loadpatents
name:-0.0036540031433105
name:-0.0081281661987305
name:-0.0033590793609619
Low; Yee Leng Patent Filings

Low; Yee Leng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Low; Yee Leng.The latest application filed is for "communication through window using free-space optical data communication".

Company Profile
3.6.3
  • Low; Yee Leng - New Providence NJ
  • Low; Yee Leng - Murray Hill NJ
  • Low; Yee Leng - Berkeley Heights NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Arrangement for connecting photonic and electronic components
Grant 10,338,329 - Low , et al.
2019-07-02
Communication Through Window Using Free-space Optical Data Communication
App 20190081706 - Neilson; David ;   et al.
2019-03-14
Arrangement For Connecting Photonic And Electronic Components
App 20190041591 - Low; Yee Leng ;   et al.
2019-02-07
Planar micro-miniature ion trap devices
Grant 7,217,922 - Jachowski , et al. May 15, 2
2007-05-15
Planar micro-miniature ion trap devices
App 20060219888 - Jachowski; Matthew Douglas Apau ;   et al.
2006-10-05
Packaging micromechanical devices
Grant 6,603,182 - Low , et al. August 5, 2
2003-08-05
Integrated circuit packages with improved EMI characteristics
Grant 6,297,551 - Dudderar , et al. October 2, 2
2001-10-02
Recessed flip-chip package
Grant 6,154,370 - Degani , et al. November 28, 2
2000-11-28
Chip-on-chip IC packages
Grant 5,898,223 - Frye , et al. April 27, 1
1999-04-27

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