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Connecting a component to a substrate by adhesion to an oxidized solder surface
Grant 11,228,124 - Hoffmeyer , et al. January 18, 2 | 2022-01-18 |
Mitigating cracking within integrated circuit (IC) device carrier
Grant 10,985,129 - Lombardi , et al. April 20, 2 | 2021-04-20 |
Managing thermal warpage of a laminate
Grant 10,832,987 - Arvin , et al. November 10, 2 | 2020-11-10 |
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
App 20200328177 - Lombardi; Thomas E. ; et al. | 2020-10-15 |
Method and apparatus for strain relieving surface mount attached connectors
Grant 10,750,615 - Gaynes , et al. A | 2020-08-18 |
Managing Thermal Warpage Of A Laminate
App 20190295921 - Arvin; Charles L. ; et al. | 2019-09-26 |
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors
App 20190281702 - Gaynes; Michael A. ; et al. | 2019-09-12 |
Method and apparatus for strain relieving surface mount attached connectors
Grant 10,368,441 - Gaynes , et al. July 30, 2 | 2019-07-30 |
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors
App 20180213645 - Gaynes; Michael A. ; et al. | 2018-07-26 |
Fixture to constrain laminate and method of assembly
Grant 10,014,273 - Lombardi , et al. July 3, 2 | 2018-07-03 |
Method and apparatus for strain relieving surface mount attached connectors
Grant 9,974,179 - Gaynes , et al. May 15, 2 | 2018-05-15 |
PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN
App 20180104758 - Arvin; Charles L. ; et al. | 2018-04-19 |
Barrier structures for underfill blockout regions
Grant 9,798,088 - Gambino , et al. October 24, 2 | 2017-10-24 |
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors
App 20170196089 - Gaynes; Michael A. ; et al. | 2017-07-06 |
Selectively Soluble Standoffs For Chip Joining
App 20170170148 - Fasano; Benjamin V. ; et al. | 2017-06-15 |
Selectively soluble standoffs for chip joining
Grant 9,673,177 - Fasano , et al. June 6, 2 | 2017-06-06 |
Barrier Structures For Underfill Blockout Regions
App 20170131476 - Gambino; Jeffrey P. ; et al. | 2017-05-11 |
Method and apparatus for strain relieving surface mount attached connectors
Grant 9,627,784 - Gaynes , et al. April 18, 2 | 2017-04-18 |
Method for shaping a laminate substrate
Grant 9,543,253 - Blackshear , et al. January 10, 2 | 2017-01-10 |
Fixture To Constrain Laminate And Method Of Assembly
App 20160329297 - LOMBARDI; Thomas E. ; et al. | 2016-11-10 |
Fixture to constrain laminate and method of assembly
Grant 9,455,234 - Lombardi , et al. September 27, 2 | 2016-09-27 |
Fixture for shaping a laminate substrate
Grant 9,059,240 - Blackshear , et al. June 16, 2 | 2015-06-16 |
Method for shaping a laminate substrate
Grant 9,048,245 - Blackshear , et al. June 2, 2 | 2015-06-02 |
Method For Shaping A Laminate Substrate
App 20150136838 - Blackshear; Edmund ; et al. | 2015-05-21 |
Fixture To Constrain Laminate And Method Of Assembly
App 20140197228 - LOMBARDI; Thomas E. ; et al. | 2014-07-17 |
Fixture to constrain laminate and method of assembly
Grant 8,759,151 - Lombardi , et al. June 24, 2 | 2014-06-24 |
Fixture For Shaping A Laminate Substrate
App 20130323345 - Blackshear; Edmund D. ; et al. | 2013-12-05 |
Method For Shaping A Laminate Substrate
App 20130320069 - Blackshear; Edmund ; et al. | 2013-12-05 |
Underfill method and chip package
Grant 8,492,910 - Gaynes , et al. July 23, 2 | 2013-07-23 |
Structure and method to improve current-carrying capabilities of C4 joints
Grant 8,367,543 - Farooq , et al. February 5, 2 | 2013-02-05 |
Overcoming laminate warpage and misalignment in flip-chip packages
Grant 8,304,290 - Graf , et al. November 6, 2 | 2012-11-06 |
Fixture To Constrain Laminate And Method Of Assembly
App 20120187180 - LOMBARDI; Thomas E. ; et al. | 2012-07-26 |
Fixture to constrain laminate and method of assembly
Grant 8,188,597 - Lombardi , et al. May 29, 2 | 2012-05-29 |
Underfill Method And Chip Package
App 20120119353 - Gaynes; Michael A. ; et al. | 2012-05-17 |
Fixture To Constrain Laminate And Method Of Assembly
App 20120070940 - Lombardi; Thomas E. ; et al. | 2012-03-22 |
Underfill method and chip package
Grant 8,129,230 - Gaynes , et al. March 6, 2 | 2012-03-06 |
Overcoming Laminate Warpage And Misalignment In Flip-chip Packages
App 20110151627 - Graf; Richard S. ; et al. | 2011-06-23 |
Underfill Method And Chip Package
App 20110037181 - Gaynes; Michael A. ; et al. | 2011-02-17 |
Structure And Method To Improve Current-carrying Capabilities Of C4 Joints
App 20070222073 - Farooq; Mukta Ghate ; et al. | 2007-09-27 |
Method of preventing solder wetting in an optical device using diffusion of Cr
Grant 6,762,119 - Ray , et al. July 13, 2 | 2004-07-13 |
Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
Grant 6,528,352 - Jackson , et al. March 4, 2 | 2003-03-04 |
Temporary attach article and method for temporary attach of devices to a substrate
Grant 6,518,674 - Interrante , et al. February 11, 2 | 2003-02-11 |
Interconnect structure and process for silicon optical bench
App 20020196996 - Ray, Sudipta K. ; et al. | 2002-12-26 |
Temporary attach article and method for temporary attach of devices to a substrate
App 20010008778 - Interrante, Mario J. ; et al. | 2001-07-19 |
Edge seal technology for low dielectric/porous substrate processing
Grant 5,489,465 - Natarajan , et al. February 6, 1 | 1996-02-06 |
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
Grant 5,480,503 - Casey , et al. January 2, 1 | 1996-01-02 |
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