Long; Lewis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Long; Lewis.The latest application filed is for "packaged microchip with premolded-type package".
- Long; Lewis - Woburn MA
| Patent | Date |
|---|---|
| Packaged microchip with premolded-type package Grant 7,166,911 - Karpman , et al. January 23, 2 | 2007-01-23 |
| Multi-surface mounting member and electronic device Grant 7,040,922 - Harney , et al. May 9, 2 | 2006-05-09 |
| Packaged microchip with premolded-type package App 20050035446 - Karpman, Maurice S. ; et al. | 2005-02-17 |
| Optical mirror module Grant 6,831,772 - Spooner , et al. December 14, 2 | 2004-12-14 |
| Multi-surface mounting member and electronic device App 20040244510 - Harney, Kieran P. ; et al. | 2004-12-09 |
| Packaged microchip with isolation Grant 6,768,196 - Harney , et al. July 27, 2 | 2004-07-27 |
| Packaged microchip with isolation App 20040041248 - Harney, Kieran ; et al. | 2004-03-04 |
| Packaged microchip App 20040041254 - Long, Lewis ; et al. | 2004-03-04 |
| Optical mirror module App 20030147118 - Spooner, Timothy ; et al. | 2003-08-07 |
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