Low; Min Wee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Low; Min Wee.The latest application filed is for "non-leaded semiconductor package and a method to assemble the same".
- Low; Min Wee - Singapore SG
| Patent | Date |
|---|---|
| Leadframe, semiconductor package and support lead for bonding with groundwires Grant 7,875,968 - Li , et al. January 25, 2 | 2011-01-25 |
| Non-leaded semiconductor package and a method to assemble the same Grant 7,732,259 - Low , et al. June 8, 2 | 2010-06-08 |
| Non-Leaded Semiconductor Package and a Method to Assemble the Same App 20080258276 - Low; Min Wee ; et al. | 2008-10-23 |
| Leadframe and Semiconductor Package App 20080128741 - Li; Wu Hu ; et al. | 2008-06-05 |
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