Low; Qwai H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Low; Qwai H..The latest application filed is for "3d-interconnect".
Company Profile
2.30.20
- Low; Qwai H. - Cupertino CA
Patent Activity
| Patent | Date |
|---|---|
| 3d-Interconnect App 20210366857 - Chia; Chok J. ; et al. | 2021-11-25 |
| 3D-interconnect Grant 11,031,362 - Chia , et al. June 8, 2 | 2021-06-08 |
| 3D-Interconnect App 20190148324 - Chia; Chok J. ; et al. | 2019-05-16 |
| 3D-interconnect Grant 10,181,447 - Chia , et al. Ja | 2019-01-15 |
| 3d-interconnect App 20180308813 - Chia; Chok J. ; et al. | 2018-10-25 |
| Low cost hybrid high density package Grant 9,875,955 - Desai , et al. January 23, 2 | 2018-01-23 |
| Low cost hybrid high density package App 20170077018 - DESAI; Kishor ; et al. | 2017-03-16 |
| Low cost hybrid high density package Grant 9,508,687 - Desai , et al. November 29, 2 | 2016-11-29 |
| Low Cost Hybrid High Density Package App 20150171058 - Desai; Kishor ; et al. | 2015-06-18 |
| Low cost hybrid high density package Grant 8,963,310 - Desai , et al. February 24, 2 | 2015-02-24 |
| Area array quad flat no-lead (QFN) package Grant 8,525,312 - Low , et al. September 3, 2 | 2013-09-03 |
| Low Cost Hybrid High Density Package App 20130049179 - Desai; Kishor ; et al. | 2013-02-28 |
| Area Array Qfn App 20130037925 - Low; Qwai H. ; et al. | 2013-02-14 |
| Package with power and ground through via Grant 8,350,379 - Low , et al. January 8, 2 | 2013-01-08 |
| Heat dissipation for integrated circuit Grant 8,134,232 - Lohr , et al. March 13, 2 | 2012-03-13 |
| Wire bonding over active circuits Grant 8,125,091 - Low February 28, 2 | 2012-02-28 |
| Package with Power and Ground Through Via App 20100059865 - Low; Qwai H. ; et al. | 2010-03-11 |
| Heat Dissipation For Integrated Circuit App 20090250805 - Lohr; Mitchel E. ; et al. | 2009-10-08 |
| Wire Bonding Over Active Circuits App 20090236742 - Low; Qwai H. | 2009-09-24 |
| Heat spreader in integrated circuit package Grant 7,420,809 - Lim , et al. September 2, 2 | 2008-09-02 |
| Integrated heatspreader for use in wire bonded ball grid array semiconductor packages Grant 7,235,889 - Othieno , et al. June 26, 2 | 2007-06-26 |
| Integrated heatspreader for use in wire bonded ball grid array semiconductor packages App 20060055029 - Othieno; Maurice O. ; et al. | 2006-03-16 |
| Test structure for detecting bonding-induced cracks Grant 6,998,638 - Low , et al. February 14, 2 | 2006-02-14 |
| Heat spreader in integrated circuit package App 20050281011 - Lim, Hong T. ; et al. | 2005-12-22 |
| Dielectric stack Grant 6,963,138 - Low , et al. November 8, 2 | 2005-11-08 |
| Test structure Grant 6,861,748 - Low , et al. March 1, 2 | 2005-03-01 |
| Buffer metal layer Grant 6,861,343 - Chia , et al. March 1, 2 | 2005-03-01 |
| Slotted bonding pad Grant 6,825,563 - Ranganathan , et al. November 30, 2 | 2004-11-30 |
| Test structure for detecting bonding-induced cracks App 20040217487 - Low, Qwai H. ; et al. | 2004-11-04 |
| Bonding pad for low k dielectric Grant 6,798,035 - Low , et al. September 28, 2 | 2004-09-28 |
| Wire bonding to full array bonding pads on active circuitry App 20040178498 - Low, Qwai H. ; et al. | 2004-09-16 |
| Test structure for detecting bonding-induced cracks Grant 6,781,150 - Low , et al. August 24, 2 | 2004-08-24 |
| Dielectric stack App 20040150069 - Low, Qwai H. ; et al. | 2004-08-05 |
| Bonding pad isolation Grant 6,743,979 - Berman , et al. June 1, 2 | 2004-06-01 |
| Test structure App 20040096995 - Low, Qwai H. ; et al. | 2004-05-20 |
| Buffer metal layer App 20040072414 - Chia, Chok J. ; et al. | 2004-04-15 |
| Test structure App 20040043656 - Low, Qwai H. ; et al. | 2004-03-04 |
| Integrated circuit package Grant 6,603,200 - Low , et al. August 5, 2 | 2003-08-05 |
| Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits Grant 5,973,393 - Chia , et al. October 26, 1 | 1999-10-26 |
| Semiconductor die having sacrificial bond pads for die test Grant 5,923,047 - Chia , et al. July 13, 1 | 1999-07-13 |
| Molded laminate package with integral mold gate Grant 5,886,398 - Low , et al. March 23, 1 | 1999-03-23 |
| Ball grid array package employing raised metal contact rings Grant 5,841,191 - Chia , et al. November 24, 1 | 1998-11-24 |
| Stacked integrated chip package and method of making same Grant 5,814,881 - Alagaratnam , et al. September 29, 1 | 1998-09-29 |
| Method of cooling a packaged electronic device Grant 5,568,683 - Chia , et al. October 29, 1 | 1996-10-29 |
| High power dissipating packages with matched heatspreader heatsink assemblies Grant 5,463,529 - Chia , et al. October 31, 1 | 1995-10-31 |
| High power dissipating packages with matched heatspreader heatsink assemblies Grant 5,353,193 - Chia , et al. October 4, 1 | 1994-10-04 |
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