LOKE; Mun Leong

Patent Applications and Registrations

Patent applications and USPTO patent grants for LOKE; Mun Leong.The latest application filed is for "chip carrier having variably-sized pads".

Company Profile

0.9.9

LOKE; Mun Leong - Bukit Mertajam MY
Loke; Mun Leong - Biekit Mertajam MY
Loke; Mun Leong - Penang MY
Loke; Mun Leong - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Carrier Having Variably-sized Pads App 20170170108 - WONG; Chee Ling ; et al.	2017-06-15
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 9,397,016 - Mong , et al. July 19, 2	2016-07-19
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20150076692 - Mong; Weng Khoon ; et al.	2015-03-19
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 8,847,368 - Mong , et al. September 30, 2	2014-09-30
Process for assembling an integrated circuit package having a substrate vent hole Grant RE44,629 - Ramalingam , et al. December 10, 2	2013-12-10
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20120319276 - Mong; Weng Khoon ; et al.	2012-12-20
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 8,258,019 - Mong , et al. September 4, 2	2012-09-04
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20090321928 - Mong; Weng Khoon ; et al.	2009-12-31
Molded flip chip package with enhanced mold-die adhesion App 20090309238 - Loke; Mun Leong	2009-12-17
Package Warpage Control App 20070205501 - Lee; Michael Keat Lye ; et al.	2007-09-06
Package Warpage Control App 20070155059 - Lee; Michael Keat Lye ; et al.	2007-07-05
Package warpage control Grant 7,208,342 - Lee , et al. April 24, 2	2007-04-24
Package warpage control App 20050266607 - Lee, Michael Keat Lye ; et al.	2005-12-01
Method of thinning a wafer utilizing a laminated reinforcing layer over the device side Grant 6,713,366 - Mong , et al. March 30, 2	2004-03-30
Method Of Thinning A Wafer Utilizing A Laminated Reinforcing Layer Over The Device Side App 20030235937 - Mong, Weng Khoon ; et al.	2003-12-25
Integrated circuit package having a substrate vent hole Grant 6,490,166 - Ramalingam , et al. December 3, 2	2002-12-03

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