Lopatin; Sergey D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lopatin; Sergey D..The latest application filed is for "anode structure with binders for silicon and stabilized lithium metal powder".

Company Profile

2.61.33

Lopatin; Sergey D. - Morgan Hill CA
Lopatin; Sergey D. - Santa Clara CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Anode structure with binders for silicon and stabilized lithium metal powder Grant 11,069,888 - Liu , et al. July 20, 2	2021-07-20
Anode Structure With Binders For Silicon And Stabilized Lithium Metal Powder App 20190013513 - LIU; Gao ; et al.	2019-01-10
Manufacturing of high capacity prismatic lithium-ion alloy anodes Grant 9,761,882 - Lopatin , et al. September 12, 2	2017-09-12
Manufacturing Of High Capacity Prismatic Lithium-ion Alloy Anodes App 20170237074 - LOPATIN; Sergey D. ; et al.	2017-08-17
Manufacturing of high capacity prismatic lithium-ion alloy anodes Grant 9,583,770 - Lopatin , et al. February 28, 2	2017-02-28
Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors Grant 9,567,683 - Lopatin , et al. February 14, 2	2017-02-14
Manufacturing Of High Capacity Prismatic Lithium-ion Alloy Anodes App 20160226070 - LOPATIN; SERGEY D. ; et al.	2016-08-04
Manufacturing of high capacity prismatic lithium-ion alloy anodes Grant 9,240,585 - Lopatin , et al. January 19, 2	2016-01-19
Particle synthesis apparatus and methods Grant 9,070,944 - Yang , et al. June 30, 2	2015-06-30
Nucleation and growth of tin particles into three dimensional composite active anode for lithium high capacity energy storage device Grant 8,669,011 - Lopatin , et al. March 11, 2	2014-03-11
Manufacturing Of High Capacity Prismatic Lithium-ion Alloy Anodes App 20140011088 - Lopatin; Sergey D. ; et al.	2014-01-09
Nucleation And Growth Of Tin Particles Into Three Dimensional Composite Active Anode For Lithium High Capacity Energy Storage Device App 20130260255 - LOPATIN; Sergey D. ; et al.	2013-10-03
Nucleation and growth of tin particles into three dimensional composite active anode for lithium high capacity energy storage device Grant 8,546,020 - Lopatin , et al. October 1, 2	2013-10-01
Particle Synthesis Apparatus And Methods App 20130214200 - Yang; Lu ; et al.	2013-08-22
Thin film electrochemical energy storage device with three-dimensional anodic structure Grant 8,486,562 - Lopatin , et al. July 16, 2	2013-07-16
Porous Three Dimensional Copper, Tin, Copper-tin, Copper-tin-cobalt, And Copper-tin-cobalt-titanium Electrodes For Batteries And Ultra Capacitors App 20120237823 - LOPATIN; SERGEY D. ; et al.	2012-09-20
Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors Grant 8,206,569 - Lopatin , et al. June 26, 2	2012-06-26
Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures Grant 8,192,605 - Lopatin , et al. June 5, 2	2012-06-05
Spray Deposition Module For An In-line Processing System App 20120064225 - Bachrach; Robert Z. ; et al.	2012-03-15
Integrated Composite Separator For Lithium-ion Batteries App 20110217585 - Wang; Connie P. ; et al.	2011-09-08
ELECTRODE FOR HIGH PEFORMANCE Li-ION BATTERIES App 20110200881 - Wang; Connie P. ; et al.	2011-08-18
Graded Electrode Technologies For High Energy Lithium-ion Batteries App 20110168550 - Wang; Connie P. ; et al.	2011-07-14
Compressed Powder 3d Battery Electrode Manufacturing App 20110129732 - Bachrach; Robert Z. ; et al.	2011-06-02
Nucleation And Growth Of Tin Particles Into Three Dimensional Composite Active Anode For Lithium High Capacity Energy Storage Device App 20110097628 - Lopatin; Sergey D. ; et al.	2011-04-28
Passivation Film For Solid Electrolyte Interface Of Three Dimensional Copper Containing Electrode In Energy Storage Device App 20100330425 - Lopatin; Sergey D. ; et al.	2010-12-30
Metallized Fibers For Electrochemical Energy Storage App 20100261071 - Lopatin; Sergey D. ; et al.	2010-10-14
Composite Materials Containing Metallized Carbon Nanotubes And Nanofibers App 20100261058 - LOPATIN; SERGEY D. ; et al.	2010-10-14
Thin film electrochemical energy storage device with three-dimensional anodic structure App 20100216026 - Lopatin; Sergey D. ; et al.	2010-08-26
Mesoporous Carbon Material For Energy Storage App 20100203391 - Lopatin; Sergey D. ; et al.	2010-08-12
Metrology Methods And Apparatus For Nanomaterial Characterization Of Energy Storage Electrode Structures App 20100200403 - Lopatin; Sergey D. ; et al.	2010-08-12
Porous Three Dimensional Copper, Tin, Copper-tin, Copper-tin-cobalt, And Copper-tin-cobalt-titanium Electrodes For Batteries And Ultra Capacitors App 20100193365 - Lopatin; Sergey D. ; et al.	2010-08-05
Three-dimensional Battery With Hybrid Nano-carbon Layer App 20100151318 - LOPATIN; SERGEY D. ; et al.	2010-06-17
Apparatus And Method For Forming 3d Nanostructure Electrode For Electrochemical Battery And Capacitor App 20100126849 - LOPATIN; SERGEY D. ; et al.	2010-05-27
Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect Grant 7,696,092 - Lopatin , et al. April 13, 2	2010-04-13
Method of making an organic memory cell Grant 7,374,654 - Chang , et al. May 20, 2	2008-05-20
Etch-back process for capping a polymer memory device Grant 7,323,418 - Ngo , et al. January 29, 2	2008-01-29
Nano-electrode-array For Integrated Circuit Interconnects App 20070284746 - Lopatin; Sergey D. ; et al.	2007-12-13
Nano-electrode-array for integrated circuit interconnects Grant 7,226,856 - Lopatin , et al. June 5, 2	2007-06-05
Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition Grant 7,169,706 - Lopatin , et al. January 30, 2	2007-01-30
Method and apparatus for transistor sidewall salicidation Grant 7,151,018 - Nunan , et al. December 19, 2	2006-12-19
SO.sub.2 treatment of oxidized CuO for copper sulfide formation of memory element growth Grant 7,115,440 - Lyons , et al. October 3, 2	2006-10-03
Silver under-layers for electroless cobalt alloys Grant 7,064,065 - Lopatin , et al. June 20, 2	2006-06-20
Sidewall formation for high density polymer memory element array Grant 7,015,504 - Lyons , et al. March 21, 2	2006-03-21
Implanted barrier layer to improve line reliability and method of forming same Grant 6,992,004 - Besser , et al. January 31, 2	2006-01-31
Post CMP precursor treatment Grant 6,982,188 - Xie , et al. January 3, 2	2006-01-03
Manufacturing a conformal atomic liner layer in an integrated circuit interconnect Grant 6,972,254 - Lopatin , et al. December 6, 2	2005-12-06
Silver under-layers for electroless cobalt alloys App 20050124158 - Lopatin, Sergey D. ; et al.	2005-06-09
Multi-cell organic memory element and methods of operating and fabricating Grant 6,900,488 - Lopatin , et al. May 31, 2	2005-05-31
Manufacturing seedless barrier layers in integrated circuits Grant 6,893,955 - Lopatin , et al. May 17, 2	2005-05-17
CuS formation by anodic sulfide passivation of copper surface Grant 6,893,895 - Okoroanyanwu , et al. May 17, 2	2005-05-17
Sidewall formation for high density polymer memory element array App 20050092983 - Lyons, Christopher F. ; et al.	2005-05-05
Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers App 20050085031 - Lopatin, Sergey D. ; et al.	2005-04-21
Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition App 20050085073 - Lopatin, Sergey D. ; et al.	2005-04-21
Method of forming an adhesion layer with an element reactive with a barrier layer Grant 6,861,349 - Lopatin , et al. March 1, 2	2005-03-01
System and method of forming a passive layer by a CMP process Grant 6,836,398 - Subramanian , et al. December 28, 2	2004-12-28
Method of implanting copper barrier material to improve electrical performance Grant 6,835,655 - Besser , et al. December 28, 2	2004-12-28
Method of forming an electroless nucleation layer on a via bottom Grant 6,815,340 - Lopatin , et al. November 9, 2	2004-11-09
Silicon containing material for patterning polymeric memory element Grant 6,803,267 - Subramanian , et al. October 12, 2	2004-10-12
Polymer memory device formed in via opening Grant 6,787,458 - Tripsas , et al. September 7, 2	2004-09-07
Methods of forming passive layers in organic memory cells Grant 6,773,954 - Subramanian , et al. August 10, 2	2004-08-10
Implantation for the formation of CuX layer in an organic memory device Grant 6,770,905 - Buynoski , et al. August 3, 2	2004-08-03
Method of forming copper sulfide for memory cell Grant 6,746,971 - Ngo , et al. June 8, 2	2004-06-08
Laminated conductive lines and methods of forming the same Grant 6,724,087 - Buynoski , et al. April 20, 2	2004-04-20
Method of inserting alloy elements to reduce copper diffusion and bulk diffusion Grant 6,703,308 - Besser , et al. March 9, 2	2004-03-09
Method of implantation after copper seed deposition Grant 6,703,307 - Lopatin , et al. March 9, 2	2004-03-09
Method Of Implantation After Copper Seed Deposition App 20040023486 - Lopatin, Sergey D. ; et al.	2004-02-05
Selective formation of top memory electrode by electroless formation of conductive materials Grant 6,686,263 - Lopatin , et al. February 3, 2	2004-02-03
Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect App 20040005773 - Lopatin, Sergey D. ; et al.	2004-01-08
Method of manufacturing an amorphized barrier layer for integrated circuit interconnects Grant 6,583,051 - Lopatin , et al. June 24, 2	2003-06-24
Method of enhanced fill of vias and trenches Grant 6,534,865 - Lopatin , et al. March 18, 2	2003-03-18
Conformal atomic liner layer in an integrated circuit interconnect Grant 6,528,884 - Lopatin , et al. March 4, 2	2003-03-04
Variable grain size in conductors for semiconductor vias and trenches Grant 6,489,683 - Lopatin , et al. December 3, 2	2002-12-03
Semiconductor catalytic layer and atomic layer deposition thereof Grant 6,479,902 - Lopatin , et al. November 12, 2	2002-11-12
Method of encapsulated copper (Cu) interconnect formation Grant 6,455,415 - Lopatin , et al. September 24, 2	2002-09-24
Post-CMP-Cu deposition and CMP to eliminate surface voids Grant 6,403,466 - Lopatin June 11, 2	2002-06-11
Method of manufacturing an amorphized barrier layer for integrated circuit interconnects App 20020061644 - Lopatin, Sergey D. ; et al.	2002-05-23
Graded compound seed layers for semiconductors Grant 6,368,961 - Lopatin , et al. April 9, 2	2002-04-09
Method of copper interconnect formation using atomic layer copper deposition Grant 6,368,954 - Lopatin , et al. April 9, 2	2002-04-09
Method for low stress plating of semiconductor vias and channels Grant 6,368,965 - Lopatin April 9, 2	2002-04-09
Manufacturing method for semiconductor metalization barrier Grant 6,344,410 - Lopatin , et al. February 5, 2	2002-02-05
Semiconductor metalization barrier and manufacturing method therefor Grant 6,320,263 - Lopatin , et al. November 20, 2	2001-11-20
Low resistivity semiconductor barrier layer manufacturing method Grant 6,297,146 - Lopatin October 2, 2	2001-10-02
Apparatus and method of encapsulated copper (Cu) Interconnect formation Grant 6,259,160 - Lopatin , et al. July 10, 2	2001-07-10
Graded compound seed layers for semiconductors Grant 6,174,799 - Lopatin , et al. January 16, 2	2001-01-16
Semiconductor metalization barrier Grant 6,144,099 - Lopatin , et al. November 7, 2	2000-11-07
Low resistivity semiconductor barrier layers and manufacturing method therefor Grant 6,144,096 - Lopatin November 7, 2	2000-11-07

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