Longworth; Hai Pham
Patent Applications and Registrations
Patent applications and USPTO patent grants for Longworth; Hai Pham.The latest application filed is for "structure and method to improve current-carrying capabilities of c4 joints".
- Longworth; Hai Pham - Poughkeepsie NY US
| Patent | Date |
|---|---|
| Structure and method to improve current-carrying capabilities of C4 joints Grant 8,367,543 - Farooq , et al. February 5, 2 | 2013-02-05 |
| Micro-bumps to enhance LGA interconnections Grant 7,302,757 - Brody , et al. December 4, 2 | 2007-12-04 |
| Structure And Method To Improve Current-carrying Capabilities Of C4 Joints App 20070222073 - Farooq; Mukta Ghate ; et al. | 2007-09-27 |
| Micro-bumps to enhance LGA interconnections App 20060030170 - Brody; Jeffrey A. ; et al. | 2006-02-09 |
| Micro-bumps To Enhance Lga Interconnections App 20050221635 - Brody, Jeffrey A. ; et al. | 2005-10-06 |
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