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Patent applications and USPTO patent grants for Lowry; Robert K..The latest application filed is for "hydrophobic circuit board coating of electrotransport drug delivery devices".
Patent | Date |
---|---|
Laser decapsulation method Grant RE43,980 - Lowry February 5, 2 | 2013-02-05 |
Laser decapsulation method Grant RE42,193 - Lowry March 1, 2 | 2011-03-01 |
Hydrophobic Circuit Board Coating of Electrotransport Drug Delivery Devices App 20100004583 - Panos; Rodney M. ;   et al. | 2010-01-07 |
Laser decapsulation method Grant 7,316,936 - Lowry January 8, 2 | 2008-01-08 |
Laser Decapsulation Apparatus And Method App 20070111337 - Lowry; Robert K. | 2007-05-17 |
Laser decapsulation apparatus and method Grant 7,166,186 - Lowry January 23, 2 | 2007-01-23 |
Bonded wafer with metal silicidation Grant 6,909,146 - Linn , et al. June 21, 2 | 2005-06-21 |
Laser decapsulation apparatus and method App 20020025600 - Lowry, Robert K. | 2002-02-28 |
Laser decapsulation method Grant 6,335,208 - Lowry January 1, 2 | 2002-01-01 |
Radiation hardened dielectric for EEPROM Grant 6,130,172 - Fuller , et al. October 10, 2 | 2000-10-10 |
Bonded wafer processing with oxidative bonding Grant 5,849,627 - Linn , et al. December 15, 1 | 1998-12-15 |
Bonded wafer processing Grant 5,728,624 - Linn , et al. March 17, 1 | 1998-03-17 |
Bonded wafer processing with metal silicidation Grant 5,569,620 - Linn , et al. October 29, 1 | 1996-10-29 |
Bonded wafer processing Grant 5,517,047 - Linn , et al. May 14, 1 | 1996-05-14 |
Bonded wafer processing with metal silicidation Grant 5,387,555 - Linn , et al. February 7, 1 | 1995-02-07 |
Bonded wafer processing Grant 5,362,667 - Linn , et al. November 8, 1 | 1994-11-08 |
Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions Grant 4,781,853 - Lowry , et al. November 1, 1 | 1988-11-01 |
Method and means for measuring moisture content of hermetic semiconductor devices Grant 4,272,986 - Lowry , et al. June 16, 1 | 1981-06-16 |
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