Long; Brian J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Long; Brian J..The latest application filed is for "thermal conductivity for integrated circuit packaging".
- Long; Brian J. - Folsom CA
| Patent | Date |
|---|---|
| Thermal conductivity for integrated circuit packaging Grant 11,147,153 - Long October 12, 2 | 2021-10-12 |
| Solid state memory case with enhanced cooling Grant 10,937,464 - Long March 2, 2 | 2021-03-02 |
| Thermal Conductivity For Integrated Circuit Packaging App 20200323076 - Long; Brian J. | 2020-10-08 |
| Thermal conductivity for integrated circuit packaging Grant 10,729,000 - Long | 2020-07-28 |
| Frame embedded components Grant 10,681,817 - Long | 2020-06-09 |
| Solid State Memory Case With Enhanced Cooling App 20200174533 - LONG; Brian J. | 2020-06-04 |
| Packaged integrated circuit device with cantilever structure Grant 10,490,516 - Meyers , et al. Nov | 2019-11-26 |
| Electronics Connectors Having Power-regulating Passive Components App 20190215960 - LONG; Brian J. | 2019-07-11 |
| Frame Embedded Components App 20190215964 - Long; Brian J. | 2019-07-11 |
| Thermal Conductivity For Integrated Circuit Packaging App 20190200446 - Long; Brian J. | 2019-06-27 |
| Packaged Integrated Circuit Device With Cantilever Structure App 20180138133 - Meyers; John G. ; et al. | 2018-05-17 |
| Packaged integrated circuit device with cantilever structure Grant 9,871,007 - Meyers , et al. January 16, 2 | 2018-01-16 |
| Electronic device Grant 9,867,276 - Gwin , et al. January 9, 2 | 2018-01-09 |
| Packaged Integrated Circuit Device With Cantilever Structure App 20170092602 - Meyers; John G. ; et al. | 2017-03-30 |
| Electronic Device App 20170094772 - Gwin; Paul J. ; et al. | 2017-03-30 |
| Liquid cooling system Grant 8,353,176 - Gwin , et al. January 15, 2 | 2013-01-15 |
| Liquid cooling system Grant 7,760,500 - Gwin , et al. July 20, 2 | 2010-07-20 |
| Liquid cooling system Grant 7,748,229 - Gwin , et al. July 6, 2 | 2010-07-06 |
| Liquid cooling system App 20100155024 - Gwin; Paul J. ; et al. | 2010-06-24 |
| Electronic component cooling apparatus Grant 7,527,085 - Iijima , et al. May 5, 2 | 2009-05-05 |
| Liquid Cooling System App 20080283218 - Gwin; Paul J. ; et al. | 2008-11-20 |
| Liquid Cooling System App 20080148757 - Gwin; Paul J. ; et al. | 2008-06-26 |
| Electrically isolated semi-locking hinge for cooling system Grant 7,046,517 - Long , et al. May 16, 2 | 2006-05-16 |
| Electronic component cooling apparatus App 20050168939 - Iijima, Masayuki ; et al. | 2005-08-04 |
| Liquid cooling system App 20050138944 - Gwin, Paul J. ; et al. | 2005-06-30 |
| Electrically isolated semi-locking hinge for cooling system App 20050141191 - Long, Brian J. ; et al. | 2005-06-30 |
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