manufacturing A Laminate Circuit Board App 20140115889 - Lin; Ting-Hao ; et al. | 2014-05-01 |
| Method Of Manufacturing A Chip Support Board Structure App 20140115888 - Lin; Ting-Hao ; et al. | 2014-05-01 |
| Laminate Circuit Board Structure App 20140116755 - Lin; Ting-Hao ; et al. | 2014-05-01 |
| Chip Support Board Structure App 20140116757 - Lin; Ting-Hao ; et al. | 2014-05-01 |
| Method for manufacturing a heat dissipation structure of a printed circuit board Grant 8,312,624 - Chang , et al. November 20, 2 | 2012-11-20 |
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