Lopez; Albert S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lopez; Albert S..The latest application filed is for "carrier for microelectronic assemblies having direct bonding".
- Lopez; Albert S. - Tempe AZ
| Patent | Date |
|---|---|
| Carrier For Microelectronic Assemblies Having Direct Bonding App 20220199453 - Baker; Michael J. ; et al. | 2022-06-23 |
| TSV-less die stacking using plated pillars/through mold interconnect Grant 11,296,052 - Meyers , et al. April 5, 2 | 2022-04-05 |
| Flexible packaging for a wearable electronic device Grant 10,820,437 - Aleksov , et al. October 27, 2 | 2020-10-27 |
| Tsv-less Die Stacking Using Plated Pillars/through Mold Interconnect App 20200212012 - MEYERS; Preston T. ; et al. | 2020-07-02 |
| Flexible Packaging For A Wearable Electronic Device App 20190281717 - Aleksov; Aleksandar ; et al. | 2019-09-12 |
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