loadpatents
name:-0.0052700042724609
name:-0.021876096725464
name:-0.0010979175567627
Lowry; Robert K. Patent Filings

Lowry; Robert K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lowry; Robert K..The latest application filed is for "hydrophobic circuit board coating of electrotransport drug delivery devices".

Company Profile
0.16.3
  • Lowry; Robert K. - Indialantic FL US
  • Lowry; Robert K. - Melbourne Beach FL
  • Lowry; Robert K. - Melbourne FL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser decapsulation method
Grant RE43,980 - Lowry February 5, 2
2013-02-05
Laser decapsulation method
Grant RE42,193 - Lowry March 1, 2
2011-03-01
Hydrophobic Circuit Board Coating of Electrotransport Drug Delivery Devices
App 20100004583 - Panos; Rodney M. ;   et al.
2010-01-07
Laser decapsulation method
Grant 7,316,936 - Lowry January 8, 2
2008-01-08
Laser Decapsulation Apparatus And Method
App 20070111337 - Lowry; Robert K.
2007-05-17
Laser decapsulation apparatus and method
Grant 7,166,186 - Lowry January 23, 2
2007-01-23
Bonded wafer with metal silicidation
Grant 6,909,146 - Linn , et al. June 21, 2
2005-06-21
Laser decapsulation apparatus and method
App 20020025600 - Lowry, Robert K.
2002-02-28
Laser decapsulation method
Grant 6,335,208 - Lowry January 1, 2
2002-01-01
Radiation hardened dielectric for EEPROM
Grant 6,130,172 - Fuller , et al. October 10, 2
2000-10-10
Bonded wafer processing with oxidative bonding
Grant 5,849,627 - Linn , et al. December 15, 1
1998-12-15
Bonded wafer processing
Grant 5,728,624 - Linn , et al. March 17, 1
1998-03-17
Bonded wafer processing with metal silicidation
Grant 5,569,620 - Linn , et al. October 29, 1
1996-10-29
Bonded wafer processing
Grant 5,517,047 - Linn , et al. May 14, 1
1996-05-14
Bonded wafer processing with metal silicidation
Grant 5,387,555 - Linn , et al. February 7, 1
1995-02-07
Bonded wafer processing
Grant 5,362,667 - Linn , et al. November 8, 1
1994-11-08
Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions
Grant 4,781,853 - Lowry , et al. November 1, 1
1988-11-01
Method and means for measuring moisture content of hermetic semiconductor devices
Grant 4,272,986 - Lowry , et al. June 16, 1
1981-06-16

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