LONG; Theng Chao

Patent Applications and Registrations

Patent applications and USPTO patent grants for LONG; Theng Chao.The latest application filed is for "method for connecting an electrical device to a bottom unit by using a solderless joint".

Company Profile

3.11.15

LONG; Theng Chao - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Connecting An Electrical Device To A Bottom Unit By Using A Solderless Joint App 20220278085 - CHIANG; Chau Fatt ; et al.	2022-09-01
Stacked Transistor Chip Package With Source Coupling App 20220122906 - YUFEREV; Sergey ; et al.	2022-04-21
Pressure sensor having a lidless/laminate structure Grant 11,274,984 - Chiang , et al. March 15, 2	2022-03-15
Pressure Sensor App 20210025774 - Chiang; Chau Fatt ; et al.	2021-01-28
Multi-phase half bridge driver package and methods of manufacture Grant 10,396,018 - Chiang , et al. A	2019-08-27
Multi-Phase Half Bridge Driver Package and Methods of Manufacture App 20190164873 - Chiang; Chau Fatt ; et al.	2019-05-30
Connectable Package Extender for Semiconductor Device Package App 20180102300 - Tan; Tian San ; et al.	2018-04-12
Connectable package extender for semiconductor device package Grant 9,892,991 - Tan , et al. February 13, 2	2018-02-13
Semiconductor device having multiple contact clips Grant 9,837,380 - Tan , et al. December 5, 2	2017-12-05
Small footprint semiconductor package Grant 9,666,557 - Tan , et al. May 30, 2	2017-05-30
Electronic module Grant 9,655,265 - Pon , et al. May 16, 2	2017-05-16
Turret handlers and methods of operations thereof Grant 9,594,111 - Long , et al. March 14, 2	2017-03-14
Semiconductor die package with multiple mounting configurations Grant 9,508,625 - Tan , et al. November 29, 2	2016-11-29
Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements Grant 9,490,199 - Long , et al. November 8, 2	2016-11-08
Semiconductor device and method of manufacturing a semiconductor device Grant 9,484,280 - Pon , et al. November 1, 2	2016-11-01
Connectable Package Extender for Semiconductor Device Package App 20150348864 - Tan; Tian San ; et al.	2015-12-03
Electronic module and method of manufacturing the same App 20150342073 - PON; Tiam Meng ; et al.	2015-11-26
Molded semiconductor package with pluggable lead Grant 9,153,518 - Tan , et al. October 6, 2	2015-10-06
Semiconductor Die Package With Multiple Mounting Configurations App 20150279757 - Tan; Tian San ; et al.	2015-10-01
Interposer with Programmable Matrix for Realizing Configurable Vertical Semiconductor Package Arrangements App 20150249047 - Long; Theng Chao ; et al.	2015-09-03
Semiconductor Device Including Flexible Leads App 20150214179 - Tan; Tian San ; et al.	2015-07-30
Semiconductor Device Having Multiple Contact Clips App 20150214189 - Tan; Tian San ; et al.	2015-07-30
Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20150200148 - PON; Tiam Meng ; et al.	2015-07-16
Molded Semiconductor Package with Pluggable Lead App 20150061140 - Tan; Tian San ; et al.	2015-03-05
Small Footprint Semiconductor Package App 20140353766 - Tan; Tian San ; et al.	2014-12-04
Turret Handlers and Methods of Operations Thereof App 20140239998 - Long; Theng Chao ; et al.	2014-08-28

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