Lortscher; Peter S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lortscher; Peter S..The latest application filed is for "thermoplastic injection molded and flushable material".
- Lortscher; Peter S. - Neenah WI
| Patent | Date |
|---|---|
| Polymeric material Grant 11,345,791 - McEneany , et al. May 31, 2 | 2022-05-31 |
| Thermoplastic injection molded and flushable material Grant 11,124,641 - DeMarco , et al. September 21, 2 | 2021-09-21 |
| Thermoplastic injection molded and flushable tampon applicator Grant 11,123,228 - DeMarco , et al. September 21, 2 | 2021-09-21 |
| Thermoplastic Injection Molded And Flushable Material App 20200056032 - DeMarco; Alphonse ; et al. | 2020-02-20 |
| Thermoplastic Injection Molded And Flushable Tampon Applicator App 20200054494 - DeMarco; Alphonse ; et al. | 2020-02-20 |
| Molding Thermoplastic Injection-molded And Flushable Materials App 20190366602 - DeMarco; Alphonse ; et al. | 2019-12-05 |
| Polymeric Material App 20190338097 - McEneany; Ryan J. ; et al. | 2019-11-07 |
| Thermoplastic Injection Molded And Flushable Material App 20190255212 - DeMarco; Alphonse ; et al. | 2019-08-22 |
| Eyewear Containing a Porous Polymeric Material App 20160252747 - Lortscher; Peter S. ; et al. | 2016-09-01 |
| Energy Absorbing Member App 20160108194 - Topolkaraev; Vasily A. ; et al. | 2016-04-21 |
| Product seal of dissimilar materials Grant 7,473,818 - Datta , et al. January 6, 2 | 2009-01-06 |
| Method for simulating a dynamic force response and method of calibration Grant 7,100,419 - Honer , et al. September 5, 2 | 2006-09-05 |
| Apparatus for simulating a dynamic force response Grant 6,945,121 - Honer , et al. September 20, 2 | 2005-09-20 |
| Apparatus For Simulating A Dynamic Force Response App 20040107776 - Honer, Peter D. ; et al. | 2004-06-10 |
| Method for simulating a dynamic force response and method of calibration App 20040110603 - Honer, Peter D. ; et al. | 2004-06-10 |
| Product seal of dissimilar materials App 20020165514 - Datta, Paul J. ; et al. | 2002-11-07 |
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