Lu; Chen-Fa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Chen-Fa.The latest application filed is for "buffer layer(s) on a stacked structure having a via".

Company Profile

8.23.20

Lu; Chen-Fa - Kaohsiung City TW
Lu; Chen-Fa - Kaohsiung TW
- Gangshan Township TW
Lu; Chen-Fa - Gangshan Township N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Buffer Layer(s) on a Stacked Structure Having a Via App 20220189928 - Lu; Chen-Fa ; et al.	2022-06-16
Buffer layer(s) on a stacked structure having a via Grant 11,270,978 - Lu , et al. March 8, 2	2022-03-08
Semiconductor Structure With Ultra Thick Metal And Manufacturing Method Thereof App 20210366828 - LU; CHEN-FA ; et al.	2021-11-25
Semiconductor structure with ultra thick metal and manufacturing method thereof Grant 11,114,378 - Lu , et al. September 7, 2	2021-09-07
Semiconductor structure Grant 10,665,456 - Chou , et al.	2020-05-26
Buffer Layer(s) on a Stacked Structure Having a Via App 20200118977 - Lu; Chen-Fa ; et al.	2020-04-16
System and method to reduce pre-back-grinding process defects Grant 10534353 -	2020-01-14
Buffer layer(s) on a stacked structure having a via Grant 10,510,723 - Lu , et al. Dec	2019-12-17
Semiconductor Structure With Ultra Thick Metal And Manufacturing Method Thereof App 20190252317 - LU; CHEN-FA ; et al.	2019-08-15
Semiconductor structure with ultra thick metal and manufacturing method thereof Grant 10,269,701 - Lu , et al.	2019-04-23
Semiconductor Structure App 20190080907 - CHOU; SHIH-PEI ; et al.	2019-03-14
Stress monitoring device and method of manufacturing the same Grant 10,134,645 - Lu , et al. November 20, 2	2018-11-20
Semiconductor structure and manufacturing method thereof Grant 10,128,113 - Chou , et al. November 13, 2	2018-11-13
Stress Minitoring Device And Method Of Manufacturing The Same App 20180286769 - LU; CHEN-FA ; et al.	2018-10-04
Buffer Layer(s) on a Stacked Structure Having a Via App 20180053748 - Lu; Chen-Fa ; et al.	2018-02-22
Buffer layer(s) on a stacked structure having a via Grant 9,793,243 - Lu , et al. October 17, 2	2017-10-17
Semiconductor Structure And Manufacturing Method Thereof App 20170200640 - Chou; Shih-Pei ; et al.	2017-07-13
Semiconductor Structure With Ultra Thick Metal And Manufacturing Method Thereof App 20170098606 - LU; CHEN-FA ; et al.	2017-04-06
Method and apparatus to protect a wafer edge Grant 9,508,659 - Lu , et al. November 29, 2	2016-11-29
Plasma treatment for semiconductor devices Grant 9,418,955 - Lu , et al. August 16, 2	2016-08-16
Buffer Layer(s) On A Stacked Structure Having A Via App 20160049384 - Lu; Chen-Fa ; et al.	2016-02-18
Bonded Wafer Edge Protection Scheme App 20150001681 - Lu; Chen-Fa ; et al.	2015-01-01
Plasma Treatment for Semiconductor Devices App 20140131861 - Lu; Chen-Fa ; et al.	2014-05-15
Bump structure with barrier layer on post-passivation interconnect Grant 8,716,858 - Lu , et al. May 6, 2	2014-05-06
UV exposure method for reducing residue in de-taping process Grant 8,710,458 - Hu , et al. April 29, 2	2014-04-29
System And Method To Reduce Pre-back-grinding Process Defects App 20140039661 - LU; Chen-Fa ; et al.	2014-02-06
Method for wafer back-grinding control Grant 8,636,559 - Lu , et al. January 28, 2	2014-01-28
Plasma treatment for semiconductor devices Grant 8,629,053 - Lu , et al. January 14, 2	2014-01-14
System and method to reduce pre-back-grinding process defects Grant 8,571,699 - Lu , et al. October 29, 2	2013-10-29
Method For Wafer Back-grinding Control App 20130011937 - LU; Chen-Fa ; et al.	2013-01-10
Bump Structure With Barrier Layer On Post-passivation Interconnect App 20120326298 - LU; Chen-Fa ; et al.	2012-12-27
System and method for wafer back-grinding control Grant 8,298,041 - Lu , et al. October 30, 2	2012-10-30
UV Exposure Method for Reducing Residue in De-Taping Process App 20120091367 - Hu; Yu-Hsiang ; et al.	2012-04-19
System And Method For Wafer Back-grinding Control App 20120088316 - LU; Chen-Fa ; et al.	2012-04-12
System And Method To Reduce Pre-back-grinding Process Defects App 20120065764 - LU; Chen-FA ; et al.	2012-03-15
Flip Chip Substrate Package Assembly and Process for Making Same App 20120032337 - Lu; Chen-Fa ; et al.	2012-02-09
Plasma Treatment for Semiconductor Devices App 20110309490 - Lu; Chen-Fa ; et al.	2011-12-22
Method for preventing Cu CMP corrosion Grant 6,555,477 - Lu , et al. April 29, 2	2003-04-29
Method for a copper CMP endpoint detection system Grant 6,517,413 - Hu , et al. February 11, 2	2003-02-11

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.