Louie; Wai Seung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Louie; Wai Seung.The latest application filed is for "hydroprocessing thermally cracked products".
- Louie; Wai Seung - Bloomfield NJ
- Louie; Wai Seung - Brooklyn NY
| Patent | Date |
|---|---|
| Hydroprocessing thermally cracked products Grant 10,385,283 - Arora , et al. A | 2019-08-20 |
| Hydroprocessing Thermally Cracked Products App 20170183573 - Arora; Arun ; et al. | 2017-06-29 |
| Hydroprocessing thermally cracked products Grant 9,631,150 - Arora , et al. April 25, 2 | 2017-04-25 |
| Hydroprocessing Thermally Cracked Products App 20140262942 - Arora; Arun ; et al. | 2014-09-18 |
| Multiple stage catalyst bed hydrocracking with interstage feeds Grant 6,726,832 - Baldassari , et al. April 27, 2 | 2004-04-27 |
| Hydrocracking of vacuum gas and other oils using a post-treatment reactive distillation system Grant 6,547,956 - Mukherjee , et al. April 15, 2 | 2003-04-15 |
| Multiple stage ebullating bed hydrocracking with interstage stripping and separating Grant 6,454,932 - Baldassari , et al. September 24, 2 | 2002-09-24 |
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