Lopez; Osvaldo J

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lopez; Osvaldo J.The latest application filed is for "ultra-thin power transistor and synchronous buck converter having customized footprint".

Company Profile

0.19.15

Lopez; Osvaldo J - Annandale NJ
Lopez; Osvaldo J. - Annandale NJ US
LOPEZ; Osvaldo J. - Annadale NJ
Lopez; Osvaldo J. - Lebanon NJ
Lopez; Osvaldo J. - Lincoln NE
Lopez; Osvaldo J. - North Bergen NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ultra-thin power transistor and synchronous buck converter having customized footprint Grant 9,779,967 - Herbsommer , et al. October 3, 2	2017-10-03
High performance power transistor having ultra-thin package Grant 9,508,633 - Herbsommer , et al. November 29, 2	2016-11-29
Ultra-thin Power Transistor And Synchronous Buck Converter Having Customized Footprint App 20160005627 - HERBSOMMER; Juan A ; et al.	2016-01-07
Ultra-thin power transistor and synchronous buck converter having customized footprint Grant 9,165,865 - Herbsommer , et al. October 20, 2	2015-10-20
Fabricating a power supply converter with load inductor structured as heat sink Grant 8,910,369 - Herbsommer , et al. December 16, 2	2014-12-16
Dc-dc Converter Vertically Integrated With Load Inductor Structured As Heat Sink App 20140247562 - Herbsommer; Juan A. ; et al.	2014-09-04
DC-DC converter vertically integrated with load inductor structured as heat sink Grant 8,760,872 - Herbsommer , et al. June 24, 2	2014-06-24
Synchronous buck converter having coplanar array of contact bumps of equal volume Grant 8,546,925 - Herbsommer , et al. October 1, 2	2013-10-01
Power converter having integrated capacitor Grant 8,431,979 - Herbsommer , et al. April 30, 2	2013-04-30
DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink App 20130077250 - HERBSOMMER; Juan A. ; et al.	2013-03-28
Semiconductor device package and method of assembly thereof Grant 8,389,336 - Herbsommer , et al. March 5, 2	2013-03-05
High Performance Power Transistor Having Ultra-Thin Package App 20130049077 - HERBSOMMER; Juan A. ; et al.	2013-02-28
Wirebond-less semiconductor package Grant 8,304,903 - Herbsommer , et al. November 6, 2	2012-11-06
Ultra-Thin Power Transistor and Synchronous Buck Converter Having Customized Footprint App 20120256239 - HERBSOMMER; Juan A. ; et al.	2012-10-11
Power Converter Having Integrated Capacitor App 20120248521 - HERBSOMMER; Juan A. ; et al.	2012-10-04
Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing App 20120200281 - HERBSOMMER; Juan A. ; et al.	2012-08-09
Semiconductor Device Package and Method of Assembly Thereof App 20120015483 - HERBSOMMER; Juan Alejandro ; et al.	2012-01-19
Semiconductor device package and method of assembly thereof Grant 8,049,312 - Herbsommer , et al. November 1, 2	2011-11-01
High Frequency Power Supply Module Having High Efficiency and High Current App 20110210708 - HERBSOMMER; Juan A. ; et al.	2011-09-01
Mosfet With Gate Pull-down App 20110148376 - Xu; Shuming ; et al.	2011-06-23
Wirebond-less Semiconductor Package App 20110095411 - HERBSOMMER; Juan Alejandro ; et al.	2011-04-28
Semiconductor Device Package And Method Of Assembly Thereof App 20100176508 - Herbsommer; Juan Alejandro ; et al.	2010-07-15
Wirebond-less Semiconductor Package App 20080036078 - Herbsommer; Juan Alejandro ; et al.	2008-02-14
Active clamping circuit for power amplifiers Grant 6,580,321 - Arell , et al. June 17, 2	2003-06-17
DNA methyltransferase genotyping Grant 6,514,698 - Lopez , et al. February 4, 2	2003-02-04
Method and apparatus for reducing local oscillator leakage in integrated circuit receivers Grant 5,428,837 - Bayruns , et al. June 27, 1	1995-06-27

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