loadpatents
name:-0.026509046554565
name:-0.031734943389893
name:-0.0015809535980225
Low; Boon Yew Patent Filings

Low; Boon Yew

Patent Applications and Registrations

Patent applications and USPTO patent grants for Low; Boon Yew.The latest application filed is for "conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes".

Company Profile
1.36.37
  • Low; Boon Yew - Subang Jaya MY
  • Low; Boon Yew - Petaling Jaya N/A MY
  • LOW; Boon Yew - Petalling Jaya MY
  • Low; Boon Yew - Selangor MY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Conduit Inserts For Encapsulant Compound Formulation Kneading And Encapsulation Back-end Assembly Processes
App 20220250301 - Chopin; Sheila F. ;   et al.
2022-08-11
Circuit Modules With Front-side Interposer Terminals And Through-module Thermal Dissipation Structures
App 20220208646 - Low; Boon Yew ;   et al.
2022-06-30
Semiconductor device with bond wire reinforcement structure
Grant 11,056,457 - Low , et al. July 6, 2
2021-07-06
Semiconductor Device With Bond Wire Reinforcemment Structure
App 20200105709 - Low; Boon Yew ;   et al.
2020-04-02
Packaged semiconductor device having bent leads and method for forming
Grant 9,947,614 - Oratti Kalandar , et al. April 17, 2
2018-04-17
Packaged Semiconductor Device Having Bent Leads And Method For Forming
App 20170263538 - ORATTI KALANDAR; Navas Khan ;   et al.
2017-09-14
Integrated circuit with sewn interconnects
Grant 9,418,929 - Low , et al. August 16, 2
2016-08-16
Method for forming multilayer device having solder filled via connection
Grant 9,351,407 - Low May 24, 2
2016-05-24
Embedded die ball grid array package
Grant 9,299,675 - Kalandar , et al. March 29, 2
2016-03-29
Molded Interposer For Packaged Semiconductor Device
App 20160071789 - Tong; Pei Fan ;   et al.
2016-03-10
Multi-use substrate for integrated circuit
Grant 9,190,355 - Chan , et al. November 17, 2
2015-11-17
Lead Frames Having Metal Traces With Metal Stubs
App 20150311143 - Foong; Chee Seng ;   et al.
2015-10-29
Multi-use Substrate For Integrated Circuit
App 20150303137 - Chan; Weng Hoong ;   et al.
2015-10-22
Semiconductor device with plated through holes
Grant 9,165,862 - Low , et al. October 20, 2
2015-10-20
Copper pillar bump and flip chip package using same
Grant 9,159,682 - Foong , et al. October 13, 2
2015-10-13
Embedded Die Ball Grid Array Package
App 20150243621 - KALANDAR; NAVAS KHAN ORATTI ;   et al.
2015-08-27
Embedded die ball grid array package
Grant 9,034,694 - Kalandar , et al. May 19, 2
2015-05-19
Mold cap for semiconductor device
Grant 9,030,000 - Eu , et al. May 12, 2
2015-05-12
Dual Corner Top Gate Molding
App 20150118802 - Low; Boon Yew ;   et al.
2015-04-30
Semiconductor device with corner tie bars
Grant 9,000,570 - Chan , et al. April 7, 2
2015-04-07
Side Vented Pressure Sensor Device
App 20150076630 - Low; Boon Yew ;   et al.
2015-03-19
Copper Pillar Bump And Flip Chip Package Using Same
App 20150069603 - Foong; Chee Seng ;   et al.
2015-03-12
Semiconductor Device With Corner Tie Bars
App 20150014831 - Chan; Weng Hoong ;   et al.
2015-01-15
Lead frame with power bar for semiconductor device
Grant 8,933,547 - Yap , et al. January 13, 2
2015-01-13
Semiconductor Device With Heat Spreader And Thermal Sheet
App 20140374891 - Low; Boon Yew ;   et al.
2014-12-25
Mold Cap For Semiconductor Device
App 20140367840 - Eu; Poh Leng ;   et al.
2014-12-18
Solar powered IC chip
Grant 8,809,078 - Lau , et al. August 19, 2
2014-08-19
Solar Powered Ic Chip
App 20140225211 - Lau; Teck Beng ;   et al.
2014-08-14
Semiconductor device package
Grant 8,802,508 - Carpenter , et al. August 12, 2
2014-08-12
Semiconductor Device Package
App 20140147975 - Carpenter; Burton J. ;   et al.
2014-05-29
Flexible substrate with crimping interconnection
Grant 8,698,288 - Low , et al. April 15, 2
2014-04-15
Packaged semiconductor die with power rail pads
Grant 8,643,189 - Low , et al. February 4, 2
2014-02-04
Packaged Semiconductor Die With Power Rail Pads
App 20140021621 - Low; Boon Yew ;   et al.
2014-01-23
Vented substrate for semiconductor device
Grant 8,338,236 - Low December 25, 2
2012-12-25
Semiconductor package and method of testing same
Grant 8,338,828 - Low , et al. December 25, 2
2012-12-25
Vented Substrate For Semiconductor Device
App 20120319245 - LOW; Boon Yew
2012-12-20
Semiconductor package with protective tape
Grant 8,237,293 - Wong , et al. August 7, 2
2012-08-07
Mold and substrate for use with mold
Grant 8,198,143 - Eu , et al. June 12, 2
2012-06-12
Semiconductor Package And Method Of Testing Same
App 20120032167 - LOW; Boon Yew ;   et al.
2012-02-09
Method and apparatus for molding substrate
Grant 8,062,424 - Manikam , et al. November 22, 2
2011-11-22
Mold And Substrate For Use With Mold
App 20110244637 - EU; Poh Leng ;   et al.
2011-10-06
Mold and substrate for use with mold
Grant 7,956,471 - Eu , et al. June 7, 2
2011-06-07
Semiconductor Package And Method Of Making Same
App 20110121468 - WONG; Tzu Ling ;   et al.
2011-05-26
Method And Apparatus For Molding Substrate
App 20110115125 - MANIKAM; Vermal Raja ;   et al.
2011-05-19
Mold And Substrate For Use With Mold
App 20100117202 - Eu; Poh Leng ;   et al.
2010-05-13
Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate
App 20080182398 - Carpenter; Burton J. ;   et al.
2008-07-31

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