LOTZ; Stefanie M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for LOTZ; Stefanie M..The latest application filed is for "multi-chip package and method of providing die-to-die interconnects in same".

Company Profile

11.17.21

LOTZ; Stefanie M. - Phoenix AZ
Lotz; Stefanie M - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same App 20210134726 - BRAUNISCH; Henning ; et al.	2021-05-06
Multi-chip package and method of providing die-to-die interconnects in same Grant 10,923,429 - Braunisch , et al. February 16, 2	2021-02-16
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same App 20200357747 - BRAUNISCH; Henning ; et al.	2020-11-12
High Density Organic Bridge Device And Method App 20200294924 - Roy; Mihir K. ; et al.	2020-09-17
Integrated circuit package substrate Grant 10,770,387 - Zhang , et al. Sep	2020-09-08
Multi-chip package and method of providing die-to-die interconnects in same Grant 10,763,216 - Braunisch , et al. Sep	2020-09-01
High density organic bridge device and method Grant 10,672,713 - Roy , et al.	2020-06-02
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same App 20200075493 - BRAUNISCH; Henning ; et al.	2020-03-05
Multi-chip package and method of providing die-to-die interconnects in same Grant 10,510,669 - Braunisch , et al. Dec	2019-12-17
Integrated Circuit Package Substrate App 20190304892 - ZHANG; Qinglei ; et al.	2019-10-03
Integrated circuit package substrate Grant 10,325,843 - Zhang , et al.	2019-06-18
High Density Organic Bridge Device And Method App 20190019755 - Roy; Mihir K. ; et al.	2019-01-17
High density organic bridge device and method Grant 10,103,105 - Roy , et al. October 16, 2	2018-10-16
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same App 20180145031 - BRAUNISCH; Henning ; et al.	2018-05-24
Integrated Circuit Package Substrate App 20180138118 - ZHANG; Qinglei ; et al.	2018-05-17
Multi-chip package and method of providing die-to-die interconnects in same Grant 9,875,969 - Braunisch , et al. January 23, 2	2018-01-23
Integrated circuit package substrate Grant 9,831,169 - Zhang , et al. November 28, 2	2017-11-28
High Density Organic Bridge Device And Method App 20170125349 - Roy; Mihir K. ; et al.	2017-05-04
High density organic bridge device and method Grant 9,548,264 - Roy , et al. January 17, 2	2017-01-17
Integrated Circuit Package Substrate App 20160379923 - ZHANG; Qinglei ; et al.	2016-12-29
Integrated circuit package substrate Grant 9,508,636 - Zhang , et al. November 29, 2	2016-11-29
High Density Organic Bridge Device And Method App 20160133552 - Roy; Mihir K. ; et al.	2016-05-12
Laser cavity formation for embedded dies or components in substrate build-up layers Grant 9,202,803 - Zhang , et al. December 1, 2	2015-12-01
Integrated Circuit Package Substrate App 20150318236 - ZHANG; Qinglei ; et al.	2015-11-05
Laser Cavity Formation For Embedded Dies Or Components In Substrate Build-up Layers App 20150279817 - ZHANG; Chong ; et al.	2015-10-01
Package substrate with high density interconnect design to capture conductive features on embedded die Grant 9,119,313 - Zhang , et al. August 25, 2	2015-08-25
Fabrication Of A Substrate With An Embedded Die Using Projection Patterning And Associated Package Configurations App 20150048515 - Zhang; Chong ; et al.	2015-02-19
Package Substrate With High Density Interconnect Design To Capture Conductive Features On Embedded Die App 20140321091 - Zhang; Chong ; et al.	2014-10-30
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same App 20120261838 - Braunisch; Henning ; et al.	2012-10-18
Multi-chip package and method of providing die-to-die interconnects in same Grant 8,227,904 - Braunisch , et al. July 24, 2	2012-07-24
Multi-chip package and method of providing die-to-die interconnects in same App 20100327424 - Braunisch; Henning ; et al.	2010-12-30
Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates Grant 7,332,429 - Lotz February 19, 2	2008-02-19
Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates App 20070158854 - Lotz; Stefanie M.	2007-07-12

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