loadpatents
Patent applications and USPTO patent grants for Low; Boon Yew.The latest application filed is for "conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes".
Patent | Date |
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Conduit Inserts For Encapsulant Compound Formulation Kneading And Encapsulation Back-end Assembly Processes App 20220250301 - Chopin; Sheila F. ;   et al. | 2022-08-11 |
Circuit Modules With Front-side Interposer Terminals And Through-module Thermal Dissipation Structures App 20220208646 - Low; Boon Yew ;   et al. | 2022-06-30 |
Semiconductor device with bond wire reinforcement structure Grant 11,056,457 - Low , et al. July 6, 2 | 2021-07-06 |
Semiconductor Device With Bond Wire Reinforcemment Structure App 20200105709 - Low; Boon Yew ;   et al. | 2020-04-02 |
Packaged semiconductor device having bent leads and method for forming Grant 9,947,614 - Oratti Kalandar , et al. April 17, 2 | 2018-04-17 |
Packaged Semiconductor Device Having Bent Leads And Method For Forming App 20170263538 - ORATTI KALANDAR; Navas Khan ;   et al. | 2017-09-14 |
Integrated circuit with sewn interconnects Grant 9,418,929 - Low , et al. August 16, 2 | 2016-08-16 |
Method for forming multilayer device having solder filled via connection Grant 9,351,407 - Low May 24, 2 | 2016-05-24 |
Embedded die ball grid array package Grant 9,299,675 - Kalandar , et al. March 29, 2 | 2016-03-29 |
Molded Interposer For Packaged Semiconductor Device App 20160071789 - Tong; Pei Fan ;   et al. | 2016-03-10 |
Multi-use substrate for integrated circuit Grant 9,190,355 - Chan , et al. November 17, 2 | 2015-11-17 |
Lead Frames Having Metal Traces With Metal Stubs App 20150311143 - Foong; Chee Seng ;   et al. | 2015-10-29 |
Multi-use Substrate For Integrated Circuit App 20150303137 - Chan; Weng Hoong ;   et al. | 2015-10-22 |
Semiconductor device with plated through holes Grant 9,165,862 - Low , et al. October 20, 2 | 2015-10-20 |
Copper pillar bump and flip chip package using same Grant 9,159,682 - Foong , et al. October 13, 2 | 2015-10-13 |
Embedded Die Ball Grid Array Package App 20150243621 - KALANDAR; NAVAS KHAN ORATTI ;   et al. | 2015-08-27 |
Embedded die ball grid array package Grant 9,034,694 - Kalandar , et al. May 19, 2 | 2015-05-19 |
Mold cap for semiconductor device Grant 9,030,000 - Eu , et al. May 12, 2 | 2015-05-12 |
Dual Corner Top Gate Molding App 20150118802 - Low; Boon Yew ;   et al. | 2015-04-30 |
Semiconductor device with corner tie bars Grant 9,000,570 - Chan , et al. April 7, 2 | 2015-04-07 |
Side Vented Pressure Sensor Device App 20150076630 - Low; Boon Yew ;   et al. | 2015-03-19 |
Copper Pillar Bump And Flip Chip Package Using Same App 20150069603 - Foong; Chee Seng ;   et al. | 2015-03-12 |
Semiconductor Device With Corner Tie Bars App 20150014831 - Chan; Weng Hoong ;   et al. | 2015-01-15 |
Lead frame with power bar for semiconductor device Grant 8,933,547 - Yap , et al. January 13, 2 | 2015-01-13 |
Semiconductor Device With Heat Spreader And Thermal Sheet App 20140374891 - Low; Boon Yew ;   et al. | 2014-12-25 |
Mold Cap For Semiconductor Device App 20140367840 - Eu; Poh Leng ;   et al. | 2014-12-18 |
Solar powered IC chip Grant 8,809,078 - Lau , et al. August 19, 2 | 2014-08-19 |
Solar Powered Ic Chip App 20140225211 - Lau; Teck Beng ;   et al. | 2014-08-14 |
Semiconductor device package Grant 8,802,508 - Carpenter , et al. August 12, 2 | 2014-08-12 |
Semiconductor Device Package App 20140147975 - Carpenter; Burton J. ;   et al. | 2014-05-29 |
Flexible substrate with crimping interconnection Grant 8,698,288 - Low , et al. April 15, 2 | 2014-04-15 |
Packaged semiconductor die with power rail pads Grant 8,643,189 - Low , et al. February 4, 2 | 2014-02-04 |
Packaged Semiconductor Die With Power Rail Pads App 20140021621 - Low; Boon Yew ;   et al. | 2014-01-23 |
Vented substrate for semiconductor device Grant 8,338,236 - Low December 25, 2 | 2012-12-25 |
Semiconductor package and method of testing same Grant 8,338,828 - Low , et al. December 25, 2 | 2012-12-25 |
Vented Substrate For Semiconductor Device App 20120319245 - LOW; Boon Yew | 2012-12-20 |
Semiconductor package with protective tape Grant 8,237,293 - Wong , et al. August 7, 2 | 2012-08-07 |
Mold and substrate for use with mold Grant 8,198,143 - Eu , et al. June 12, 2 | 2012-06-12 |
Semiconductor Package And Method Of Testing Same App 20120032167 - LOW; Boon Yew ;   et al. | 2012-02-09 |
Method and apparatus for molding substrate Grant 8,062,424 - Manikam , et al. November 22, 2 | 2011-11-22 |
Mold And Substrate For Use With Mold App 20110244637 - EU; Poh Leng ;   et al. | 2011-10-06 |
Mold and substrate for use with mold Grant 7,956,471 - Eu , et al. June 7, 2 | 2011-06-07 |
Semiconductor Package And Method Of Making Same App 20110121468 - WONG; Tzu Ling ;   et al. | 2011-05-26 |
Method And Apparatus For Molding Substrate App 20110115125 - MANIKAM; Vermal Raja ;   et al. | 2011-05-19 |
Mold And Substrate For Use With Mold App 20100117202 - Eu; Poh Leng ;   et al. | 2010-05-13 |
Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate App 20080182398 - Carpenter; Burton J. ;   et al. | 2008-07-31 |
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