Loo, Mike C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Loo, Mike C..The latest application filed is for "optimum power and ground bump pad and bump patterns for flip chip packaging".
- Loo, Mike C. - San Jose CA
| Patent | Date |
|---|---|
| Optimum power and ground bump pad and bump patterns for flip chip packaging App 20030102159 - Loo, Mike C. | 2003-06-05 |
| Printed circuit boards and printed circuit board based substrates structures with multiple core layers App 20030031830 - Sun, Ming ; et al. | 2003-02-13 |
| Package structure for low cost and ultra thin chip scale package Grant 6,191,483 - Loo February 20, 2 | 2001-02-20 |
| Semiconductor die metal layout for flip chip packaging Grant 6,118,180 - Loo , et al. September 12, 2 | 2000-09-12 |
| Upgradable multi-chip module Grant 5,648,893 - Loo , et al. July 15, 1 | 1997-07-15 |
| High contact density ball grid array package for flip-chips Grant 5,637,920 - Loo June 10, 1 | 1997-06-10 |
| Tab semiconductor package with cushioned land grid array outer lead bumps Grant 5,394,009 - Loo February 28, 1 | 1995-02-28 |
| Multi-chip cooling module and method Grant 5,380,956 - Loo , et al. January 10, 1 | 1995-01-10 |
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