loadpatents
Patent applications and USPTO patent grants for Lu; Charng-Shing.The latest application filed is for "polyimide film laminate and metal laminate employing the same".
Patent | Date |
---|---|
Polyamic acid resin composition and method for forming polyimide resin Grant 9,051,429 - Chang , et al. June 9, 2 | 2015-06-09 |
Polyimide film laminate and metal laminate employing the same Grant 8,652,622 - Lu , et al. February 18, 2 | 2014-02-18 |
Polyimide Film Laminate And Metal Laminate Employing The Same App 20120156459 - Lu; Charng-Shing ;   et al. | 2012-06-21 |
Double-sided metal clad laminate and fabrication method thereof Grant 8,101,038 - Lu , et al. January 24, 2 | 2012-01-24 |
Polyamic Acid Resin Composition And Polyimide Film Prepared Therefrom App 20110091732 - Lu; Charng-Shing ;   et al. | 2011-04-21 |
Polyamic Acid Resin Composition And Method For Forming Polyimide Resin App 20110054124 - Chang; Li-Ming ;   et al. | 2011-03-03 |
Double-sided Metal Clad Laminate And Fabrication Method Thereof App 20100035066 - Lu; Charng-Shing ;   et al. | 2010-02-11 |
Thermoplastic polyimide composition Grant 7,459,518 - Shih , et al. December 2, 2 | 2008-12-02 |
Negative photoresist composition Grant 7,374,861 - Jeng , et al. May 20, 2 | 2008-05-20 |
Thermoplastic polyimide composition App 20070276086 - Shih; Shu-Chu ;   et al. | 2007-11-29 |
Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same App 20070166535 - Lu; Charng-Shing ;   et al. | 2007-07-19 |
Negative photoresist composition App 20070141509 - Jeng; Jyh-Long ;   et al. | 2007-06-21 |
Coating composition of positive photosensitive polyimide App 20050282958 - Jeng, Jyh-Long ;   et al. | 2005-12-22 |
Ink jet printing medium Grant 5,928,789 - Chen , et al. July 27, 1 | 1999-07-27 |
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