Lou; Bai-Yao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lou; Bai-Yao.The latest application filed is for "bump structure having first portion of copper and second portion of pure tin covering the first portion, and interconnect structure using the same".
- Lou; Bai-Yao - Taipei TW
- Lou; Bai-Yao - Taipei City TW
- Lou; Bai-Yao - Hsinchu TW
- LOU; Bai-Yao - Hsinchu City TW
| Patent | Date |
|---|---|
| Passive component structure and manufacturing method thereof Grant 9,761,555 - Lai , et al. September 12, 2 | 2017-09-12 |
| Bump Structure Having First Portion Of Copper And Second Portion Of Pure Tin Covering The First Portion, And Interconnect Structure Using The Same App 20170179058 - Lou; Bai-Yao | 2017-06-22 |
| Image Sensor Chip Package And Fabricating Method Thereof App 20160380024 - CHEN; Chih-Hao ; et al. | 2016-12-29 |
| Chip package and method for forming the same Grant 9,449,897 - Lou , et al. September 20, 2 | 2016-09-20 |
| Chip package and method for forming the same Grant 9,293,394 - Lou , et al. March 22, 2 | 2016-03-22 |
| Passive Component Structure And Manufacturing Method Thereof App 20150214162 - LAI; Jiun-Yen ; et al. | 2015-07-30 |
| Power module and the method of packaging the same Grant 9,088,206 - Yiu , et al. July 21, 2 | 2015-07-21 |
| Wafer packaging method Grant 9,023,676 - Chen , et al. May 5, 2 | 2015-05-05 |
| Chip Package And Method For Forming The Same App 20140252642 - LOU; Bai-Yao ; et al. | 2014-09-11 |
| Chip Package And Method For Forming The Same App 20140231966 - LOU; Bai-Yao ; et al. | 2014-08-21 |
| Wafer Packaging Method App 20140213010 - CHEN; Chih-Hao ; et al. | 2014-07-31 |
| Capacitive coupler packaging structure Grant 8,791,768 - Yiu , et al. July 29, 2 | 2014-07-29 |
| Electronic device package and fabrication method thereof Grant 8,778,798 - Chang , et al. July 15, 2 | 2014-07-15 |
| Image Sensor Chip Package And Fabricating Method Thereof App 20140191350 - CHEN; Chih-Hao ; et al. | 2014-07-10 |
| Electronic Device Package And Fabrication Method Thereof App 20140193950 - CHANG; Shu-Ming ; et al. | 2014-07-10 |
| Chip package and method for forming the same Grant 8,742,564 - Lou , et al. June 3, 2 | 2014-06-03 |
| Electronic device package and fabrication method thereof Grant 8,710,680 - Chang , et al. April 29, 2 | 2014-04-29 |
| Chip package Grant 8,604,578 - Chiu , et al. December 10, 2 | 2013-12-10 |
| Electronic device package and method for fabricating the same Grant 8,541,877 - Tsai , et al. September 24, 2 | 2013-09-24 |
| Chip package and method for forming the same Grant 8,431,946 - Chiu , et al. April 30, 2 | 2013-04-30 |
| Chip package Grant 8,384,174 - Chiu , et al. February 26, 2 | 2013-02-26 |
| Capacitive Coupler Packaging Structure App 20120194301 - YIU; Ho-Yin ; et al. | 2012-08-02 |
| Power Module And The Method Of Packaging The Same App 20120194148 - YIU; Ho-Yin ; et al. | 2012-08-02 |
| Chip Package And Method For Forming The Same App 20120181672 - LOU; Bai-Yao ; et al. | 2012-07-19 |
| Chip package and method for fabricating the same Grant 8,207,615 - Lou , et al. June 26, 2 | 2012-06-26 |
| Chip Package App 20120097999 - CHIU; Hsin-Chih ; et al. | 2012-04-26 |
| Chip Package And Method For Forming The Same App 20110291139 - CHIU; Hsin-Chih ; et al. | 2011-12-01 |
| Electronic Device Package And Fabrication Method Thereof App 20110233782 - CHANG; Shu-Ming ; et al. | 2011-09-29 |
| Chip Package App 20110233770 - CHIU; Hsin-Chih ; et al. | 2011-09-29 |
| Chip Package And Method For Fabricating The Same App 20110175236 - LOU; Bai-Yao ; et al. | 2011-07-21 |
| Electronic Device Package And Method For Fabricating The Same App 20110140267 - TSAI; Chia-Lun ; et al. | 2011-06-16 |
| Semiconductor device and fabrication methods thereof Grant 7,888,236 - Pu , et al. February 15, 2 | 2011-02-15 |
| Semiconductor device and fabrication methods thereof App 20080286938 - Pu; Han-Ping ; et al. | 2008-11-20 |
| Semiconductor wafer with protection structure against damage during a die separation process App 20060125059 - Chen; Hsien-Wei ; et al. | 2006-06-15 |
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